| PART |
Description |
Maker |
| CONFIG2 CONFIG0 CONFIG1 DSUMFT311EV |
The FT311D Development Module is a development module which utilises the FT311D IC to develop USB accessories connecting to Android platforms via Android Open Accessory mode.
|
Future Technology Devices International Ltd.
|
| 2903103 |
SmartWire DT?digital module for connecting digital output signals, 8 outputs (24 V DC/0.5 A).
|
PHOENIX CONTACT
|
| BSM50GD60DN2E3226 C67070-A2515-A67 050D06E2 |
Circular Connector; Body Material:Aluminum; Series:PT07; No. of Contacts:41; Connector Shell Size:22; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:22-41
IGBT Power Module (Power module 3-phase full-bridge Including fast free-wheel diodes)
From old datasheet system
|
SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
|
| NC316-144 NC316-288 NC316-72 |
Media Cross Connect垄芒 (MCC) Product Family
Media Cross Connect (MCC) Product Family
|
MRV Communications, Inc.
|
| OL6204N-50 OL6204N-50AP OL6204N-50BP OL6204N-BP OL |
From old datasheet system
1.6 um High-Power DIP Module with 9mm Profile
1.6 レm High-Power DIP Module with 9mm Profile
1.6 m High-Power DIP Module with 9mm Profile
1.6 μm High-Power DIP Module with 9mm Profile
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Crimp; Body Material:Aluminum; Series:PT02; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Crimp; Circular Shell Style:Box Mount Receptacle
|
OKI electronic eomponets
OKI electronic components
OKI[OKI electronic componets]
OKI SEMICONDUCTOR CO., LTD.
|
| MPXHZ6115A MPXHZ6115AC6U MPXAZ6115A MPXAZ6115A6T1 |
Media Resistant and High Temperature Accuracy Integrated Pressure Sensor
Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor
CAP 68UF 6V 20% TANT SMD-6032-28 TR-7
|
Freescale (Motorola)
MOTOROLA[Motorola, Inc]
MOTOROLA[Motorola Inc]
Motorola, Inc.
|
| OL3204N-40 OL3201N-40 |
FIBER OPTIC LASER DIODE MODULE EMITTER, 1280-1330nm, THROUGH HOLE MOUNT, FC CONNECTOR
1.3 レm High-Power Laser-Diode DIP Module 1.3レ米高功率激光二极管双酯模块
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT02; Number of Contacts:4; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle 1.3レ米高功率激光二极管双酯模块
1.3 μm High-Power Laser-Diode DIP Module
1.3 m High-Power Laser-Diode DIP Module
|
LAPIS SEMICONDUCTOR CO LTD
OKI SEMICONDUCTOR CO., LTD.
OKI[OKI electronic componets]
OKI electronic components
|
| 050-112 |
Media Converter
|
Glenair, Inc.
|
| OTP-1DVI2A1D1KM |
Media Transport
|
Emcore Corporation
|
| EPE6303S |
Media Isolation Transformers
|
PCA ELECTRONICS INC.
|
| 09650-M |
FAN FILTER MEDIA
|
Qualtek Electronics Corporation
|
| IP113ALF IP113ALF-DS-R01 IP113ALF-DS-R02 IP113ALF- |
10 /100Base-Tx/Fx Media Converter
|
List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
|
