PART |
Description |
Maker |
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
SOP-7 |
Package Outline
|
Global Mixed-mode Techn...
|
LQFP44 |
Package outline
|
Philips
|
TQFN2X2-12 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X3-16 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT223 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-14-EP |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|