| PART |
Description |
Maker |
| 35182-0194 |
1.78mm (.070) Tab, Wire-to-Wire Male Housing TPA? 1 Circuit, Vertical
|
Molex Electronics Ltd.
|
| 351810220 |
1.78mm (.070) Tab Multiple Wire-to-Wire Female Housing, 2 Circuits, Vertical, C-Type
|
Molex Electronics Ltd.
|
| 35979-0344 0359790344 |
7.92mm (.312) Pitch Wire-to-Board Header, Vertical, 4 Circuits, Blue, Polyester Alloy, Glow Wire Compatible
|
Molex Electronics Ltd.
|
| 49548-0390 0495480390 |
1.78mm (.070) Tab, 8.50mm (.335) Pitch Wire-to-Wire Female Housing TPA, 3 Circuits, Vertical, Lower Type
|
Molex Electronics Ltd.
|
| M570 |
Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMIC’s
|
M/A-COM Technology Solutions, Inc.
|
| M541 |
Bonding, Handling, and Mounting Procedures for Chip Diode Devices
|
M/A-COM Technology Solutions, Inc.
|
| HT10401LHO |
LCD MODULE(1024 × RGB × 768)with AR Coated Glass Optical Bonding
LCD MODULE(1024 隆驴 RGB 隆驴 768)with AR Coated Glass Optical Bonding
|
HYES Optoelectronics, Inc.
|
| 35182-0290 0351820290 |
1.78mm (.070) Tab, 8.70mm (.343) Pitch Wire-to-Wire Male Housing TPA? 2Circuits, Vertical
1.78mm (.070") Tab, 8.70mm (.343") Pitch Wire-to-Wire Male Housing TPA?? 2Circuits, Vertical
|
http://
Molex Electronics Ltd.
|
| 0513470300 |
2.00mm (.079) Pitch MicroBlade Wire-to-Board Header, Vertical, 9 Circuits
2.00mm (.079") Pitch MicroBlade垄芒 Wire-to-Board Header, Vertical, 9 Circuits
|
Molex Electronics Ltd.
|
| CYP15G0401DXB-BGXI |
Quad HOTLink II (TM) Transceiver; Features: Channel Bonding, 8B/10B, Redundancy, BIST, JTAG; Frequency Range: 0.2 to 1.5 Gbps; Standard: Ethernet, Fibre Channel, ESCON, DVB-ASI;
|
CYPRESS SEMICONDUCTOR CORP
|
|
