| PART |
Description |
Maker |
| 1206J6300180KCT 1206J6300180KCR 1206J6300101KCR 12 |
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000018 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000015 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000022 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00015 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00018 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000018 uF, SURFACE MOUNT, 1206 CHIP
|
Syfer Technology, Ltd.
|
| ECJ2FB0J225M ECJ2FB0J226M ECJ2FB0J475K ECJ2FB0J106 |
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 2.2 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 22 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 4.7 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 10 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
Multilayer Ceramic Capacitors(High Capacitance) Small size and high capacitance
Multilayer Ceramic Capacitors High Capacitance
Multilayer Ceramic Capacitors (High Capacitance)
Multilayer Ceramic Capacitors High Capacitance
|
Panasonic, Corp.
Panasonic Battery Group
Panasonic Semiconductor
|
| LDB211G9020C-001 LDB21906M20C-001 LDB21906M05C-001 |
Chip Multilayer Hybrid Baluns 1800 MHz - 2000 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 887 MHz - 925 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 800 MHz - 1000 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 1500 MHz - 1700 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 1600 MHz - 1800 MHz RF TRANSFORMER
|
Murata Manufacturing Co., Ltd.
|
| HKQ0603W16NH-T |
High-Q Multilayer Chip Inductors for High Frequency Applications (HK series Q type)
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W0N7B-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W0N6S-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603C1N1S-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ04024N7J-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603C1N4S-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ040247NH-T |
High-Q Multilayer Chip Inductors for High Frequency
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W2N9C-T |
High-Q Multilayer Chip Inductors for High Frequency
|
Taiyo Yuden (U.S.A.), I...
|
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