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| NL17SZ16 Single Input Buffer The NL17SZ16 is a single input Buffer in two tiny footprint packages. The device performs much as LCX multi-gate products in speed and drive. Features * * * * * * Tiny SOT-353 and SOT-553 Packages Source/Sink 24 mA at 3.0 Volts Over-V oltage Tolerant Inputs and Outputs Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation Pb-Free Packages are Available http://onsemi.com MARKING DIAGRAMS 5 1 SOT-353/SC70-5/SC-88A DF SUFFIX CASE 419A d = Date Code 5 5 LR D 1 1 5 LRd NC 1 5 VCC 1 SOT-553 XV5 SUFFIX CASE 463B A 2 LR = Device Marking D = One Digit Date Code 4 Y GND 3 PIN ASSIGNMENT Pin Function NC IN A GND OUT Y VCC Figure 1. Pinout (Top View) 1 2 3 A 1 Y 4 5 Figure 2. Logic Symbol FUNCTION TABLE A Input L H Y Output L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. (c) Semiconductor Components Industries, LLC, 2005 1 January, 2005 - Rev. 5 Publication Order Number: NL17SZ16/D NL17SZ16 MAXIMUM RATINGS Symbol VCC VI VO IIK IOK IOUT ICC IGND TSTG TL TJ qJA PD MSL FR ESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground per Supply Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance Power Dissipation in Still Air at 85C Moisture Sensitivity Flammability Rating ESD Classification Oxygen Index: 28 to 34 Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) Above VCC and Below GND at 85C (Note 6) SOT-353 SOT-553 SOT-353 SOT-553 Output in High or Low State (Note 2) VI < GND VO < GND Parameter Value *0.5 to )7.0 *0.5 v VI v )7.0 *0.5 v VO v )7.0 *50 *50 $50 $100 $100 *65 to )150 260 )150 350 360 150 180 Level 1 UL 94 V-0 @ 0.125 in Class IC Class A N/A $500 V Unit V V V mA mA mA mA mA C C C C/W mW ILatchup Latchup Performance mA Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. IO Absolute Maximum Rating Must be Obtained. 3. Tested to EIA/JESD22-A114-A, rated to EIA/JESD22-A114-B. 4. Tested to EIA/JESD22-A115-A, rated to EIA/JESD22-A115-A. 5. Tested to JESD22-C101-A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT TA tr, tf DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature Range Input Rise and Fall Time VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V Parameter Operations Only Data Retention Min 1.65 1.5 0 0 *40 0 0 0 Max 5.5 5.5 5.5 5.5 )85 20 10 5 Unit V V V C ns/V http://onsemi.com 2 NL17SZ16 NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130C TJ = 120C TJ = 100C TJ = 110C TJ = 90C TJ = 80C 100 TIME, YEARS 1 1 10 1000 Figure 3. Failure Rate vs. Time Junction Temperature DC ELECTRICAL CHARACTERISTICS VCC (V) 1.65 to 1.95 2.3 to 5.5 1.65 to 1.95 2.3 to 5.5 IOH = -100 mA IOH = -3 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA IOH = -24 mA IOH = -32 mA IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA VIN = VCC or GND VOUT = 5.5 V VIN = VCC or GND 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 0 to 5.5 0 5.5 VCC - 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.52 2.1 2.4 2.7 2.5 4.0 0.0 0.08 0.20 0.22 0.28 0.38 0.42 0.1 0.24 0.3 0.4 0.4 0.55 0.55 $0.1 1 1 TA = 255C Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC - 0.1 1.29 1.9 2.2 2.4 2.3 3.8 0.1 0.24 0.3 0.4 0.4 0.55 0.55 $1.0 10 10 Typ Max *405C v TA v 855C Min 0.75 VCC 0.7 VCC 1.25 VCC 0.3 VCC Max Unit V V V Symbol VIH VIL VOH Parameter High-Level Input Voltage Low-Level Input Voltage High-Level Output Voltage VIN = VIL or VIH Condition VOL Low-Level Output Voltage VIN = VIH or VOH V IIN IOFF ICC Input Leakage Current Power Off-Output Leakage Current Quiescent Supply Current mA mA mA AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns Symbol tPLH tPHL Parameter Propagation Delay (Figure 4 and 5) Condition RL = 1 MW, CL = 15 pF VCC (V) 1.65 1.8 2.5 $ 0.2 3.3 $ 0.3 5.0 $ 0.5 3.3 $ 0.3 5.0 $ 0.5 TA = 255C Min 2.0 2.0 0.8 0.5 0.5 1.5 0.8 Typ 5.3 4.4 2.9 2.1 1.8 2.9 2.4 Max 11.4 9.5 6.5 4.5 3.9 5.0 4.3 *405C v TA v 855C Min 2.0 2.0 0.8 0.5 0.5 1.5 0.8 Max 12 10 7.0 4.7 4.1 5.2 4.5 Unit ns RL = 500 W, CL = 50 pF F http://onsemi.com 3 NL17SZ16 CAPACITIVE CHARACTERISTICS Symbol CIN CPD Input Capacitance Power Dissi ation Ca acitance Dissipation Capacitance (Note 7) Parameter Condition VCC = 5.5 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC Typical u4 25 30 Unit pF pF F 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. tf = 3 ns 90% 90% 50% tf = 3 ns VCC INPUT 10% INPUT A and B 50% 10% OUTPUT RL CL GND tPHL tPLH VOL OUTPUT Y 50% 50% VOH A 1-MHz square input wave is recommended for propagation delay tests. Figure 4. Switching Waveform Figure 5. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number NL17SZ16DFT2 Logic Circuit Indicator NL No. of Gates per Package 1 Temp Range Identifier 7 Device Function 16 Package Suffix DF Tape and Reel Suffix T2 Package Type SOT-353/ SC70-5/ SC-88A SOT-353/ SC70-5/ SC-88A (Pb-Free) SOT-553* Tape and Reel Size 178 mm, 3000 Unit 178 mm, 3000 Unit Technology SZ NL17SZ16DFT2G NL 1 7 SZ 16 DF T2 NL17SZ16XV5T2 NL 1 7 SZ 16 XV5 T2 178 mm, 4000 Unit For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *All Devices in Package SOT553 are Inherently Pb-Free. http://onsemi.com 4 NL17SZ16 PACKAGE DIMENSIONS SOT-353 DF SUFFIX 5-LEAD PACKAGE CASE 419A-02 ISSUE G A G 5 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. S 1 2 3 -B- DIM A B C D G H J K N S D 5 PL 0.2 (0.008) M B M N J C INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 NL17SZ16 PACKAGE DIMENSIONS SOT-553 XV5 SUFFIX 5-LEAD PACKAGE CASE 463B-01 ISSUE A A -X- C K 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS MIN MAX 1.50 1.70 1.10 1.30 0.50 0.60 0.17 0.27 0.50 BSC 0.08 0.18 0.10 0.30 1.50 1.70 BASE 1 EMITTER 1/2 BASE 2 COLLECTOR 2 COLLECTOR 1 INCHES MIN MAX 0.059 0.067 0.043 0.051 0.020 0.024 0.007 0.011 0.020 BSC 0.003 0.007 0.004 0.012 0.059 0.067 STYLE 2: PIN 1. 2. 3. 4. 5. CATHODE ANODE CATHODE CATHODE CATHODE 5 1 2 3 B -Y- S D G 5 PL M J XY 0.08 (0.003) DIM A B C D G J K S STYLE 1: PIN 1. 2. 3. 4. 5. SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.0 0.0394 1.35 0.0531 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 6 NL17SZ16/D |
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