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INTEGRATED CIRCUITS
DATA SHEET
SAA3049A Infrared remote control decoder
Product specification Supersedes data of 1996 Apr 15 File under Integrated Circuits, IC02 1996 Sep 13
Philips Semiconductors
Product specification
Infrared remote control decoder
FEATURES * Decodes 64 remote control commands with a maximum of 32 subaddresses * Accepts RECS80 codes with pulse position modulation (SAA3004, SAA3007, SAA3008) or RC5 codes with bi-phase transmission (SAA3006, SAA3010) * Suitable for low voltage and low SAA3049A supply current applications * Adding circuitry for binary decoding allows a maximum of 2048 commands to be used, for example 1-of-16 decoder (HEF4515). ORDERING INFORMATION TYPE NUMBER SAA3049AP SAA3049AT PACKAGE NAME DIP20 SO20 DESCRIPTION plastic dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm GENERAL DESCRIPTION
SAA3049A
The main function of the SAA3049A is to check and convert the received coded data (RECS80/RC5) into latched binary outputs. The device address can be hard-wired for a particular address, allowing several devices in one location. Alternatively, received data with any address can be accepted; the received data and address are then outputs.
VERSION SOT146-1 SOT163-1
1996 Sep 13
2
Philips Semiconductors
Product specification
Infrared remote control decoder
SYSTEM DIAGRAM
SAA3049A
handbook, full pagewidth
command acknowledge +5 V VCC CA bits A
VBatt
REMOTE CONTROL TRANSMITTER SAA3004 SAA3007 SAA3008 or SAA3006 SAA3010
B REMOTE CONTROL DECODER C D E F CQW89A CQY89A IR BPW50 IR PREAMPLIFIER IN T0 SAA3049A A0 (S0) A1 (S1) A2 (S2) A3 (S3) A4 address toggle data
4 MHz
MGE374
Remote control transmitters (see individual data sheet for full specification): SAA3004: VBatt = 4 to 11 V (max.); 7 x 64 = 448 commands (RECS80 code). SAA3007: VBatt = 2 to 6.5 V (max.); 20 x 64 = 1280 commands (RECS80 code). SAA3008: VBatt = 2 to 6.5 V (max.); 20 x 64 = 1280 commands (RECS80 code). SAA3006: VBatt = 2 to 7 V (max.); 32 x 64 = 2048 commands (RC5 code). SAA3010: VBatt = 2 to 7 V (max.); 32 x 64 = 2048 commands (RC5 code).
Fig.1 System diagram.
1996 Sep 13
3
Philips Semiconductors
Product specification
Infrared remote control decoder
PINNING SYMBOL A B C D E F A0 (S0) A1 (S1) IN GND MODE XTAL1 XTAL2 RESET A4 A3 (S3) A2 (S2) T0 CRI VCC PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION data output data output data output data output data output data output data/address output/input data/address output/input digital input ground RC5/RECS80 mode selection crystal oscillator crystal oscillator reset input address output/input address output/input address output/input T0 bit command received indicator supply voltage
A0 (S0) 7 A1 (S1) 8 IN 9 GND 10
MGD347
SAA3049A
handbook, halfpage
A1 B2 C3 D4 E5
20 VCC 19 CRI 18 T0 17 A2 (S2) 16 A3 (S3)
SAA3049A
F6 15 A4 14 RESET 13 XTAL2 12 XTAL1 11 MODE
Fig.2 Pin configuration.
1996 Sep 13
4
Philips Semiconductors
Product specification
Infrared remote control decoder
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC VI II IO Ptot Po IDD ISS Tamb Tstg HANDLING supply voltage input voltage DC input current DC output current total power dissipation power dissipation per output positive supply current negative supply current operating ambient temperature storage temperature any pin any pin any pin PARAMETER CONDITIONS MIN. -0.5 -0.5 - - - - -50 -100 -40 -65
SAA3049A
MAX. +7 VCC + 0.5 -10 10 125 30 +50 +50 +85 +150 V V
UNIT
mA mA mW mW mA mA C C
Inputs and outputs are protected against electrostatic charge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see "Handling MOS Devices").
1996 Sep 13
5
Philips Semiconductors
Product specification
Infrared remote control decoder
CHARACTERISTICS VCC = 2.5 to 5.5 V; Tamb = -40 to +85 C; unless otherwise specified. SYMBOL Supply VCC ICC supply voltage supply current VDD = 3 V, fxtal = 4 MHz 2.5 - - 0.3 5.5 0.7 PARAMETER CONDITIONS MIN. TYP.
SAA3049A
MAX.
UNIT
V mA
Input signals (pin 9) VIH VIL VIH VIL VIH VIL fosc Outputs OPEN-DRAIN WITHOUT INTERNAL PULL-UP RESISTOR; note 3 IOL(sink) Notes 1. With pin 19 = HIGH, then pins 7, 8, 15, 16 and 17 are address inputs. With pin 19 = LOW, then pins 7, 8, 15, 16, and 17 are 4 or 5 address received outputs. a) In Figs 5, 6 and 7 this HIGH/LOW switching is dependent on whether the transistor on pin 19 is fed via a series resistor or not. In both applications pin 19, which toggles several times (see Fig.4) while a valid command is acknowledged, can be used to activate (flash) an LED indicator. 2. A quartz crystal with a frequency of 4 MHz is recommended for the standard transmitter application. 3. Application as output requires connection of an external pull-up resistor. LOW level output sink current VCC = 5 V; VOL = 0.4 V -1.6 -12 - mA HIGH level input voltage LOW level input voltage 0.7VCC 0 - - - - - - VCC 0.3VCC VCC 0.3VCC VCC 0.3VCC - V V
Mode selection (pin 11) HIGH level input voltage LOW level input voltage 0.7VCC 0 V V
Command received indicator and mode control (pin 19); note 1 HIGH level input voltage LOW level input voltage 0.7VCC 0 - V V
Crystal oscillator oscillator frequency note 2 4 MHz
1996 Sep 13
6
Philips Semiconductors
Product specification
Infrared remote control decoder
Reset
SAA3049A
The circuit is shown in Figs 5, 6 and 7. The alternative reset circuit shown in Fig.3 protects against short term power supply transients by generating a reset. The reset pin should either be connected to external reset circuitry as proposed or connected to VSS. If connected to VSS, a reset pulse will be generated by the on-chip Power-on reset circuit at typically 1.3 V (500 mV accuracy).
handbook, full pagewidth
VCC 390 zener diode 3.6 V BC548 1N4148 1 k 1.8 k 1N4148 1 F
20 SAA3049A 14
68 k
MGE375
Fig.3 Proposed improved reset circuit.
Infrared signal input (pin 9) This pin is sensitive to a negative-going edge. Command received indicator (pin 19)
APPLICATION INFORMATION In Fig.5, the circuit shown is for use with transmitters SAA3004, SAA3007 or SAA3008; pin 11 is HIGH for RECS80 code. In Fig.6, the circuit shown is for use with transmitter types SAA3006 or SAA3010; pin 11 is LOW for RC5 code.
handbook, halfpage
signal at pin 19
15 ms 120 ms
MGE376
In Fig.7, the decoder is set for the required subaddress by holding the address pins HIGH or LOW. Pin 11 is HIGH for use with transmitter types SAA3004, SAA3007 or SAA3008 (RECS80 code). Pin 11 is LOW for use with transmitter types SAA3006 or SAA3010 (RC5 code). The remote control decoder is for up to 32 subaddresses with 6 + 1-bit parallel outputs (RC5 code).
Fig.4 Output diagram of command acknowledge.
1996 Sep 13
7
1996 Sep 13
T0-bit VCC (+5 V) 68 k 1 F 1N4148 S2-bit 33 k 5.6 k S3-bit (1) address outputs
handbook, full pagewidth
Philips Semiconductors
command acknowledge
220
D1 CQW24
5.6 k
BC548
BC548 4 MHz subaddress range (2)
Infrared remote control decoder
8
20 19 18 17 16 15 14 13 12 11 SAA3049A 1 2 3 4 5 6 7 8 9 10 IN input S1-bit A data outputs B C D E F S0-bit address outputs
MGE377
(1) Only for subaddress 8 to 20. (2) subaddress range: when LOW (subaddress 8 to 20) pin 15 is connected to ground when HIGH (subaddress 1 to 7) pin 15 is connected via pull-up resistor to VCC.
Product specification
SAA3049A
Fig.5 Remote control decoder with latched 11 (10) -bit parallel outputs [10 (9) -bits inverted].
1996 Sep 13
T0-bit VCC (+5 V) 68 k 1 F 1N4148 A2-bit 33 k 5.6 k A4-bit A3-bit address outputs
handbook, full pagewidth
Philips Semiconductors
command acknowledge
220
D1 CQW24
5.6 k
BC548
Infrared remote control decoder
BC548
4 MHz
9
20 19 18 17 16 15 14 13 12 11 SAA3049A 1 2 3 4 5 6 7 8 9 10 IN input A1-bit A data outputs B C D E F A0-bit address outputs
MGE378
Product specification
SAA3049A
Fig.6 Remote control decoder with latched 12 -bit parallel outputs (11 bits inverted).
handbook, full pagewidth
mode VCC (+5 V) 68 k 1 F 1N4148 set subaddresses H or L (1) S2 (A2) 33 k 5.6 k (A4) (2) S1 (A1) 68 k for address see data sheets of transmitter ICs S0 (A0) S3 (A3) H selects RECS80 code L selects RC5 CODE
1996 Sep 13
command acknowledge
Philips Semiconductors
220
D1 CQW24
5.6 k
BC548
BC548 4 MHz
Infrared remote control decoder
10
20 SAA3049A 1 2 3 4 5 6 7 8 9 10 19 18 17 16 15 14 13 12 11 IN input A data outputs B C D E F
MGE379
T0
(1) Address inputs: when LOW address input pin is connected to ground when HIGH address input pin is connected via pull-up resistor to VCC. (2) subaddress range RECS80 code: when LOW (subaddress 8 to 20) pin 15 is connected to ground when HIGH (subaddress 1 to 7) pin 15 is connected via pull-up resistor to VCC.
Product specification
SAA3049A
Fig.7 Remote control decoder for up to 20 subaddresses with 6 + 1-bit parallel outputs (RECS80 code).
Philips Semiconductors
Product specification
Infrared remote control decoder
PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil)
SAA3049A
SOT146-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 7.62 0.30
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2.0 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-05-24
1996 Sep 13
11
Philips Semiconductors
Product specification
Infrared remote control decoder
SAA3049A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
1996 Sep 13
12
Philips Semiconductors
Product specification
Infrared remote control decoder
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
SAA3049A
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Sep 13
13
Philips Semiconductors
Product specification
Infrared remote control decoder
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
SAA3049A
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Sep 13
14
Philips Semiconductors
Product specification
Infrared remote control decoder
NOTES
SAA3049A
1996 Sep 13
15
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/25/02/pp16
Date of release: 1996 Sep 13
Document order number:
9397 750 01145

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