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PRELIMINARY
W216
Spread Spectrum FTG for 440BX and VIA Apollo Pro-133
Features
* Maximized EMI Suppression using Cypress's Spread Spectrum Technology * Single chip system FTG for Intel(R) 440BX AGPset and VIA Apollo Pro-133 * Three copies of CPU output * Seven copies of PCI output * One 48-MHz output for USB / One 24-MHz for SIO * Two buffered reference outputs * Two IOAPIC outputs * Seventeen SDRAM outputs provide support for 4 DIMMs * Supports frequencies up to 150 MHz * I2CTM interface for programming * Power management control inputs Table 1. Mode Input Table Mode 0 1 Pin 3 PCI_STOP# REF0
Key Specifications
CPU Cycle-to-Cycle Jitter: .......................................... 250 ps CPU to CPU Output Skew: ......................................... 175 ps PCI to PCI Output Skew: ............................................ 500 ps SDRAMIN to SDRAM0:15 Delay: ..........................3.7 ns typ. VDDQ3: .................................................................... 3.3V5% VDDQ2: .................................................................... 2.5V5% SDRAM0:15 (leads) to SDRAM_F Skew: ..............0.4 ns typ.
Table 2. Pin Selectable Frequency Input Address CPU_F, 1:2 PCI_F, 0:5 FS3 FS2 FS1 FS0 (MHz) (MHz) 1 1 1 1 133.3 33.3 (CPU/4) 1 1 1 0 124 31 (CPU/4) 1 1 0 1 150 37.5 (CPU/4) 1 1 0 0 140 35 (CPU/4) 1 0 1 1 105 35 (CPU/3) 1 0 1 0 110 36.7 (CPU/3) 1 0 0 1 115 38.3 (CPU/3) 1 0 0 0 120 40 (CPU/3) 0 1 1 1 100 33.3 (CPU/3) 0 1 1 0 Reserved 0 1 0 1 112 37.3 (CPU/3) 0 1 0 0 103 34.3 (CPU/3) 0 0 1 1 66.8 33.4 (CPU/2) 0 0 1 0 83.3 41.7 (CPU/2) 0 0 0 1 75 37.5 (CPU/2) 0 0 0 0 Reserved
Block Diagram
VDDQ3 REF0/(PCI_STOP#) X1 X2 XTAL OSC REF1/FS2 PLL Ref Freq
Stop Clock Control
Pin Configuration
VDDQ3 REF1/FS2 REF0/(PCI_STOP#) GND X1 X2 VDDQ3 PCI_F/MODE PCI0/FS3 GND PCI1 PCI2 PCI3 PCI4 VDDQ3 PCI5 SDRAMIN SDRAM11 SDRAM10 VDDQ3 SDRAM9 SDRAM8 GND SDRAM15 SDRAM14 GND SDATA SCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
[1]
I/O Pin Control
CLK_STOP#
VDDQ2 IOAPIC_F IOAPIC0 VDDQ2 CPU_F
PLL 1
/2,3,4
Stop Clock Control
CPU1 CPU2 VDDQ3 PCI_F/MODE PCI0/FS3 PCI1 PCI2 PCI3
Stop Clock Control SDATA SCLK I2C Logic
PCI4 PCI5 VDDQ3
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
VDDQ2 IOAPIC0 IOAPIC_F GND CPU_F CPU1 VDDQ2 CPU2 GND CLK_STOP# SDRAM_F VDDQ3 SDRAM0 SDRAM1 GND SDRAM2 SDRAM3 SDRAM4 SDRAM5 VDDQ3 SDRAM6 SDRAM7 GND SDRAM12 SDRAM13 VDDQ3 24MHz/FS0 48MHz/FS1
PLL2
Stop Clock Control
48MHz/FS1 24MHz/FS0 VDDQ3 SDRAM0:15 16 SDRAM_F
SDRAMIN
Note: 1. Internal pull-up resistors should not be relied upon for setting I/O pins HIGH. Pin function with parentheses determined by MODE pin resistor strapping. Unlike other I/O pins, input FS3 has an internal pull-down resistor.
W216
Intel is a registered trademark of Intel Corporation. I2C is a trademark of Philips Corporation.
Cypress Semiconductor Corporation
*
3901 North First Street
*
San Jose
*
CA 95134 * 408-943-2600 October 27, 1999, rev. **
PRELIMINARY
Pin Definitions
Pin Name CPU1:2 CPU_F PCI1:5 PCI0/FS3 Pin No. 51, 49 52 11, 12, 13, 14, 16 9
W216
PCI_F/MODE
8
CLK_STOP#
47
IOAPIC_F
54
IOAPIC0 48MHz/FS1
55 29
24MHz/FS0
30
REF1/FS2 REF0 (PCI_STOP#)
2 3
SDRAMIN SDRAM0:15
17 44, 43, 41, 40, 39, 38, 36, 35, 22, 21, 19, 18, 33, 32, 25, 24 46 28 27 5
Pin Type Pin Description CPU Outputs 1 and 2: Frequency is set by the FS0:3 inputs or through serial input O interface, see Tables 2 and 6. These outputs are affected by the CLK_STOP# input. Free-Running CPU Output: Frequency is set by the FS0:3 inputs or through serial input O interface, see Tables 2 and 6. This output is not affected by the CLK_STOP# input. PCI Outputs 1 through 5: Frequency is set by the FS0:3 inputs or through serial input O interface, see Tables 2 and 6. These outputs are affected by the PCI_STOP# input. I/O PCI Output/Frequency Select Input: As an output, frequency is set by the FS0:3 inputs or through serial input interface, see Tables 2 and 6. This output is affected by the PCI_STOP# input. When an input, latches data selecting the frequency of the CPU and PCI outputs. I/O Free Running PCI Output: Frequency is set by the FS0:3 inputs or through serial input interface, see Tables 2 and 6. This output is not affected by the PCI_STOP# input. When an input, selects function of pin 3 as described in Table 1. CLK_STOP# Input: When brought LOW, affected outputs are stopped LOW after comI pleting a full clock cycle (2-3 CPU clock latency). When brought HIGH, affected outputs start beginning with a full clock cycle (2-3 CPU clock latency). Free-running IOAPIC Output: This output is a buffered version of the reference input O which is not affected by the CPU_STOP# logic input. It's swing is set by voltage applied to VDDQ2. I/O IOAPIC Output: Provides 14.318-MHz fixed frequency. The output voltage swing is set by voltage applied to VDDQ2. This output is disabled when CLK_STOP# is set LOW. I/O 48-MHz Output: 48 MHz is provided in normal operation. In standard systems, this output can be used as the reference for the Universal Serial Bus. Upon power up, FS1 input will be latched, setting output frequencies as described in Table 2. I/O 24-MHz Output: 24 MHz is provided in normal operation. In standard systems, this output can be used as the clock input for a Super I/O chip. Upon power up, FS0 input will be latched, setting output frequencies as described in Table 2. I/O Reference Output: 14.318 MHz is provided in normal operation. Upon power-up, FS2 input will be latched, setting output frequencies as described in Table 2. I/O Fixed 14.318-MHz Output 0 or PCI_STOP# Pin: Function determined by MODE pin. The PCI_STOP# input enables the PCI 0:5 outputs when HIGH and causes them to remain at logic 0 when LOW. The PCI_STOP signal is latched on the rising edge of PCI_F. Its effects take place on the next PCI_F clock cycle. As an output, this pin provides a fixed clock signal equal in frequency to the reference signal provided at the X1/X2 pins (14.318 MHz). Buffered Input Pin: The signal provided to this input pin is buffered to 17 outputs I (SDRAM0:15, SDRAM_F). Buffered Outputs: These sixteen dedicated outputs provide copies of the signal proO vided at the SDRAMIN input. The swing is set by VDDQ3, and they are deactivated when CLK_STOP# input is set LOW. O I I/O I Free-Running Buffered Output: This output provides a single copy of the SDRAMIN input. The swing is set by VDDQ3; this signal is unaffected by the CLK_STOP# input. Clock pin for I2C circuitry. Data pin for I2C circuitry. Crystal Connection or External Reference Frequency Input: This pin has dual functions. It can be used as an external 14.318-MHz crystal connection or as an external reference frequency input. Crystal Connection: An input connection for an external 14.318-MHz crystal. If using an external reference, this pin must be left unconnected. Power Connection: Power supply for core logic, PLL circuitry, SDRAM outputs buffers, PCI output buffers, reference output buffers and 48-MHz/24-MHz output buffers. Connect to 3.3V. Power Connection: Power supply for IOAPIC and CPU output buffers. Connect to 2.5V or 3.3V.
SDRAM_F SCLK SDATA X1
X2 VDDQ3
6 1, 7, 15, 20, 31, 37, 45 50, 56
I P
VDDQ2
P
2
PRELIMINARY
Pin Definitions (continued)
Pin Name GND
W216
Pin Pin No. Type Pin Description Ground Connections: Connect all ground pins to the common system ground plane. 4, 10, 23, 26, G 34, 42, 48, 53 tor on the l/O pins to pull the pins and their associated capacitive clock load to either a logic HIGH or LOW state. At the end of the 2-ms period, the established logic "0" or "1" condition of the l/O pin is latched. Next the output buffer is enabled, converting the l/O pins into operating clock outputs. The 2-ms timer starts when VDD reaches 2.0V. The input bits can only be reset by turning VDD off and then back on again. It should be noted that the strapping resistors have no significant effect on clock output signal integrity. The drive impedance of clock output (<40, nominal), which is minimally affected by the 10-k strap to ground or VDD. As with the series termination resistor, the output strapping resistor should be placed as close to the l/O pin as possible in order to keep the interconnecting trace short. The trace from the resistor to ground or VDD should be kept less than two inches in length to prevent system noise coupling during input logic sampling. When the clock outputs are enabled following the 2-ms input period, the specified output frequency is delivered on the pin, assuming that VDD has stabilized. If VDD has not yet reached full value, output frequency initially may be below target but will increase to target once VDD voltage has stabilized. In either case, a short output clock cycle may be produced from the CPU clock outputs when the outputs are enabled.
VDD Output Strapping Resistor 10 k (Load Option 1) W216 Output Buffer Power-on Reset Timer Output Three-state Hold Output Low
D
Overview
The W216 was designed as a single-chip alternative to the standard two-chip Intel 440BX AGPset clock solution. It provides sufficient outputs to support most single-processor, four SDRAM DIMM designs.
Functional Description
I/O Pin Operation Pins 2, 8, 9, 29, and 30 are dual-purpose l/O pins. Upon powerup these pins act as logic inputs, allowing the determination of assigned device functions. A short time after power-up, the logic state of each pin is latched and the pins become clock outputs. This feature reduces device pin count by combining clock outputs with input select pins. An external 10-k "strapping" resistor is connected between the l/O pin and ground or VDD. Connection to ground sets a latch to "0," connection to VDD sets a latch to "1." Figure 1 and Figure 2 show two suggested methods for strapping resistor connections. Upon W216 power-up, the first 2 ms of operation is used for input logic selection. During this period, the five I/O pins (2, 8, 9, 29, 30) are three-stated, allowing the output strapping resis-
Series Termination Resistor R Clock Load
10 k (Load Option 0)
Q
Data Latch
Figure 1. Input Logic Selection Through Resistor Load Option
Jumper Options
VDD 10 k W216 Output Buffer Power-on Reset Timer Output Three-state Hold Output Low
D
Output Strapping Resistor Series Termination Resistor Clock Load
R Resistor Value R
Q
Data Latch
Figure 2. Input Logic Selection Through Jumper Option
3
PRELIMINARY
Spread Spectrum Frequency Timing Generator
The device generates a clock that is frequency modulated in order to increase the bandwidth that it occupies. By increasing the bandwidth of the fundamental and its harmonics, the amplitudes of the radiated electromagnetic emissions are reduced. This effect is depicted in Figure 3. As shown in Figure 3, a harmonic of a modulated clock has a much lower amplitude than that of an unmodulated signal. The reduction in amplitude is dependent on the harmonic number and the frequency deviation or spread. The equation for the reduction is dB = 6.5 + 9*log10(P) + 9*log10(F)
W216
Where P is the percentage of deviation and F is the frequency in MHz where the reduction is measured. The output clock is modulated with a waveform depicted in Figure 4. This waveform, as discussed in "Spread Spectrum Clock Generation for the Reduction of Radiated Emissions" by Bush, Fessler, and Hardin produces the maximum reduction in the amplitude of radiated electromagnetic emissions. The deviation selected for this chip is specified in Table 6. Figure 4 details the Cypress spreading pattern. Cypress does offer options with more spread and greater EMI reduction. Contact your local Sales representative for details on these devices. Spread Spectrum clocking is activated or deactivated by selecting the appropriate values for bits 1-0 in data byte 0 of the I2C data stream. Refer to Table 7 for more details.
EMI Reduction
Spread Spectrum Enabled
NonSpread Spectrum
Figure 3. Clock Harmonic with and without SSCG Modulation Frequency Domain Representation
MAX
FREQUENCY
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
10%
20%
30%
40%
50%
60%
70%
80%
90%
MIN
Figure 4. Typical Modulation Profile
4
100%
PRELIMINARY
Serial Data Interface
The W216 features a two-pin, serial data interface that can be used to configure internal register settings that control particular device functions. Upon power-up, the W216 initializes with default register settings, therefore the use of this serial data interface is optional. The serial interface is write-only (to the clock chip) and is the dedicated function of device pins SDATA and SCLOCK. In motherboard applications, SDATA and SCLOCK are typically driven by two logic outputs of the Table 3. Serial Data Interface Control Functions Summary Control Function Output Disable Description Common Application
W216
chipset. Clock device register changes are normally made upon system initialization, if any are required. The interface can also be used during system operation for power management functions. Table 3 summarizes the control functions of the serial data interface. Operation Data is written to the W216 in eleven bytes of eight bits each. Bytes are written in the order shown in Table 4.
Any individual clock output(s) can be disabled. Dis- Unused outputs are disabled to reduce EMI abled outputs are actively held low. and system power. Examples are clock outputs to unused PCI slots. Provides CPU/PCI frequency selections alternate to the selections that are provided by the FS0:3 pins. Frequency is changed in a smooth and controlled fashion. Enables or disables spread spectrum clocking. Puts all clock outputs into a high-impedance state. For alternate microprocessors and power management options. Smooth frequency transition allows CPU frequency change under normal system operation. For EMI reduction. Production PCB testing.
CPU Clock Frequency Selection
Spread Spectrum Enabling Output Three-state Test Mode (Reserved)
All clock outputs toggle in relation to X1 input, inter- Production PCB testing. nal PLL is bypassed. Refer to Table 5. Reserved function for future device revision or pro- No user application. Register bit must be writduction device testing. ten as 0.
Table 4. Byte Writing Sequence Byte Sequence 1 Byte Name Slave Address Bit Sequence 11010010 Byte Description Commands the W216 to accept the bits in Data Bytes 0-7 for internal register configuration. Since other devices may exist on the same common serial data bus, it is necessary to have a specific slave address for each potential receiver. The slave receiver address for the W216 is 11010010. Register setting will not be made if the Slave Address is not correct (or is for an alternate slave receiver). Unused by the W216, therefore bit values are ignored ("don't care"). This byte must be included in the data write sequence to maintain proper byte allocation. The Command Code Byte is part of the standard serial communication protocol and may be used when writing to another addressed slave receiver on the serial data bus. Unused by the W216, therefore bit values are ignored ("don't care"). This byte must be included in the data write sequence to maintain proper byte allocation. The Byte Count Byte is part of the standard serial communication protocol and may be used when writing to another addressed slave receiver on the serial data bus. The data bits in Data Bytes 0-7 set internal W216 registers that control device operation. The data bits are only accepted when the Address Byte bit sequence is 11010010, as noted above. For description of bit control functions, refer to Table 5, Data Byte Serial Configuration Map.
2
Command Code
Don't Care
3
Byte Count
Don't Care
4 5 6 7 8 9 10 11
Data Byte 0 Data Byte 1 Data Byte 2 Data Byte 3 Data Byte 4 Data Byte 5 Data Byte 6 Data Byte 7
Refer to Table 5
Don't Care
Unused by the W216, therefore bit values are ignored ("don't care").
5
PRELIMINARY
Writing Data Bytes Each bit in Data Bytes 0-7 controls a particular device function except for the "reserved" bits which must be written as a logic 0. Bits are written MSB (most significant bit) first, which is bit 7. Table 5 gives the bit formats for registers located in Data Bytes 0-7. Table 5. Data Bytes 0-7 Serial Configuration Map Affected Pin Bit(s) 7 6 5 4 3 Pin No. -----Pin Name -----Control Function (Reserved) SEL2 SEL1 SEL0 Frequency Table Selection 0 -Refer to Table 6 Refer to Table 6 Refer to Table 6 Frequency Controlled by FS (3:0) Table 2 OFF Normal ----Low Low Low Low -Low Low Low Low Low Low Low --Low Low Low Frequency Controlled by SEL (3:0) Table 6 ON Three-stated ----Active Active Active Active -Active Active Active Active Active Active Active --Active Active Active Data Byte 0 -Bit Control 1
W216
Table 6 details additional frequency selections that are available through the serial data interface. Table 7 details the select functions for Byte 0, bits 1 and 0.
Default 0 0 0 0 0
2 1 0 Data Byte 1 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 Data Byte 3 7 6 5 4 3
-------46 49 51 52 -8 16 14 13 12 11 9 --29 30 33, 32, 25, 24
-Test Mode ----SDRAM_F CPU2 CPU1 CPU_F -PCI_F PCI5 PCI4 PCI3 PCI2 PCI1 PCI0 --48MHz 24MHz SDRAM12:15
SEL3 -----Clock Output Disable Clock Output Disable Clock Output Disable Clock Output Disable (Reserved) Clock Output Disable Clock Output Disable Clock Output Disable Clock Output Disable Clock Output Disable Clock Output Disable Clock Output Disable (Reserved) (Reserved) Clock Output Disable Clock Output Disable Clock Output Disable
Refer to Table 6
0 0 0 0 0 0 0 1 1 1 1 0 1 1 1 1 1 1 1 0 0 1 1 1
Spread Spectrum --
Data Byte 2
6
PRELIMINARY
Table 5. Data Bytes 0-7 Serial Configuration Map (continued) Affected Pin Bit(s) 2 1 0 Pin No. 22, 21, 19, 18 39, 38, 36, 35 44, 43, 41, 40 ----------54 55 --2 3 Pin Name SDRAM8:11 SDRAM4:7 SDRAM0:3 Control Function Clock Output Disable Clock Output Disable Clock Output Disable 0 Low Low Low Bit Control 1 Active Active Active
W216
Default 1 1 1
Data Byte 4 7 6 5 4 3 2 1 0 Data Byte 5 7 6 5 4 3 2 1 0 --IOAPIC_F IOAPICO --REF1 REF0 (Reserved) (Reserved) Disabled Disabled (Reserved) (Reserved) Clock Output Disable Clock Output Disable --Low Low --Low Low --Active Active --Active Active 0 0 1 1 0 0 1 1 --------(Reserved) (Reserved) (Reserved) (Reserved) (Reserved) (Reserved) (Reserved) (Reserved) ----------------0 0 0 0 0 0 0 0
7
PRELIMINARY
Table 6. Additional Frequency Selections through Serial Data Interface Data Bytes Input Conditions Data Byte 0, Bit 3 = 1 Bit 2 SEL_3 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 Bit 6 SEL_2 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 Bit 5 SEL_1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 Bit 4 SEL_0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 112 103 66.8 83.3 75 CPU, SDRAM Clocks (MHz) 133.3 124 150 140 105 110 115 120 100 Reserved 37.3 (CPU/3) 34.3 (CPU/3) 33.4 (CPU/2) 41.7 (CPU/2) 37.5 (CPU/2) Reserved PCI Clocks (MHz) 33.3 (CPU/4) 31 (CPU/4) 37.5 (CPU/4) 35 (CPU/4) 35 (CPU/3) 36.7 (CPU/3) 38.3 (CPU/3) 40 (CPU/3) 33.3 (CPU/3) Output Frequency
W216
Spread On
Spread Percentage -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down -0.5% Down
Table 7. Select Function for Data Byte 0, Bits 0:1 Input Conditions Data Byte 0 Function Normal Operation Spread Spectrum Three-state Bit 1 0 1 X Bit 0 0 0 1 CPU_F, 1:2 Note 2 Note 2 Hi-Z PCI_F, PCI0:5 Note 2 Note 2 Hi-Z Output Conditions REF0:1, IOAPIC0,_F 14.318 MHz 14.318 MHz Hi-Z 48MHZ 48 MHz 48 MHz Hi-Z 24MHZ 24 MHz 24 MHz Hi-Z
Note: 2. CPU and PCI frequency selections are listed in Table 2 and Table 6.
8
PRELIMINARY
Absolute Maximum Ratings
Stresses greater than those listed in this table may cause permanent damage to the device. These represent a stress rating only. Operation of the device at these or any other conditions
.
W216
above those specified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect reliability. Rating -0.5 to +7.0 -65 to +150 -55 to +125 0 to +70 2 (min.) Unit V C C C kV
Parameter VDD, VIN TSTG TB TA ESDPROT
Description Voltage on any pin with respect to GND Storage Temperature Ambient Temperature under Bias Operating Temperature Input ESD Protection
DC Electrical Characteristics: TA = 0C to +70C, VDDQ3 = 3.3V5%, VDDQ2 = 2.5V5%
Parameter Supply Current IDD IDD Logic Inputs VIL VIH IIL IIH IIL IIH VOL VOH VOH IOL Input Low Voltage Input High Voltage Input Low Current[4] Input High Current
[4]
Description 3.3V Supply Current 2.5V Supply Current
Test Condition CPU_F, 1:2 = 100 MHz Outputs Loaded[3] CPU_F, 1:2 = 100 MHz Outputs Loaded[3]
Min.
Typ. 320 40
Max.
Unit mA mA
GND - 0.3 2.0
0.8 VDD + 0.3 -25 10 -5 +5
V V A A A A mV V V
Input Low Current (SEL100/66#) Input High Current (SEL100/66#) Output Low Voltage Output High Voltage Output High Voltage Output Low Current CPU_F, 1:2 IOAPIC CPU_F, 1:2 PCI_F, PCI0:5 IOAPIC0, IOAPIC_F REF0:1 48-MHz 24-MHz SDRAM0:15,_F IOL = 1 mA IOH = -1 mA IOH = -1 mA VOL = 1.25V VOL = 1.5V VOL = 1.25V VOL = 1.5V VOL = 1.5V VOL = 1.5V VOL = 1.5V VOL = 1.25V VOL = 1.5V VOL = 1.25V VOL = 1.5V VOL = 1.5V VOL = 1.5V VOL = 1.5V 3.1 2.2 60 96 72 61 60 60 95 43 76 60 50 50 50 75 73 110 92 71 70 70 110 60 96 90 60 60 60 95
Clock Outputs 50
85 130 110 80 80 80 130 80 120 130 72 72 72 120
mA mA mA mA mA mA mA mA mA mA mA mA mA mA
IOH
Output High Current
CPU_F, 1:2 PCI_F, PCI0:5 IOAPIC0, IOAPIC_F REF0:1 48-MHz 24-MHz SDRAM0:15,_F
Notes: 3. All clock outputs loaded with 6" 60 transmission lines with 22-pF capacitors. 4. W216 logic inputs (except FS3) have internal pull-up devices (pull-ups not full CMOS level). Logic input FS3 has an internal pull-down device.
9
PRELIMINARY
DC Electrical Characteristics: TA = 0C to +70C, VDDQ3 = 3.3V5%, VDDQ2 = 2.5V5% (continued)
Parameter Crystal Oscillator VTH CLOAD CIN,X1 CIN COUT LIN X1 Input Threshold Voltage[5] Load Capacitance, Imposed on External Crystal[6] X1 Input Capacitance[7] Input Pin Capacitance Output Pin Capacitance Input Pin Inductance Pin X2 unconnected Except X1 and X2 VDDQ3 = 3.3V 1.65 14 28 5 6 7 Description Test Condition Min. Typ. Max.
W216
Unit V pF pF pF pF nH
Pin Capacitance/Inductance
AC Electrical Characteristics
TA = 0C to +70C, VDDQ3 = 3.3V5%,VDDQ2 = 2.5V 5% fXTL = 14.31818 MHz AC clock parameters are tested and guaranteed over stated operating conditions using the stated lump capacitive load at the clock output; Spread Spectrum is disabled. CPU Clock Outputs, CPU_F, 1:2 (Lump Capacitance Test Load = 20 pF) Parameter tP tH tL tR tF tD tJC Description Period High Time Low Time Output Rise Edge Rate Test Condition/ Comments Measured on rising edge at 1.25 Duration of clock cycle above 2.0V Duration of clock cycle below 0.4V Measured from 0.4V to 2.0V CPU = 66.8 MHz 15 5.2 5.0 1 1 45 4 4 55 250 15.5 CPU = 100 MHz 10 3.0 2.8 1 1 45 4 4 55 250 10.5 CPU = 133 MHz 7.5 1.87 1.67 1 1 45 4 4 55 250 8.0 ns ns ns V/ns V/ns % ps Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit
Output Fall Edge Measured from 2.0V to Rate 0.4V Duty Cycle Jitter, Cycle-to-Cycle Measured on rising and falling edge at 1.25V Measured on rising edge at 1.25V. Maximum difference of cycle time between two adjacent cycles. Measured on rising edge at 1.25V Assumes full supply voltage reached within 1 ms from power-up. Short cycles exist prior to frequency stabilization. Average value during switching transition. Used for determining series termination value.
tSK fST
Output Skew Frequency Stabilization from Power-up (cold start) AC Output Impedance
175 3
175 3
175 3
ps ms
Zo
20
20
20
Notes: 5. X1 input threshold voltage (typical) is VDDQ3/2. 6. The W216 contains an internal crystal load capacitor between pin X1 and ground and another between pin X2 and ground. Total load placed on crystal is 14 pF; this includes typical stray capacitance of short PCB traces to crystal. 7. X1 input capacitance is applicable when driving X1 with an external clock source (X2 is left unconnected).
10
PRELIMINARY
PCI Clock Outputs, PCI0:5 (Lump Capacitance Test Load = 30 pF Parameter tP tH tL tR tF tD tJC tSK tO fST Description Period High Time Low Time Output Rise Edge Rate Output Fall Edge Rate Duty Cycle Jitter, Cycle-to-Cycle Output Skew CPU to PCI Clock Skew Frequency Stabilization from Power-up (cold start) AC Output Impedance Test Condition/Comments Measured on rising edge at 1.5V Duration of clock cycle above 2.4V Duration of clock cycle below 0.4V Measured from 0.4V to 2.4V Measured from 2.4V to 0.4V Measured on rising and falling edge at 1.5V Measured on rising edge at 1.5V. Maximum difference of cycle time between two adjacent cycles. Measured on rising edge at 1.5V Covers all CPU/PCI outputs. Measured on rising edge at 1.5V. CPU leads PCI output. Assumes full supply voltage reached within 1 ms from power-up. Short cycles exist prior to frequency stabilization. Average value during switching transition. Used for determining series termination value. 15 1.5 Min. 30 12 12 1 1 45 4 4 55 250 500 4 3 Typ. Max.
W216
Unit ns ns ns V/ns V/ns % ps ps ns ms
Zo
IOAPIC0 and IOAPIC_F Clock Outputs (Lump Capacitance Test Load = 20 pF) Parameter f tR tF tD fST Description Frequency, Actual Output Rise Edge Rate Output Fall Edge Rate Duty Cycle Frequency Stabilization from Power-up (cold start) AC Output Impedance Test Condition/Comments Frequency generated by crystal oscillator Measured from 0.4V to 2.0V Measured from 2.0V to 0.4V Measured on rising and falling edge at 1.25V Assumes full supply voltage reached within 1 ms from power-up. Short cycles exist prior to frequency stabilization. Average value during switching transition. Used for determining series termination value. 15 1 1 45 Min. Typ. 14.318 4 4 55 1.5 Max. Unit MHz V/ns V/ns % ms
Zo
REF0:1 Clock Outputs (Lump Capacitance Test Load = 20 pF) Parameter f tR tF tD fST Description Frequency, Actual Output Rise Edge Rate Output Fall Edge Rate Duty Cycle Frequency Stabilization from Power-up (cold start) AC Output Impedance Test Condition/Comments Frequency generated by crystal oscillator Measured from 0.4V to 2.4V Measured from 2.4V to 0.4V Measured on rising and falling edge at 1.5V Assumes full supply voltage reached within 1 ms from power-up. Short cycles exist prior to frequency stabilization. Average value during switching transition. Used for determining series termination value. 25 0.5 0.5 45 Min. Typ. 14.318 2 2 55 3 Max. Unit MHz V/ns V/ns % ms
Zo
11
PRELIMINARY
SDRAM 0:15,_F Clock Outputs (Lump Capacitance Test Load = 22 pF) Test Condition/ Comments Measured on rising edge at 1.5V Duration of clock cycle above 2.4V Duration of clock cycle below 0.4V Measured from 0.4V to 2.4V SDRAMIN = 66.8 MHz 15 5.2 5.0 1 1 45 4 4 55 250 3.7 15 3.7 15 15.5 SDRAMIN = 100 MHz 10 3.0 2.0 1 1 45 4 4 55 250 3.7 15 10.5 SDRAMIN = 133 MHz 7.5 1.87 1.67 1 1 45 4 4
W216
Parameter tP tH tL tR tF tD tSK tPD Zo
Description Period High Time Low Time Output Rise Edge Rate
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit 8.0 ns ns ns V/ns V/ns % ps
ns
Output Fall Edge Measured from 2.4V to Rate 0.4V Duty Cycle Output Skew Propagation Delay AC Output Impedance Measured on rising and falling edge at 1.5V Measured on rising and falling edge at 1.5V Measured from SDRAMIN Average value during switching transition. Used for determining series termination value.
55 250
48-MHz Clock Output (Lump Capacitance Test Load = 20 pF) Parameter f fD m/n tR tF tD fST Description Frequency, Actual Deviation from 48 MHz PLL Ratio Output Rise Edge Rate Output Fall Edge Rate Duty Cycle Frequency Stabilization from Power-up (cold start) AC Output Impedance Test Condition/Comments Determined by PLL divider ratio (see m/n below) (48.008 - 48)/48 (14.31818 MHz x 57/17 = 48.008 MHz) Measured from 0.4V to 2.4V Measured from 2.4V to 0.4V Measured on rising and falling edge at 1.5V Assumes full supply voltage reached within 1 ms from power-up. Short cycles exist prior to frequency stabilization. Average value during switching transition. Used for determining series termination value. 25 0.5 0.5 45 Min. Typ. 48.008 +167 57/17 2 2 55 3 V/ns V/ns % ms Max. Unit MHz ppm
Zo
12
PRELIMINARY
24-MHz Clock Output (Lump Capacitance Test Load = 20 pF) Parameter f fD m/n tR tF tD fST Description Frequency, Actual Deviation from 24 MHz PLL Ratio Output Rise Edge Rate Output Fall Edge Rate Duty Cycle Frequency Stabilization from Power-up (cold start) AC Output Impedance Test Condition/Comments Determined by PLL divider ratio (see m/n below) (24.004 - 24)/24 (14.31818 MHz x 57/34 = 24.004 MHz) Measured from 0.4V to 2.4V Measured from 2.4V to 0.4V Measured on rising and falling edge at 1.5V Assumes full supply voltage reached within 1 ms from power-up. Short cycles exist prior to frequency stabilization. Average value during switching transition. Used for determining series termination value. 25 0.5 0.5 45 Min. Typ. 24.004 +167 57/34 2 2 55 3 Max.
W216
Unit MHz ppm V/ns V/ns % ms
Zo
Ordering Information
Ordering Code W216 Document #: 38-00850 Package Name H Package Type 56-pin SSOP (300 mils)
13
PRELIMINARY
Package Diagram
56-Pin Small Shrink Outline Package (SSOP, 300 mils)
W216
Summary of nominal dimensions in inches: Body Width: 0.296 Lead Pitch: 0.025 Body Length: 0.625 Body Height: 0.102
(c) Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.

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