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Integrated Circuit Systems, Inc.
ICS9169C-273
Frequency Generator for PentiumTM Based Systems
General Description
The ICS9169C-273 is a low-cost frequency generator designed specifically for Pentium based chip set systems. The integrated buffer minimizes skew and provides all the clocks required. A 14.318 MHz XTAL crystal provides the reference clock to generate standard Pentium frequencies. The CPU clock makes gradual frequency transitions without violating the PLL timing of internal microprocessor clock multipliers. Twelve CPU clock outputs provide sufficient clocks for the CPU, chip set, memory and up to two DIMM connectors (with four clocks to each DIMM). Either synchronous (CPU/2) or asynchronous (32 MHz) PCI bus operation can be selected by latching data on the BSEL input.
Features
* * * * * * * * * * Twelve selectable CPU clocks operate up to 83.3MHz Maximum CPU jitter of 200ps Six BUS clocks support sync or async bus operation 250ps skew window for CPU outputs, 500ps skew window for BUS outputs CPU clocks BUS clocks skew 0-2ns (CPU early) Integrated buffer outputs drive up to 30pF loads 3.0V - 3.7V supply range, CPU(1:6) outputs 2.5V(2.3752.62V) VDD option 32-pin SOJ package Logic inputs latched at Power-On for frequency selection saving pins as Input/Output 48 MHz clock for USB support and 24 MHz clock for FD
Block Diagram Pin Configuration
32-Pin SOJ
3.3V10%, 0-70 C Crystal (X1, X2) = 14.31818 MHz
Functionality
BUS (1:6)MHz BSEL=1 25 30 33.3 REF/4 27.5 37.5 41.7 Tristate
VDD Groups:
VDD1 = X1, X2, REF/BSEL VDD2 = CPU(1:6) VDD3 = CPU(7:12) & PLL Core VDD4 = BUS(1:6) VDD5 = 48/24 MHz
Latched Inputs: L1 = BSEL L2 = FS0 L3 = FS1 L4 = FS2
ADDRESS SELECT FS2 FS1 FS0 0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1
CPU(1:12) (MHz) 50 60 66.6 REF/2 55 75 83.3 Tristate
48MHz BSEL=0 32 48 32 48 32 48 REF/3 REF/2 32 48 32 48 32 48 Tristate Tristate
24MHz 24 24 24 REF/4 24 24 24 Tristate
REF REF REF REF REF REF REF REF Tristate
Pentium is a trademark on Intel Corporation. 9169C-273RevC031897
ICS reserves the right to make changes in the device data identified in this publication without further notice. ICS advises its customers to obtain the latest version of all device data to verify that any information being relied upon by the customer is current and accurate.
ICS9169C-273
Pin Descriptions
PIN NUM BER 1 PIN NAM E VDD1 TYPE PW R DESCRIPTION Power for device logic, and 24/48M Hz output XTAL or external reference frequency input. This input includes XTAL load capacitance and feedback bias for a 12-16M Hz crystal, nominally 14.31818M Hz external crystal load of 30pF to GND recommended for VDD power on faster than 2.0ms. XTAL output which includes XTAL load capacitance. External crystal load of 10pF to GND recommended for VDD power on faster than 2.0ms. Ground for device logic. Processor clock output which is a multiple of the input reference frequency. Frequency multiplier select pin. See shared pin description.* Processor clock outputs which are a multiple of the input reference frequency. Power for CPU(1:6) output buffers only. Can be reduced VDD for 2.5V (2.375-2.62V) next generation processor clocks. Processor clock output which is a multiple of the input reference frequency internal pull up devices. Frequency multiplier select pin. See shared pin description.* Processor clock output which is a multiple of the input reference frequency internal pull up devices. Frequency multiplier select pin. See shared pin description.* Power for CPU(7:12) output buffers. M ust be nominal 3.3V (3.0 to 3.7V) BUS clock outputs which are a multiple of the input reference clock. Power for BUS clock buffers BUS(1:6). Power for fixed clock buffer (48 M Hz, 24 M hz). Fixed 24M Hz clock (assuming a 14.31818M Hz REF frequency). Fixed 48M Hz clock (assuming a 14.31818M Hz REF frequency). Fixed 14.31818M Hz clock (assuming a 14.31818M Hz REF frequency). Selection for synchronous or asynchronous bus clock operation. See shared pin programming description late in this data sheet for further explanation.
2
X1
IN
3 4,11,20,26
X2 GND CPU(1)
OUT PW R OUT IN OUT PW R OUT IN OUT IN PW R OUT PW R PW R OUT OUT OUT IN
5 FS0 6,7,9,10,15,16,17,18,19 8 CPU (2:5) (8:12) VDD2 CPU(6) 12 FS1 13 CPU(7) FS2 14 28, 27, 25, 24, 22, 21 23 29 30 31 VDD3 BUS (1:6) VDD4 VDD5 24M Hz 48M Hz REF 32 BSEL
* The internal pull-up will vary from 350K to 500K based on temperature.
2
ICS9169C-273
Shared Pin Operation Input/Output Pins
Shared Pin Operation - Input/Output Pins 5, 12, 13 and 32 on the ICS9169C-273 serve as dual signal functions to the device. During initial power-up, they act as input pins. The logic level (voltage) that is present on these pins at this time is read and stored into a 4-bit internal data latch. At the end of Power-On reset, (see AC characteristics for timing values), the device changes the mode of operation for these pins to an output function. In this mode the pins produce the specified buffered clocks to external loads. To program (load) the internal configuration register for these pins, a resistor is connected to either the VDD (logic 1) power supply or the GND (logic 0) voltage potential. A 10 Kilohm(10K) resistor is used to provide both the solid CMOS programming voltage needed during the power-up programming period and to provide an insignificant load on the output clock during the subsequent operating period. Figures 1 and 2 show the recommended PCB means of implementing this function. In Fig. 1 either one of the resistors is stuffed on the board (selective stuffing) to configure the device's internal logic. Figures 2a and b provide a single resistor stuffing option where either solder spot tabs or a physical jumper header may be used. These figures illustrate the optimal PCB physical layout options. These configuration resistors are of such a large ohmic value that they do not effect the low impedance clock signals. The layouts have been optimized to provide as little impedance transition to the clock signal as possible, as it passes through the programming resistor pad(s).
Test Mode Operation
The ICS9169C-273 includes a production test verification mode of operation. This requires that the FSO and FS1 pins be programmed to a logic high and the FS2 pin be programmed to a logic low(see Shared Pin Operation section). In this mode the device will output the following frequencies.
Pin Frequency
REF 48MHz 24MHz CPU (1:12) BSEL=1 BUS (1:6) BSEL = 0
REF REF/2 REF/4 REF2 REF/4 REF/3
Note: REF is the frequency of either the crystal connected between the devices X1and X2 or, in the case of a device being driven by an external reference clock, the frequency of the reference (or test) clock on the device's X1 pin.
(Resistors are surface mount devices shown schematically between 5.m. pads) *use only one programming resistor
Fig. 1
3
ICS9169C-273
Fig. 2a
Fig. 2b
Fig. 3
4
ICS9169C-273
Technical Pin Function Descriptions
VDD1 This is the power supply to the internal logic of the device as well as the following clock output buffers: A. REF clock output buffers B. BUS clock output buffers C. Fixed clock output buffers This pin may be operated at any voltage between 3.0 and 5.5 volts. Clocks from the listed buffers that it supplies will have a voltage swing from ground to this level. For the actual guaranteed high and low voltage levels of these clocks, please consult the AC parameter table in this data sheet. GND This is the power supply ground return pin for the internal logic of the device as well as the following Clock Output buffers: A. B. C. D. E. REF clock output buffers BUS clock output buffers CPU clock output buffers Fixed clock output buffers 24/48MHz clock output buffers clocks is controlled by the supply that is applied to the VDD pin of the group. See the Functionality Table at the beginning of this data sheet for a list of the specific frequencies that this clock operates at and the selection codes that are necessary to produce these frequencies. FS0, FS1, FS2 These pins control the frequency of the clocks at the CPU, CPUL, BUS & SDRAM pins. See the Funtionality table at the beginning of this data sheet for a list of the specific frequencies that this clock operates at and the selection codes that are necessary to produce these frequencies. The device reads these pins at power-up and stores the programmed selection code in an internal data latch. (See programming section of this data sheet for configuration circuitry recommendations. BSEL When this pin is a logic 1, it will place the CPU clocks in the synchronous mode (running at half the frequency of the Ref). If this pin is a logic 0, it will be in the asynchronous mode for the CPU clocks and will operate at the preprogrammed fixed frequency rate. It is a shared pin and is programed the same way as the frequency select pins. VDD (2:3) These are the power supply pins for the CPU (1:6) and CPU (7:12) clock buffers. By separating the clock power pins, each group can receive the appropriate power decoupling and bypassing necessary to minimize EMI and crosstalk between the individual signals. VDD2 can be reduced to 2.5V VDD for advanced processor clocks, which will bring CPU (1:6) outputs at 0 to 2.5V output swings. VDD4 This is the power supply pin for BUS clock buffers BUS (1:6). VDD5 This is the power supply pin for fixed clock buffer (48MHz and 24MHz). 48 MHz This is a fixed frequency clock that is typically used to drive Super I/O peripheral device needs. 24 MHz This is a fixed frequency clock that is typically used to drive Keyboard controller clock needs. REF This is a fixed frequency clock that runs at the same frequency as the input reference clock (typically 14.31818 MHz) is and typically used to drive Video and ISA BUS requirements.
X1 This pin serves one of two functions. When the device is used with a crystal, X1 acts as the input pin for the reference signal that comes from the discrete crystal. When the device is driven by an external clock signal, X1 is the device' input pin for that reference clock. This pin also implements an internal crystal loading capacitor that is connected to ground. See the data tables for the value of the capacitor. X2 This pin is used only when the device uses a Crystal as the reference frequency source. In this mode of operation, X2 is an output signal that drives (or excites) the discrete crystal. This pin also implements an internal crystal loading capacitor that is connected to ground. See the data tables for the value of the capacitor. CPU (1:12) These pins are clock outputs that drive the processor and other CPU related circuitry that require clocks which are in tight skew tolerance with the CPU clock. The voltage swing of these clocks is controlled by that which is applied to the VDD pins of the device. See note on VDD3. See the Functionality Table at the beginning of this data sheet for a list of the specific frequencies that this clock operates at and the selection codes that are necessary to produce these frequencies. BUS (1:6) These pins are the Clock Outputs that are intended to drive the systems plug-in card bus. The voltage swing of these 5
ICS9169C-273
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0 V Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND -0.5 V to VDD +0.5 V Ambient Operating Temperature . . . . . . . . . . . . 0C to +70C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . -65C to +150C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only and functional operation of the device at these or any other conditions above those listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
Electrical Characteristics at 3.3V
VDD = 3.0 - 3.7 V, TA = 0 - 70 C unless otherwise stated
DC Characteristics
PARAMETER Input Low Voltage Input High Voltage Input Low Current Input High Current Output Low Current
1
SYMBOL VIL VIH IIL IIH IOL IOH IOL IOH VOL VOH VOL VOH IDD VIN = 0V VIN = VDD
TEST CONDITIONS
MIN 0.7VDD -28.0 -5.0 16.0 19.0 2.4 2.4 -
TYP -10.5 25.0 -30.0 30.0 -38.0 0.3 2.8 0.3 2.8 90
MAX 0.2VDD 5.0 -14 -16.0 0.4 0.4 180
UNITS V V A A mA mA mA mA V V V V mA
VOL = 0.8V; for CPU, BUS, Fixed CLKs VOL = 2.0V; for CPU, BUS, Fixed CLKs VOL = 0.8V; for REF CLK VOL = 2.0V; for REF CLK IOL = 8mA; for CPU, BUS, Fixed CLKs IOH = -8mA; for CPU, BUS, Fixed CLKs IOL = 10mA; for REF CLK IOH = -15mA; for REF CLK @66.6 MHz; all outputs unloaded
Output High Current1 Output Low Current
1
Output High Current1 Output Low Voltage
1
Output High Voltage1 Output Low Voltage
1
Output High Voltage1 Supply Current
Note 1: Parameter is guaranteed by design and characterization. Not 100% tested in production.
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ICS9169C-273
Electrical Characteristics at 3.3V
VDD = 3.0 - 3.7 V, TA = 0 - 70 C unless otherwise stated
AC Characteristics
PARAMETER Rise Time 1 Fall Time 1 Rise Time 1 Fall Time 1 Duty Cycle1 Jitter, One Sigma1 Jitter, Absolute1 Jitter, One Sigma1 Jitter, Absolute
1
SYMBOL Tr1 Tf1 Tr2 Tf2 Dt Tj1s1 Tjab1 Tj1s2 Tjab2 Fi CIN
1
TEST CONDITIONS 20pF load, 0.8 to 2.0V CPU & BUS 20pF load, 2.0 to 0.8V CPU & BUS 20pF load, 20% to 80% CPU & BUS 20pF load, 80% to 20% CPU & BUS 20pF load @ VOUT=1.4V CPU & BUS Clocks; Load=20pF, BSEL=1 CPU & BUS Clocks; Load=20pF, BSEL=1 REF & Fixed CLK; Load=20pF REF & Fixed CLK; Load=20pF
MIN 45 -250 -5 12.0
TYP 0.9 0.8 1.5 1.4 50 50 1 2 14.318 5 18 2.5 150 150 1.0 0.5
MAX 1.5 1.4 2.5 2.4 60 150 250 3 5 16.0 4.5 250 250 2 1
UNITS ns ns ns ns % ps ps % % MHz pF pF ms ps ps ns ns
Input Frequency1 Logic Input Capacitance 1 Crystal Oscillator Capacitance Power-on Time 1 Clock Skew1 Clock Skew1 Clock Skew1 Clock Skew1
Logic input pins X1, X2 pins From VDD=1.6V to 1st crossing of 66.6 MHz VDD supply ramp < 40ms CPU to CPU; Load=20pF; @1.4V BUS to BUS; Load=20pF; @1.4V CPU to BUS; Load=20pF; @1.4V (CPU is early) CPU (@3.3V) to CPU (@2.5V) (2.5V CPU is late)
0
CINX ton Tsk1 Tsk2 Tsk3 TSR4
Note 1: Parameter is guaranteed by design and characterization. Not 100% tested in production.
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ICS9169C-273
0.818
SOIC Package
Ordering Information
ICS9169CM-273 ICS9169CJ-273
Example:
SOJ Package
ICS XXXX M - PPP
Pattern Number (2 or 3 digit number for parts with ROM code patterns) Package Type M=SOIC J=SOJ Device Type (consists of 3 or 4 digit numbers) Prefix ICS, AV = Standard Device
8
ICS reserves the right to make changes in the device data identified in this publication without further notice. ICS advises its customers to obtain the latest version of all device data to verify that any information being relied upon by the customer is current and accurate.

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