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TD62001~004P/AP/F/AF
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62001P,TD62001AP,TD62001F,TD62001AF,TD62002P TD62002AP,TD62002F,TD62002AF,TD62003P,TD62003AP,TD62003F TD62003AF,TD62004P,TD62004AP,TD62004F,TD62004AF
7CH DARLINGTON SINK DRIVER
The TD62001P / AP / F / AF Series are high-voltage, high-current darlington drivers comprised of seven NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and display (LED) drivers.
FEATURES
l Output current (single output) 500 mA MAX. l High sustaining voltage output 35 V MIN. (TD62001P / F Series) 50 V MIN. (TD62001AP / AF Series) l Output clamp diodes l Inputs compatible with various types of logic l Package Type-P, AP : DIP-16 pin l Package Type-F, AF : SOP-16 pin
TYPE TD62001P / AP / F / AF TD62002P / AP / F / AF TD62003P / AP / F / AF TD62004P / AP / F / AF INPUT BASE RESISTOR External 10.5-k + 7 V Zenner diode 2.7 k 10.5 k DESIGNATION General Purpose 14~25 V PMOS TTL, 5 V CMOS 6~15 V PMOS, CMOS
Weight DIP16-P-300-2.54A : 1.11 g (Typ.) SOP16-P-225-1.27 : 0.16 g (Typ.)
PIN CONNECTION (TOP VIEW)
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SCHEMATICS (EACH DRIVER)
TD62001P / AP / F / AF TD62002P / AP / F / AF TD62003P / AP / F / AF
TD62004P / AP / F / AF
Note:
The input and output parasitic diodes cannot be used as clamp diodes.
MAXIMUM RATINGS (Ta = 25C)
CHARACTERISTIC Output Sustaining Voltage Output Current Input Voltage Input Current Clamp Diode Reverse Voltage Clamp Diode Forward Current P Power Dissipation AP F, AF Operating Temperature Storage Temperature P AP, F, AF Topr Tstg PD P, F AP, AF P, F AP, AF SYMBOL VCE (SUS) IOUT VIN (Note 1) IIN (Note 2) VR IF RATING -0.5~35 -0.5~50 500 -0.5~30 25 35 50 500 1.0 1.47 0.54 / 0.625 (Note 3) -30~75 -40~85 -55~150 C C W UNIT V mA / ch V mA V mA
Note 1: Except TD62001P / AP / F / AF Note 2: Only TD62001P / AP / F / AF Note 3: On glass epoxy PCB (30 x 30 x 1.6 mm Cu 50%)
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RECOMMENDED OPERATING CONDITIONS
CHARACTERISTIC Output Sustaining Voltage P, F AP, AF AP Tpw = 25 ms 7 Circuits Ta = 85C Tj = 120C SYMBOL VCE (SUS) Duty = 10% Duty = 50% IOUT Duty = 10% Duty = 50% Duty = 10% Duty = 50% VIN
(Ta = -40~85C and Ta = -30~75C for only Type-P)
CONDITION MIN 0 0 0 0 0 0 0 0 0 14.5 VIN (ON) IOUT = 400 mA hFE = 800 2.8 6.2 0 VIN (OFF) 0 0 0 IIN VR IF P Power Dissipation AP AF, F PD Ta = 85C Ta = 85C (Note) 0 TYP. MAX 35 50 370 130 295 95 233 70 24 24 24 24 0.6 7.4 0.7 1.0 10 35 50 350 0.6 0.76 0.325 W mA V mA V V V mA / ch UNIT V
Output Current
P
F, AF Except TD62001P / AP / F / AF TD62002 Input Voltage (Output On) TD62003 TD62004 TD62001 Input Voltage (Output Off) TD62002 TD62003 TD62004 Input Current Clamp Diode Reverse Voltage Clamp Diode Forward Current Only TD62001 P, F AP, AF
Input Voltage
Note:
On glass epoxy PCB (30 x 30 x 1.6 mm Cu 50%)
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ELECTRICAL CHARACTERISTICS (Ta = 25C unless otherwise noted)
CHARACTERISTIC SYMBOL TEST CIR- CUIT TEST CONDITION VCE = 50 V, Ta = 25C VCE = 50 V, Ta = 85C ICEX 1 VCE = 35 V, Ta = 25C VCE = 35 V, Ta = 85C VCE = 35 V, Ta = 25C VCE = 35 V, Ta = 75C IOUT = 350 mA, IIN = 500 A Collector-Emitter Saturation Voltage VCE (sat) 2 IOUT = 200 mA, IIN = 350 A IOUT = 100 mA, IIN = 250 A DC Current Transfer Ratio TD62002 Input Current (Output On) TD62003 TD62004 Input Current (Output Off) P AP, F, AF TD62002 Input Voltage (Output On) VCE = 2 V hFE = 800 IIN (OFF) 4 IIN (ON) 3 hFE 2 VCE = 2 V, IOUT = 350 mA VIN = 20 V, IOUT = 350 mA VIN = 2.4 V, IOUT = 350 mA VIN = 9.5 V, IOUT = 350 mA IOUT = 500 A, Ta = 75C IOUT = 500 A, Ta = 85C IOUT = 350 mA IOUT = 200 mA VIN (ON) 5 IOUT = 350 mA IOUT = 200 mA IOUT = 350 mA IOUT = 200 mA VR = 50 V, Ta = 25C VR = 50 V, Ta = 85C IR 6 VR = 35 V, Ta = 25C VR = 35 V, Ta = 85C VR = 35 V, Ta = 25C VR = 35 V, Ta = 75C VF CIN P, F Turn-On Delay AP, AF P, F Turn-Off Delay AP, AF tOFF 8 tON 8 7 VOUT = 35 V, RL = 87.5 CL = 15 pF VOUT = 50 V, RL = 125 CL = 15 pF VOUT = 35 V, RL = 87.5 CL = 15 pF VOUT = 50 V, RL = 125 CL = 15 pF IF = 350 mA MIN 1000 50 50 TYP. 1.3 1.1 0.9 1.1 0.4 0.8 65 65 15 0.1 0.1 0.2 0.2 MAX 50 100 50 100 50 100 1.6 1.3 1.1 1.7 0.7 1.2 13.7 11.4 2.6 2.0 4.7 4.4 50 100 50 100 50 100 2.0 s V pF A V A mA V A UNIT
AP, AF Output Leakage Current
F
P
TD62003
TD62004
AP, AF Clamp Diode Reverse Current
F
P Clamp Diode Forward Voltage Input Capacitance
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TEST CIRCUIT
1. ICEX 2. VCE (sat), hFE 3.
IIN (ON)
4.
IIN (OFF)
5.
VIN (ON)
6.
IR
7.
VF
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8. tON, tOFF
Note 1: Pulse width 50 s, duty cycle 10% Output impedance 50 , tr 5 ns, tf 10 ns Note 2: See below INPUT CONDITION
TYPE NUMBER TD62001P / AP / F / AF TD62002P / AP / F / AF TD62003P / AP / F / AF TD62004P / AP / F / AF R1 2.7 k 0 0 0 VIH 3V 13 V 3V 8V
Note 3: CL includes probe and jig capacitance.
PRECAUTIONS for USING
This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
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PACKAGE DIMENSIONS
DIP16-P-300-2.54A Unit : mm
Weight: 1.11 g (Typ.)
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PACKAGE DIMENSIONS
SOP16-P-225-1.27 Unit : mm
Weight: 0.16 g (Typ.)
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RESTRICTIONS ON PRODUCT USE
000707EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
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