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| DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC4092 J-FET INPUT LOW-OFFSET DUAL OPERATIONAL AMPLIFIER The PC4092 dual operational amplifier offers high input impedance, low offset voltage, high slew rate, and stable AC operating characteristics. NEC's unique high-speed PNP transistor (fT = 300 MHz) in the output stage solves the oscillation problem of current sinking with a large capacitive load. Zener-zap resistor trimming in the input stage produces excellent offset voltage and temperature drift characteristics. FEATURES * Stable operation with 10000 pF capacitive load * Low input offset voltage 3 mV (MAX.) 7 V/C (TYP.) temperature drift * Very low input bias and offset currents * Low noise : en = 19 nV/ Hz (TYP.) * Output short circuit protection * High input impedance ... J-FET Input Stage * Internal frequency compensation * High slew rate: 15 V/s (TYP.) ORDERING INFORMATION Part Number Package 8-pin plastic DIP (300 mil) 8-pin plastic SOP (225 mil) PC4092C PC4092G2 EQUIVALENT CIRCUIT (1/2 Circuit) + PIN CONFIGURATION (Top View) V PC4092C, 4092G2 Q9 Q6 II Q1 Q2 C1 Q5 Q3 Q4 Q8 TRIMMED - OUT1 1 1 -+ 8 V + Q7 OUT HIGH SPEED Q10 PNP II1 2 2 +- 7 OUT2 IN D1 IN1 3 6 II2 V - 4 5 IN2 V The information in this document is subject to change without notice. Document No. G13905EJ1V0DS00 (1st edition) Date Published December 1998 N CP(K) Printed in Japan (c) 1998 PC4092 ABSOLUTE MAXIMUM RATINGS (TA = 25 C) Parameter Voltage between V and V Differential Input Voltage Input Voltage Note 2 + -Note 1 + Symbol V -V VID VI VO - - Ratings -0.3 to +36 30 V -0.3 to V +0.3 V -0.3 to V +0.3 350 440 Indefinite - Unit V V + V V mW mW sec C C Output Voltage Note 3 + Power Dissipation C Package Note 4 PT G2 Package Output Short Circuit Duration Note 6 Note 5 Operating Ambient Temperature Storage Temperature TA Tstg -20 to +80 -55 to +125 Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is -5.0 mV/C when operating ambient temperature is higher than 55 C. 5. Thermal derating factor is -4.4 mV/C when operating ambient temperature is higher than 25 C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Output Current Capacitive Load (AV = +1, Rf = 0 ) V IO CL Symbol MIN. 5 TYP. MAX. 16 10 10000 Unit V mA pF 2 PC4092 ELECTRICAL CHARACTERISTICS (TA = 25 C, V = 15 V) Parameter Input Offset Voltage Input Offset Current Input Bias Current Note 7 Symbol VIO IIO IB AV ICC CMR SVR Vom RS 50 Conditions MIN. TYP. 1 25 50 MAX. 3 100 200 Unit mV pA pA Note 7 Large Signal Voltage Gain Supply Current Common Mode Rejection Ratio Supply Voltage Rejection Ratio Output Voltage Swing RL 2 k , VO = 10 V IO = 0 A, Both Amplifiers 25000 200000 5 6.8 mA dB dB V 70 70 RL 10 k 12 100 100 +14.0 -13.3 RL 2 k 10 +13.5 -12.8 V Common Model Input Voltage Range VICM 11 +14 -12 V Slew Rate Unity Gain Frequency Input Equivalent Noise Voltage Density Channel Separation Input Offset Voltage Average VIO Temperature Drift Input Offset Current Input Bias Current Note 7 SR funity en AV = 1 15 4 V/s MHz nV/Hz dB 5 mV RS = 100 , f = 1 kHz 19 120 VIO VIO/T IIO IB RS 50 , TA = -20 to +70 C TA = -20 to +70 C TA = -20 to +70 C TA = -20 to +70 C 7 V/C 2 7 nA nA Note 7 Notes 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the junction temperature close to the operating ambient temperature. 3 PC4092 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 C, TYP.) POWER DISSIPATION 600 PT - Total Power Dissipation - mW OPEN LOOP FREQUENCY RESPONSE 120 AV - Open Loop Voltage Gain - dB 500 400 300 200 100 PC4092G2 PC4092C 200 C/W 100 80 60 40 20 0 1 10 100 1k V = 15 V RL = 2 k 227 C/W 0 20 40 60 80 100 TA - Operating Ambient Temperature - C 10 k 100 k 1 M 10 M f - Frequency - Hz INPUT OFFSET VOLTAGE 5 4 VIO - Input Offset Voltage - mV INPUT BIAS CURRENT 100 V = 15 V V = 15 V IB - Input Bias Current - nA 3 2 1 0 -1 -2 -3 -4 -5 -40 -20 0 20 40 60 80 10 1.0 0.1 0.01 -20 0 20 40 60 80 TA - Operating Ambient Temperature - C TA - Operating Ambient Temperature - C LARGE SIGNAL FREQUENCY RESPONSE 30 Vom - Output Voltage Swing - Vp-p Vom - Output Voltage Swing - Vp-p OUTPUT VOLTAGE SWING 40 RL = 10 k 30 V = 15 V RL = 10 k 20 V = 10 V 20 10 V = 5 V 10 0 100 1k 10 k 100 k 1M 10 M 0 V 10 - Supply Voltage - V 20 f - Frequency - Hz 4 PC4092 OUTPUT SOURCE CURRENT LIMIT +15 VO+ - Output Voltage - V OUTPUT SINK CURRENT LIMIT -15 VO- - Output Voltage - V V = 15 V V = 15 V +10 TA = 70 C 25 C -10 TA = 70 C 25 C +5 -20 C -5 -20 C 0 10 20 30 0 10 20 30 IO SOURCE - Output Source Current - mA IO SINK - Output Sink Current - mA SUPPLY CURRENT 7 6 ICC - Supply Current - mA en - Input Equivalent Noise Voltage Density - nV/ Hz INPUT EQUIVALENT NOISE VOLTAGE DENSITY 50 V = 15 V RS = 100 40 5 4 3 2 1 0 5 V 10 15 20 30 20 10 0 10 100 1k f - Frequency - Hz 10k 100k - Supply Voltage - V VOLTAGE FOLLOWER PULSE RESPONSE 1 (V = 15 V, AV = +1) (RL = 2 k, CL = 100 pF) VOLTAGE FOLLOWER PULSE RESPONSE 2 (V = 15 V, AV = +1) (RL = 2 k, CL = 10000 pF) VO - Output Voltage - V 10 VO - Output Voltage - V 10 0 0 -10 -10 0 2 4 6 0 20 40 60 t - Time - s t - Time - s 5 PC4092 PACKAGE DRAWINGS 8PIN PLASTIC DIP (300 mil) 8 5 1 A I 4 K P L J H G F D N M C B M R NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. ITEM A B C D F G H I J K L M N P R MILLIMETERS 10.16 MAX. 1.27 MAX. 2.54 (T.P.) 0.500.10 1.4 MIN. 3.20.3 0.51 MIN. 4.31 MAX. 5.08 MAX. 7.62 (T.P.) 6.4 0.25 +0.10 -0.05 0.25 0.9 MIN. 0~15 INCHES 0.400 MAX. 0.050 MAX. 0.100 (T.P.) 0.020 +0.004 -0.005 0.055 MIN. 0.1260.012 0.020 MIN. 0.170 MAX. 0.200 MAX. 0.300 (T.P.) 0.252 0.010 +0.004 -0.003 0.01 0.035 MIN. 0~15 P8C-100-300B,C-1 6 PC4092 8 PIN PLASTIC SOP (225 mil) 8 5 detail of lead end P 1 A 4 H F G I J S B E D NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. L K N S C M M ITEM A B C D E F G H I J K L M N P MILLIMETERS 5.2 +0.17 -0.20 0.78 MAX. 1.27 (T.P.) 0.42 +0.08 -0.07 0.10.1 1.590.21 1.49 6.50.3 4.40.15 1.10.2 0.17 +0.08 -0.07 0.60.2 0.12 0.10 +7 3 -3 S8GM-50-225B-5 7 PC4092 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"(C10535E). Type of Surface Mount Device If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult PC4092G2: 8-pin plastic SOP (225 mil) Process Infrared Ray Reflow Conditions Peak temperature: 230 C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 C or higher), Maximum number of reflow processes: 1 time. Vapor Phase Soldering Peak temperature: 215 C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 C or higher), Maximum number of reflow processes: 1 time. Wave Soldering Solder temperature: 260 C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 C or below (Package surface temperature). Partial Heating Method Pin temperature: 300 C or below, Heat time: 3 seconds or less (Per each side of the device). - WS60-00-1 VP15-00-1 Symbol IR30-00-1 Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device PC4092C: 8-pin plastic DIP (300 mil) Process Wave Soldering (only to leads) Partial Heating Method Solder temperature: 260 C or below, Flow time: 10 seconds or less. Pin temperature: 300 C or below, Heat time: 3 seconds or less (per each lead). Conditions Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 8 PC4092 REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL NEC IC PACKAGE MANUAL (CD-ROM) GUIDE TO QUALITY ASSURANCE FOR SEMICONDUCTOR DEVICES SEMICONDUCTORS SELECTION GUIDE NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM (STANDARD LINEAR IC) C11531E C10535E C13388E MEI-1202 X10679E IEI-1212 9 PC4092 [MEMO] 10 PC4092 [MEMO] 11 PC4092 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5 |
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