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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8129GR
UP CONVERTER WITH AGC FUNCTION + QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS
DESCRIPTION
The PC8129GR is a silicon monolithic integrated circuit designed as indirect quadrature modulator for digital mobile communication systems. This modulator consists of 0.8 GHz to 1.9 GHz up-converter and 100 MHz to 400 MHz quadrature modulator which are packaged in 20 pin SSOP. The device has power save function and can operate 2.7 to 5.5 V supply voltage, therefore, it can contribute to make RF block small, high performance and low power consumption.
FEATURES
* High linearity up converter is incorporated; PRFout = -5 dBm TYP./@fRFout = 900 MHz * Wide operating frequency range. Up converter ; fRFout = 800 MHz to 1900 MHz Modulator ; fLO1in = 200 MHz to 800 MHz fMODout = 100 MHz to 400 MHz, fI/Q = DC to 10 MHz * External IF filter can be applied between modulator output and up converter input terminal. * Low phase difference due to digital phase shifter is adopted. * Supply voltage: VCC = 2.7 to 5.5 V * Equipped with power save function. * 20 pin SSOP suitable for high density surface mounting.
APPLICATIONS
* Digital cellular phones (ex. GSM etc...) * Digital cordless phones
ORDERING INFORMATION
PART NUMBER PACKAGE 20 pin plastic SSOP (225 mil) SUPPLYING FORM Embossed tape 12 mm wide. QTY 2.5 kp/Reel. Pins 1 through 10 are in pull-out direction.
PC8129GR-E1
* To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
PC8129GR)
Caution electro-static sensitive device
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P12781EJ2V0DS00 (2nd edition) Date Published October 1999 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
1997, 1999
PC8129GR
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS
Up-Con in
1
Reg.
20
VCC (MOD)
Up-Con inb
2
19
VCC (Up-con)
MODout
3
18
RFout
I
4
17
GND
Ib
5
16
VPS
Qb
6
15
VAGC
Q
7
14
GND
LO1 in
8
13
LO2 in
LO1 inb
9 90deg. Phase Shifter ( 2)
12
LO2 inb
GND
10
11
GND
QUADRATURE MODULATOR SERIES PRODUCT
ICC (mA) fLO1in (MHz) fMODout RF Mixer (MHz) fRFout (MHz) External Phase Shifter F/F
Part Number
Functions 150 MHz Quad.Mod RF Up-Converter + IF Quad.Mod 400 MHz Quad.Mod
Package
Application
PC8101GR PC8104GR PC8105GR PC8110GR PC8125GR PC8126GR PC8126K PC8129GR
15/@2.7 V 100 to 300 50 to 150 28/@3.0 V 100 to 400
CT-2 etc. 20-pin SSOP (225 mil) 900 to 1 900 Doubler Digital Comm. + F/F External 16-pin SSOP (225 mil) 20-pin PDC800 MHz, etc. SSOP (225 mil) PHS
16/@3.0 V
100 to 400
1 GHz Direct Quad.Mod RF Up-Converter + IF Quad.Mod + AGC
24/@3.0 V 36/@3.0 V
800 to 1 000 220 to 270
External 1 800 to 2 000
900 MHz Direct Quad.Mod 35/@3.0 V with Offset-Mixer x2LO IF Quad. Mod+RF Up-Converter
915 to 960 889 to 960
915 to 960 889 to 960 F/F 28-pin QFN
PDC800 MHz
28/@3.0 V 200 to 800 100 to 400 800 to 1 900
20-pin GSM, SSOP (225 mil) DCS1800, etc. 30-pin PHS TSSOP (225 mil)
PC8139GR-7JH Transceiver IC (1.9 GHz Indirect Quad. Mod + RX-IF + IF VCO)
PC8158K
RF Up-Converter + IF Quad.Mod + AGC
TX: 32.5 RX: 4.8 /@3.0 V 28/@3.0 V
220 to 270
1 800 to 2 000
CR
100 to 300
800 to 1 500
28-pin QFN
PDC800 M/1.5 G
2
Data Sheet P12781EJ2V0DS00
PC8129GR
APPLICATION EXAMPLE
[GSM]
SUB ANT RX SW MAIN ANT 1st. LO 2nd. LO SW SW PLL1 PLL2 LNA 1st MIX 2nd MIX DEMO. I Q
AGC
I 0
TX PA MODout = fLO/2
(F/F)
90
fLO
Q
PC8129GR
Data Sheet P12781EJ2V0DS00
3
PC8129GR
ABSOLUTE MAXIMUM RATINGS
PARAMETER Supply Voltage Power Save Voltage AGC Control Voltage IQ DC Offset Voltage Power Dissipation Operating Ambient Temperature Storage Temperature SYMBOL VCC VPS VAGC IQ (DC) PD TA Tstg RATING 6.0 6.0 6.0 4.0 430 -40 to +85 -55 to +150 UNIT V V V V mW C C TA = +85 C
Note
CONDITION TA = +25 C
Note Mounted on double sided copper clad 50 x 50 x 1.6 mm epoxy glass PWB.
RECOMMENDED OPERATING CONDITIONS
PARAMETER Supply Voltage Operating Ambient Temperature Up Converter RF Frequency Up Converter Input Freq. Modulator Output Frequency LO1 Input Frequency LO1 Input Level LO2 Input Frequency LO2 Input Level I/Q Input Frequency I/Q Input Amplitude SYMBOL VCC TA fRFout fUPCONin fMODout fLO1in PLO1in fLO2in PLO2in fI/Qin VI/Qin 200 -15 800 -15 DC -10 -10 800 -5 1800 -5 10 600 MHz dBm MHz dBm MHz mVP-P Single ended Input MIN. 2.7 -40 800 100 TYP. 3.0 +25 MAX. 5.5 +85 1900 400 UNIT V C MHz MHz CONDITIONS
4
Data Sheet P12781EJ2V0DS00
PC8129GR
ELECTRICAL CHARACTERISTICS (1)
Conditions (unless otherwise specified): TA = +25 C, VCC = 3 V, VPS = 3 V, RPS = 1 k, VAGC = 3 V, RAGC = 10 k I/Q DC = 1.5 V (Vbias(I) = Vbias(Ib) = Vbias (Q) = Vbias (Qb) = 1.5 V) fI/Qin = 67.7 kHz, VI/Qin = 500 mVP-P (single ended input, Ib = Qb = 0 mVP-P) Modulation Pattern: <0000> fLO1in = 500 MHz, PLO1in = -10 dBm fLO2in = 1150 MHz, PLO2in = -10 dBm fUPCONin = fMODout = fLO1in/2 + fI/Qin = 250 MHz + fI/Qin fRFout = 900 MHz - fI/Qin
PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS
UP CONVERTER + QUADRATURE MODULATOR TOTAL Total Circuit Current Total Circuit Current at Power Save Mode Total Output Power Local Oscillator Carrier Leakage Image Rejection (Side Band Leak) AGC Gain Control Rang Power Save Rise Time Power Save Fall Time UP CONVERTER BLOCK Circuit Current at Power Save Mode ICC(PS) (Up con.) 5.0 ICC(TOTAL) ICC(PS)TOTAL1 20 28 0.6 37 10 mA No input signal VPS 0.5 V
A
dBm dBc dBc dB
PRFout LoL ImR GCR TPS(rise) TPS(fall)
-8
-5 -40 -30
-2 -26.5 -26.5
fLoL = fLO2 - fLO1/2
28
40 2.0 2.0 5.0 5.0
VAGC = 2.5 V to 0 V VPS(Low) VPS(High) VPS(High) VPS(Low)
s s
A
VPS 0.5 V
QUADRATURE MODULATOR BLOCK Circuit Current at Power Save Mode ICC(PS) (MOD) 5.0
A
VPS 0.5 V
Data Sheet P12781EJ2V0DS00
5
PC8129GR
STANDARD CHARACTERISTICS FOR REFERENCE (1)
Conditions (unless otherwise specified): TA = +25 C, VCC = 3 V, VPS = 3 V, RPS = 1 k, VAGC = 3 V, RAGC = 10 k I/Q DC = 1.5 V (Vbias(I) = Vbias(Ib) = Vbias (Q) = Vbias (Qb) = 1.5 V) fI/Qin = 67.7 kHz, PI/Qin = 500 mVP-P (single ended input, Ib = Qb = 0 mVP-P) Modulation Pattern: <0000> fLO1in = 500 MHz, PLO1in = -10 dBm fLO2in = 1150 MHz, PLO2in = -10 dBm fUPCONin = fMODout = fLO1in/2 + fI/Qin = 250 MHz + fI/Qin fRFout = 900 MHz - fI/Qin
PARAMETER SYMBOL REFERENCE UNIT TEST CONDITIONS
UP CONVERTER + QUADRATURE MODULATOR TOTAL Total Circuit Current at Power-Save Mode Phase Error UP CONVERTER BLOCK UP Con. Circuit Current UP Con. Circuit Current at Power-Save Mode Conversion Gain Maximum Output Power Output 3rd Order Intercept Point QUADRATURE MODULATOR BLOCK MOD. Circuit Current Output Power LO1 Carrier Leakage Image Rejection (Side Band Leak) I/Q 3rd Order Intermodulation Distortion I/Q Input Impedance IQ Bias Current LO1 Input VSWR Output Noise Floor ICC(MOD) PMODout LoL ImR IM3I/Q ZI/Q II/Q VSWR(Lo1) 14 -16.5 -40 -30 -50 200 5 1.2 : 1 -133 mA dBm dBc dBc dBc k I to Ib, Q to Qb I, Ib, Q, Qb to GND (each) fLoL = fLO1/2 No input signal ICC(UpCon) ICC(PS)UpCon 14 60 mA No input signal VPS 0.5 V, VAGC = 0 V ICC(PS)TOTAL2 60
A
deg. (rms)
VPS 0.5 V, VAGC = 0 V
1.8
MOD Pattern: PN9
A
dB dBm dBm
CG PRF(sat) OIP3
12 -1.5 +6
PUPCONin = -20 dBm PUPCONin = -4 dBm fUPCONin = 250.0 MHz/250.2 MHz
A
- dBc/Hz
f = 20 MHz
6
Data Sheet P12781EJ2V0DS00
PC8129GR
STANDARD CHARACTERISTICS FOR REFERENCE (2)
Conditions (unless otherwise specified): TA = +25 C, VCC = 3 V, VPS = 3 V, RPS = 1 k, VAGC = 3 V, RAGC = 10 k I/Q DC = 1.5 V (Vbias(I) = Vbias(Ib) = Vbias (Q) = Vbias (Qb) = 1.5 V) fI/Qin = 67.7 kHz, PI/Qin = 500 mVP-P (single ended input, Ib = Qb = 0 mVP-P) Modulation Pattern: <0000> fLO1in = 500 MHz, PLO1in = -10 dBm fLO2in = 1650 MHz, PLO2in = -10 dBm fUPCONin = fMODout = fLO1in/2 + fI/Qin = 250 MHz + fI/Qin fRFout = 1900 MHz + fI/Qin
PARAMETER SYMBOL REFERENCE UNIT TEST CONDITIONS
UP CONVERTER + QUADRATURE MODULATOR TOTAL Total Output Power Local Oscillator Carrier Leakage Image Rejection (Side Band Leak) AGC Gain Control Rang Phase Error UP CONVERTER BLOCK Conversion Gain Maximum Output Power Output Intercept Point CG PRF(sat) OIP3 5 -7 -1 dB dBm dBm PUPCONin = -20 dBm PUPCONin = -4 dBm fUPCONin = 250.0 MHz/250.2 MHz PRFout LoL ImR GCR -12 -40 -30 45 1.8 dBm dBc dBc dB deg. (rms) VAGC = 2.5 V to 0 V MOD Pattern: PN9 fLoL = fLO2 + fLO1/2
Data Sheet P12781EJ2V0DS00
7
PC8129GR
PIN EXPLANATION
Supply Voltage (V) VCC - Pin Voltage Typ. (V) @VCC = 3 V - 2.2
Pin No.
Symbol
Description
Equivalent Circuit
18 1
RFout UpCon in
RF output from Up-Converter. This pin is open collector output.
18
IF input for Up-converter. This pin is high impedance input. Bypass of IF input. Grounded through external capacitor. Output from modulator. This is emitter follower output.
3
2
UpCon inb
-
2.2
1
2
3
MODout
-
1.9
4
I
VCC/2
-
Input for I signal. This input impedance is about 200 k. Relations between amplitude and VCC/2 bias of input signal are following. VCC/2 (V) 1.35 1.5 1.75 Signal Level (mVP-P) 400 600 1000 Note
4 5
5
Ib
VCC/2
-
Input for I signal. This input impedance is about 200 k. VCC/2 biased DC signal should be input. Input for Q signal. This input impedance is about 200 k VCC/2 biased DC signal should be input. Input for Q signal. This input impedance is about 200 k. Relations between amplitude and VCC/2 bias of input signal are following. VCC/2 (V) 1.35 1.5 1.75 Signal Level (mVP-P) 400 600 1000 Note
6
Qb
VCC/2
-
7
Q
VCC/2
-
7
6
Note In the case of that I/Q input signals are single ended. Of course, I/Q signal inputs can be used either single endedly or differentially with proper terminations.
8
Data Sheet P12781EJ2V0DS00
PC8129GR
PIN EXPLANATION
Supply Voltage (V) - Pin Voltage Typ. (V) @VCC = 3 V 0
Pin No.
Symbol
Description
Equivalent Circuit
8
LO1in
Lo1 input for phase shifter. This input impedance is 50 matched internally. Bypass of Lo1 input. This pin is grounded through internal capacitor.
8
50
9
LO1in b
-
2.3
9
10 11 12
GND for Modulator
0
-
Connect to the ground with minimum inductance. Track length should be kept as short as possible. Bypass of Lo2 input. Grounded through external capacitor. Lo2 input of Up-converter. This pin is high impedance input. Connect to the ground with minimum inductance. Track length should be kept as short as possible. Input for AGC amplifier. Total Output Power can be controlled by changing input voltage. And as external series resistance (RAGC) connecting, a slope of AGC curve can be changed by the resistance (RAGC). Power save control pin can be controlled ON/OFF state with bias as follows; VPS (V) 2 to VCC 0 to 0.5 STATE ON (Active Mode) OFF (Sleep Mode)
13
LO2in b
-
1.9
13
LO2in
-
1.9
12
14 17 15
GND for Up-con.
0
-
VAGC
0 to VCC
-
16
Power Save
0 to VCC
-
16
19
VCC for Upconverter VCC for Modulator
2.7 to 5.5
-
Supply voltage pin for Upconverter. Supply voltage pin for modulator. Internal regulator can be kept stable condition of supply bias against the variable temperature or VCC.
20
2.7 to 5.5
-
: Externally
Data Sheet P12781EJ2V0DS00
9
PC8129GR
STANDARD TYPICAL CHARACTERISTICS
Test Circuit 1, TA = +25 C, VCC = 3 V, VPS = 3 V, RPS = 1 k, VAGC = 3 V, RAGC = 10 k I/Q DC = 1.5 V (Vbias(I) = Vbias(Ib) = Vbias(Q) = Vbias(Qb) = 1.5 V) fI/Qin = 67.7 kHz, VI/Qin = 500 mVP-P (single ended input, Ib = Qb = 0 mVP-P) Modulation Pattern: All Zero <0000>, fLO1in = 500 MHz, PLO1in = -10 dBm fLO2in = 1150 MHz, PLO2in = -10 dBm, fUPCONin = fMODout = fLO1in/2 + fI/Qin = 250 MHz + fI/Qin fRFout = 900 MHz - fI/Qin, Unless Otherwise Specified
ICC (TOTAL) vs VCC ICC (TOTAL) vs VPS
No input signal
ICC - Total Circuit Current - mA
40
30
ICC - Total Circuit Current - mA
30
20
20
10
10
: TA = +25 C : TA = +85 C : TA = -40 C No input signal 0 1 2 3
0
0
1
2
3
4
5
6
0
VCC - Supply Voltage - V
VPS - Power Save Control Voltage - V
ICC (TOTAL) vs TA
ICC - Total Circuit Current at Power Save Mode - A
ICC (PS) TOTAL vs TA
No input signal
ICC - Total Circuit Current - mA
30
No input signal Vps = 0.5 V 30
20
20
10
10
0
-40
-20
0
+20
+40
+60
+80
0
-40
-20
0
+20
+40
+60
+80
TA - Operating Ambient Temperature - C
TA - Operating Ambient Temperature - C
10
Data Sheet P12781EJ2V0DS00
PC8129GR
ICC (PS) TOTAL2 vs TA
ICC - Total Circuit Current at Power Save Mode - A ICC - Total Circuit Current at Power Save Mode - A
ICC (PS) TOTAL1 vs VCC
150 125 100 75 50 25 0 No input signal Vps = 0.5 V VAGC = 0 V
2
No input signal Vps = 0.5 V
1
-40
-20
0
+20
+40
+60
+80
0
0
2
4
6
TA - Operating Ambient Temperature - C
VCC - Supply Voltage - V
ICC (PS) TOTAL2 vs VCC
ICC - Total Circuit Current at Power Save Mode - A
150 125 100 75 50 25 0 No input signal Vps = 0.5 V VAGC = 0 V
0
2
4
6
VCC - Supply Voltage - V
PRFout, LoL, ImR, IM3I/Q vs VCC
LoL - Local Oscillator Carrier Leakage - dBc ImR - Image Rejection - dBc IM3I/Q - I/Q 3rd Order Intermodulation Distortion - dBc
PRFout, LoL, ImR, IM3I/Q vs TA 0
PRFout - Total Output Power - dBm
-20 PRFout ImR
PRFout - Total Output Power - dBm
0 PRFout ImR -10
-20
-10
-30
-30
LoL -20 IM3I/Q -30 -50 -40
-20 LoL
IM3I/Q
-40
0
1
2
3
4
5
6
-40 -20
0
+20 +40 +60 +80
-50
VCC - Supply Voltage - V
TA - Operating Ambient Temperature - C
Data Sheet P12781EJ2V0DS00
LoL - Local Oscillator Carrier Leakage - dBc ImR - Image Rejection - dBc IM3I/Q - I/Q 3rd Order Intermodulation Distortion - dBc
11
PC8129GR
PRFout, LoL, ImR, IM3I/Q vs VI/Qin
LoL - Local Oscillator Carrier Leakage - dBc ImR - Image Rejection - dBc IM3I/O - I/Q 3rd Order Intermodulation Distortion - dBc LoL - Local Oscillator Carrier Leakage - dBc ImR - Image Rejection - dBc IM3I/O - I/Q 3rd Order Intermodulation Distortion - dBc
PRFout, LoL, ImR, IM3I/Q vs PLO1in
PRFout - Total Output Power - dBm
0 -10 -20 -30 -40
LoL ImR PRFout
-20 -30 -40 -50 -60
PRFout ImR LoL -10
-30
-40 IM3I/Q -50 -30 -20 -10 0
-20
IM3I/Q 100 500 1000 2000 -70
-30 +10
VI/Qin - I/Q Input Amplitude - mVp-p
PLO1in - LO1 Input Level - dBm
PRFout vs PLO2in 7
vs VI/Qin
MOD Pattern: PN9
PRFout - Total Output Power - dBm
0
- Phase Error - deg. (rms.)
6 5 4 3 2 1
-10
-20
-30
-40 -40
-30
-20
-10
0
0
100
500
1000
PLO2in - LO2 Input Level - dBm
VI/Qin - I/Q Input Amplitude - mVP-P
PRFout vs VAGC +10
PRFout - Total Output Power - dBm PRFout - Total Output Power - dBm
PRFout vs VAGC
0 -10 -20 -30 -40 -50 -60 -70 0 1 2 3 TA = +85 C
+25 C
0 -10
VCC = 2.7 V
-20 -30 -40 -50 -60
GCR = 40.5 dB (VCC = 2.7 V)
VCC = 3 V
VCC = 5.5 V
GCR = 40.8 dB (VCC = 3 V)
GCR = 41.7 dB (VCC = 5.5 V)
-40 C
0
1
2
3
4
5
6
VAGC - AGC Control Voltage - V
VAGC - AGC Control Voltage - V
12
Data Sheet P12781EJ2V0DS00
PRFout - Total Output Power - dBm
-20
0
PC8129GR
PRFout vs VAGC +10
PC8129GR REF 0.0 dBm 10 dB/
POWER SAVE RESPONSE
ATT 10dB
PRFout - Total Output Power - dBm
0
dB/V = 143 RAGC = 10 k, SLOPE
-40 -50 -60
RA
GC
-30
=8 0k
,
-20
SL OP
E=
-10
53 dB /V
GCR = 39.8 dB
RBW 3 MHz VBW 3 MHz
0
1
2
3
SWP 50 s
CENTER 900.0677 MHz
SPAN 0 Hz
VAGC - AGC Control Voltage - V
PC8129GR REF 0.0 dBm 10 dB/
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM 1 ATT 10 dB
TYPICAL GMSK MODULATION OUTPUT SPECTRUM
PC8129GR REF -10.0 dBm 10 dB/
ATT 0 dB
A write B view MARKER 899.200 MHz -77.25 dB
3 4 2
3 DL -10.0 dBm 1 RBW 3 kHz VBW 10 kHz SWP 1.0 s CENTER 900.0000 MHz SPAN 500 KHz *** Multi Marker List *** No.1: 899.9323 MHz -4.80 dBm No.2: 900.0000 MHz -48.02 dBc No.3: 900.0677 MHz -29.88 dBc No.4: 900.2031 MHz -42.41 dBc RBW 3 kHz VBW 10 kHz SWP 5.0 s CENTER 900. 000 MHz
No.1: No.2: No.3: No.4: No.5: No.6: : *** Multi Marker List *** 899.200 MHz -77.25 dB 899.400 MHz -76.50 dB 899.600 MHz -68.00 dB 900.400 MHz -68.25 dB 900.600 MHz -77.50 dB 900.800 MHz -77.50 dB
ADJ BS 135 kHz
4 5 6
2
SPAN 2.000 MHz
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM
PC8129GR REF 0.0 dBm 10 dB/
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM (IN BAND)
PC8129GR REF 0.0 dBm 10 dB/
MKR 900 MHz
ATT 10 dB
MARKER 900 MHz -4.67 dBm
2 fLO1in (= fIF) fLO1in (= 2fIF) 1
ATT 10 dB
MARKER 900 MHz -4.68 dBm
fLO2in fLO1in (= 3fIF) 2 fLO1in (= 4fIF)
fLO1in (= 5fIF)
5 2
3 2
750 MHz -43.6 dBm
800 MHz -49.5 dBm 850 MHz -56.6 dBm
1000 MHz -53.0 dBm 950 MHz -68.2 dBm 1050 MHz -59.4 dBm
RBW 300 kHz VBW 300 kHz SWP 5.0 s START 0 Hz STOP 2.460 GHz
RBW 300 kHz VBW 300 kHz SWP 5.0 s CENTER 900.0 MHz SPAN 400.0 MHz
Data Sheet P12781EJ2V0DS00
13
PC8129GR
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM (IN BAND)
PC8129GR REF 0.0 dBm 10 dB/
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM (IN BAND)
PC8129GR REF 0.0 dBm 10 dB/
ATT 10 dB
fLO1in = 500 MHz (fMODout = 250 MHz + fI/Q) fLO2 = 1130 MHz fRFout = 880 MHz
ATT 10 dB
MARKER 900 MHz -4.66 dBm
MARKER 880.0 MHz -4.64 dBm
MKR 900 MHz
870 MHz -55.7 dBm 890 MHz -63.0 dBm
1010 MHz -57.6 dBm 1000 MHz -54.8 dBm
850 MHz -56.2 dBm 950 MHz -65.5 dBm
1000 MHz -53.0 dBm
RBW 300 kHz VBW 300 kHz SWP 5.0 s CENTER 920.0 MHz SPAN 200.0 MHz
RBW 300 kHz VBW 300 kHz SWP 5.0 s CENTER 920.0 MHz SPAN 200.0 MHz
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM (IN BAND)
PC8129GR REF 0.0 dBm 10 dB/
ATT 10 dB
fLO1in = 500 MHz (fMODout = 250 MHz + fI/Qin) fLO2in = 1210 MHz fRFout = 960 MHz - fI/Qin
MARKER 900 MHz -7.41 dBm
MKR 900 MHz
920 MHz -51.5 dBm 880 MHz -59.9 dBm
1000 MHz -49.9 dBm
RBW 300 kHz VBW 300 kHz SWP 5.0 s CENTER 920.0 MHz SPAN 200.0 MHz
14
Data Sheet P12781EJ2V0DS00
PC8129GR
STANDARD TYPICAL CHARACTERISTICS
Test Circuit 2, TA = +25 C, VCC = 3 V, VPS = 3 V, RPS = 1 k, VAGC = 3 V, RAGC = 10 k I/Q DC = 1.5 V (Vbias(I) = Vbias(Ib) = Vbias(Q) = Vbias(Qb) = 1.5 V) fI/Qin = 67.7 kHz, VI/Qin = 500 mVP-P (single ended input, Ib = Qb = 0 mVP-P) Modulation Pattern: All Zero <0000>, fLO1in = 500 MHz, PLO1in = -10 dBm fLO2in = 500 MHz, PLO2in = -10 dBm, fUPCONin = fMODout = fLO1in/2 + fI/Qin = 250 MHz + fI/Qin fRFout = 1900 MHz + fI/Qin, Unless Otherwise Specified
PRFout vs VAGC 0
PRFout - Total Output Power - dBm PRFout - Total Output Power - dBm
PRFout vs VI/Qin 0
-10
B/V
-10
-20
SLO
=5 9d
PE
= 154
dB/V
0k ,
SLOPE
-30
=8
-20
10 k,
-40 -50 -60 -70
GCR = 45.4 dB
-30
RAG
C
RAGC =
-40
0
1
2
3
100
500
1000
2000
VAGC - AGC Control Voltage - V
VI/Qin - I/Q Input Amplitude - mVP-P
PRFout vs PLO1in 0
PRFout - Total Output Power - dBm PRFout - Total Output Power - dBm
PRFout vs PLO2in 0
-10
-10
-20
-20
-30 -40 -30 -20 -10 0 +10
-30 -30
-20
-10
0
+10
PLO1in - LO1 Input Level - dBm
PLO2in - LO2 Input Level - dBm
Data Sheet P12781EJ2V0DS00
15
PC8129GR
vs VI/Qin 7 MOD Pattern: PN9 6 5 3 4 3 2
RBW 3 kHz
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM
PC8129GR REF 0.0 dBm 10 dB/
ATT 10 dB
1
- Phase Error - deg. (rms)
4
2
1
VBW 10 kHz
0
100
500
1000
2000
SWP 1.0 s CENTER 1.9000000 GHz SPAN 500 kHz *** Multi Marker List *** No.1: 1.9000677 GHz -12.13 dBm No.2: 1.9000000 GHz -39.30 dBc No.3: 1.8999323 GHz -28.98 dBc No.4: 1.8997969 GHz -41.30 dBc
VI/Qin - I/Q Input Amplitude - mVp-p
TYPICAL GMSK MODULATION OUTPUT SPECTRUM
PC8129GR REF -10.0 dBm 10 dB/
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM
PC8129GR REF 0.0 dBm 10 dB/
MKR 1.900 GHz fLO1in (= fIF) fLO1in (= 2fIF) 3 fLO1in 2
1 2
ATT 0 dB
A write B view MARKER 1. 899200 GHz -74. 75 dB
ATT 10 dB
MARKER 1.900 GHz -11. 67 dBm
fLO2in
MKR 1.899200 GHz
(= 3fIF) 2 fLO1in (= 4fIF)
2 fLO1in (= 5fIF)
5
3 DL -10.0 dBm 1 2
4 5 6
4 fLO1in 3 fLO1in 7 fLO1in (= 8fIF) 2 (= 6fIF) (= 7fIF)
RBW 3 kHz VBW 10 kHz SWP 5.0 s CENTER 1.900000 GHz
No.1: No.2: No.3: No.4: No.5: No.6: : *** Multi Marker List *** 1.899200 GHz -74.75 dB 1.899400 GHz -74.50 dB 1.899600 GHz -64.75 dB 1.900400 GHz -66.50 dB 1.900600 GHz -74.25 dB 1.900800 GHz -74.75 dB
RBW 300 kHz VBW 300 kHz SWP 5.0 s SPAN 2. 000 MHz START 0 Hz STOP 2.500 GHz
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM (IN BAND)
PC8129GR REF 0.0 dBm 10 dB/
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM (IN BAND)
PC8129GR REF 0.0 dBm 10 dB/
ATT 10 dB
ATT 10 dB
fRFout = 1.71 GHz + fI/Qin fLO2in = 1.46 GHz
1 2 7
1 6
4 5 6 2 3 5 7
3
4
RBW 300 kHz VBW 300 kHz SWP 5.0 s CENTER 1.9000 GHz
No.1: No.2: No.3: No.4: No.5: No.6: No.7:
RBW 300 kHz VBW 300 kHz SWP 5.0 s SPAN 600 MHz CENTER 1.7950 GHz
No.1: No.2: No.3: No.4: No.5: No.6: No.7:
SPAN 600 MHz
*** Multi Marker List *** 1.900 GHz -11.71 dBm 1.650 GHz -24.07 dBm 1.750 GHz -64.52 dBm 1.800 GHz -63.37 dBm 2.000 GHz -61.09 dBm 2.050 GHz -59.39 dBm 2.150 GHz -31.62 dBm
*** Multi Marker List *** 1.710 GHz -15.16 dBm 1.670 GHz -61.50 dBm 1.750 GHz -67.84 dBm 1.920 GHz -46.33 dBm 1.940 GHz -58.68 dBm 1.960 GHz -27.94 dBm 2.000 GHz -62.11 dBm
16
Data Sheet P12781EJ2V0DS00
PC8129GR
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM (IN BAND)
PC8129GR REF 0.0 dBm 10 dB/
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM (IN BAND)
PC8129GR REF 0.0 dBm 10 dB/
ATT 10 dB
ATT 10 dB
1 2
fRFout = 1.795 GHz + fI/Qin fLO2in = 1.545 GHz
1 2
fRFout = 1.88 GHz + fI/Qin fLO2in = 1.63 GHz
7
5 3 4
6
34
56
RBW 300 kHz VBW 300 kHz SWP 5.0 s CENTER 1.7950 GHz No.1: No.2: No.3: No.4: No.5: No.6: No.7: *** Multi Marker List *** 1.795 GHz 1.545 GHz 1.590 GHz 1.750 GHz 1.840 GHz 2.000 GHz 2.045 GHz SPAN 600 MHz -14.21 dBm -24.47 dBm -65.96 dBm -66.40 dBm -60.91 dBm -61.79 dBm -28.73 dBm
RBW 300 kHz VBW 300 kHz SWP 5.0 s CENTER 1.7950 GHz No.1: No.2: No.3: No.4: No.5: No.6: *** Multi Marker List *** 1.880 GHz 1.630 GHz 1.750 GHz 1.760 GHz 2.000 GHz 2.010 GHz SPAN 600 MHz -12.32 dBm -23.47 dBm -64.08 dBm -63.19 dBm -61.05 dBm -60.25 dBm
Data Sheet P12781EJ2V0DS00
17
PC8129GR
STANDARD TYPICAL CHARACTERISTICS
TA = +25 C, VCC = 3.0 V, VPS = 3.0 V, fUPCONin = 250 MHz, PUPCONin = -20 dBm Test Circuit 1 (fRFout = 900 MHz, fLO2in = 1150 MHz) or Test Circuit 2 (fRFout = 1900 MHz, fLO2in = 1650 MHz), Unless Otherwise Specified
PRFout, IM3, vs PUpConin
PRFout - Output Power - dBm IM3 - 3rd Order Intermoduration Distortion - dBm
fUpConin = 250.0/250.2 MHz
PRFout, IM3, vs PUpConin
PRFout - Output Power - dBm IM3 - 3rd Order Intermoduration Distortion - dBm
OIP3 = +5.8 dBm fUpConin = 250.0/250.2 MHz
0 fLO2in = 1.15 GHz
fRFout = 899.8/900.0 MHz
0 fLO2in = 1.65 GHz
fRFout = 1.9000/1.9002 GHz
-10 -20 -30 -40
3
-10 -20 -30 -40 -50 -60 -70 -80 -50 -40 -30 -20 -10
IM
3
OIP3 = -1.3 dBm
PR
Fo
ut
PR
Fo
ut
-50 -60 -70 -50 -40 -30
-20
IM
-10
0
0
PUPCONin - Up-Converter Input Level - dBm
PUPCONin - Up-Converter Input Level - dBm
CG vs PLO2in
15
CG - Conversion Gain - dB
10
fRFout = 900 MHz fLO2in = 1.15 GHz
5
fRFout = 1.9 GHz fLO2in = 1.65 GHz
0
-40
-30
-20
-10
0
PLO2in - LO2 Input Level - dBm
18
Data Sheet P12781EJ2V0DS00
PC8129GR
STANDARD TYPICAL CHARACTERISTICS
Test Circuit 1 or 2, TA = +25 C, VCC = 3 V, VPS = 3 V I/Q DC = 1.5 V (Vbias(I) = Vbias(Ib) = Vbias(Q) = Vbias(Qb) = 1.5 V) fI/Qin = 67.7 kHz, VI/Qin = 500 mVP-P (single ended input, Ib = Qb = 0 mVP-P) Modulation Pattern: All Zero <0000>, fLO1in = 500 MHz, PLO1in = -10 dBm fMODout = fLO1in/2 + fI/Qin = 250 MHz + fI/Qin, Unless Otherwise Specified
PMODout vs VI/Qin +10
PMODout - Moduration Output Power - dBm
PMODout vs PLO1in +10
PMODout - Moduration Output Power - dBm
0 -10 -20 -30 -40 -50
0 -10 -20 -30 -40 -50 -40
100
200
500
1000
2000
-30
-20
-10
0
VI/Qin - I/Q Input Amplitude - mVP-P
PLO1in - LO1 Input Level - dBm
0
PMODout - Moduration Output Power - dBm
LoL - Local Oscillator Carrier Leakage - dBc ImR - Image Rejection - dBc IM3I/Q - I/Q 3rd Order Intermodulation Distortion - dBc
PMODout, LoL, ImR, IM3I/Q vs fLO1in
vs VI/Qin 3 MOD Pattern: PN9
- Phase Error - deg. (rms.)
-10 -20 -30 -40 -50
PRFout
-20 -30 -40 -50 -60
LoL ImR
2
1
IM3I/Q 100 200 500 1000 2000 -70
100
200
500
1000
2000
fLO1in - LO1 Input Frequency - MHz
VI/Qin - I/Q Input Amplitude - mVP-P
Data Sheet P12781EJ2V0DS00
19
PC8129GR
vs fLO1in 7 MOD Pattern: PN9
- Phase Error - deg. (rms.)
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM
PC8129GR REF 0.0 dBm 10 dB/
ATT 10 dB
1
6 5 4 3 2
RBW 3 kHz
3 2
4
1
VBW 10 kHz
0
100
200
500
1000
2000
SWP 1.0 s CENTER 250.0000 MHz SPAN 500 kMHz *** Multi Marker List *** -16.37 dBm No.1: 250.0677 MHz -39.49 dBc No.2: 250.0000 MHz -31.07 dBc No.3: 249.9323 MHz -58.80 dBc No.4: 249.7969 MHz
fLO1in - LO1 Input Frequency - MHz
20
Data Sheet P12781EJ2V0DS00
PC8129GR
LO1 INPUT (Pin8) IMPEDANCE VCC = VPS = 3 V
CH1 S11 1 U FS 2: 47.998 0.8066 256.76 pH 500.000 000 MHz MARKER 2 500 MHz
MOD OUTPUT (Pin3) IMPEDANCE VCC = VPS = 3 V
CH1 S22 1 U FS 2: 31.195 14.908 9.4909 nH 250.000 000 MHz MARKER 2 250 MHz
2 2 31 1 3
MARKER 1: 200 MHz 2: 500 MHz 3: 800 MHz START 100.000 000 MHz STOP 1 000.000 000 MHz START 50.000 000 MHz
MARKER 1: 100 MHz 2: 250 MHz 3: 400 MHz STOP 500.000 000 MHz
Up-Con. INPUT (Pin1) IMPEDANCE VCC = VPS = 3 V
CH1 S11 1 U FS 2: 101.78 -387.03 1.6449 pF 250. 000 000 MHz MARKER 2 250 MHz
LO2 INPUT (Pin13) IMPEDANCE VCC = VPS = 3 V
CH1 S11 1 U FS 1: 22.379 -93.543 1.8905 pF 900.000 000 MHz MARKER 1 900 MHz
2 1 3 MARKER
1: 100 MHz 2: 250 MHz 3: 400 MHz START 50.000 000 MHz STOP 500.000 000 MHz
1 3 2
MARKER 1: 900 MHz 2: 1150 MHz 3: 1900 MHz
START 800.000 000 MHz
STOP 2 000.000 000 MHz
RF OUTPUT (Pin18) IMPEDANCE VCC = VPS = 3 V
CH1 S22 1 U FS 1: 18.953 -158.83 1.1134 pF 900.000 000 MHz MARKER 1 Connect to inductor 900 MHz (L2 = 100 nH) between pin18 and pin19
1
2 3
MARKER 1: 900 MHz 2: 1150 MHz 3: 1900 MHz
START 800.000 000 MHz
STOP 2 000.000 000 MHz
Data Sheet P12781EJ2V0DS00
21
PC8129GR
TEST CIRCUIT 1 (In the case of fRFout = 900 MHz Band)
10 nF VCC 1000 pF 100 pF 100 pF 2 3 I(DC), VIin 4 Ib(DC) Qb(DC) Q(DC), VQin LO1in 8 100 pF (Open) 9 10 LO1inb GND LO2inb GND 12 100 pF 11 LO1in LO2in 13 6.8 nH 4 pF 100 pF 10 nF 5 1000 pF 10 nF 1000 pF 7 Q GND 14 Note 1 ZL = 50 6 Qb VAGC 15 Ib VPS 16 RAGC = 10 k 10 nF VAGC I GND 17 Up-Con. inb MODout VCC(UP-CON.) RFout 19 18 15 nH 6 pF 100 pF 1000 pF ZL = 50 84 nH 10 nF VCC fRFout
1
Up-Con. in
VCC(MOD.)
20
Note 2 RPS = 1 k 10 nF Vps
LO2in
Notes 1. 50 matching circuit at fLO2in = 1150 MHz. In the case of using NEC's evaluation board. 2. 50 matching circuit at fRFout = 900 MHz. In the case of using NEC's evaluation board.
22
Data Sheet P12781EJ2V0DS00
PC8129GR
TEST CIRCUIT 2 (In the case of fRFout = 1900 MHz Band)
1 100 pF 100 pF 2 3 I(DC), VIin 4 Ib(DC) Qb(DC) Q(DC), VQin LO1in 8 100 pF (Open) 9 10 LO1inb GND LO2inb GND 12 100 pF 11 LO1in LO2in 13 2 pF 100 pF 10 nF 1000 pF 10 nF 1000 pF 7 Q GND 14 Note 1 ZL = 50 6 Qb VAGC 15 5 I Ib GND VPS 17 16 Up-Con. in Up-Con. inb MODout VCC(MOD.) VCC(UP-CON.) RFout 20 1000 pF 19 18 3 pF 100 pF 1000 pF ZL = 50 68 nH 10 nF VCC 10 nF VCC fRFout
Note 2 RPS = 1 k 10 nF Vps RAGC = 10 k 10 nF VAGC
LO2in
Notes 1. 50 matching circuit at fLO2in = 1650 MHz. In the case of using NEC's evaluation board. 2. 50 matching circuit at fRFout = 1900 MHz. In the case of using NEC's evaluation board.
Data Sheet P12781EJ2V0DS00
23
PC8129GR
EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD
fLO1in = 500 MHz (fMODout = 250 MHz + fI/Qin)
fLO2in = 1150 MHz fRFout = 900 MHz
Qb C = 4 pF L = 6.8 nH C = 100 pF C = 100 pF L = 15 nH
C = 1000 pF
C = 10 nF
C = 100 pF
RAGC = 10 k
VAGC
RPS = 1 k
C = 1000 pF
C = 10 nF
C = 6 pF
L= 84 nH
C = 10 nF
C = 100 pF
C = 1000 pF
VCC
C = 100 pF
C = 100 pF
C = 10 nF
Notes 1. Double-sided patterning with 35 m thick copper on 50 x 50 x 0.4 mm polyimide board. 2. GND pattern on backside. 3. Solder coating over patterns. 4. , indicate through-holes.
NOTICE The test circuits and board pattern on data sheet are for performance evaluation use only. In the case of actual design-in, matching circuit should be determined using S-parameter of desired frequency in accordance to actual mounting pattern.
24
Data Sheet P12781EJ2V0DS00
Ib
C = 10 nF
VPS
C = 10 nF
C = 10 nF
PC8129GR
EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD
fLO1in = 500 MHz (fMODout = 250 MHz + fI/Qin)
fLO2in = 1.65 GHz fRFout = 1.9 GHz + fI/Qin
Qb C = 2 pF C = 100 pF C = 100 pF C= 1000 pF L = 68 nH C = 1000 pF C = 100 pF C = 100 pF C = 10 nF Ib C = 1000 pF C = 1000 pF C = 10 nF
C = 10 nF
C = 100 pF VAGC C = 10 nF VCC C = 10 nF C = 3 pF
Notes 1. Double-sided patterning with 35 m thick copper on polyimide board. 2. GND pattern on backside. 3. Solder coating over patterns. 4. , indicate through-holes.
NOTICE The test circuits and board pattern on data sheet are for performance evaluation use only. In the case of actual design-in, matching circuit should be determined using S-parameter of desired frequency in accordance to actual mounting pattern.
C = 100 pF
RPS = 1 k
VPS
RAGC = 10 k
Data Sheet P12781EJ2V0DS00
25
PC8129GR
PACKAGE DIMENSIONS
20 PIN PLASTIC SSOP (225 mil) (UNIT: mm)
20 11
detail of lead end
3-3
+7
1 6.7 0.3
10
1.8 MAX. 1.5 0.1
6.4 0.2 4.4 0.1 1.0 0.2
0.5 0.2 0.65 0.22 -0.05 0.1 0.1
+0.10
0.15 0.10 M
0.15 0.575 MAX.
+0.10 -0.05
NOTE
Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
26
Data Sheet P12781EJ2V0DS00
PC8129GR
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.x. 1000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering method and
conditions than the recommended conditions are to be consulted with sales representatives.
PC8129GR
Soldering process Infrared ray reflow Soldering conditions Peak package's surface temperature: 235 C or below, Reflow time: 30 seconds or below (210 C or higher) Note Number of reflow process: 2, Exposure limit : None Peak package's surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher) Note Number of reflow process: 2, Exposure limit : None Solder temperature: 260 C or below, Flow time: 10 seconds or below, Note Number of flow process: 1, Exposure limit : None Terminal temperature: 300 C or below, Flow time: 3 seconds/pin or below, Note Exposure limit : None Symbol IR35-00-2
VPS
VP15-00-2
Wave soldering
WS60-00-1
Partial heating method
Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Caution Apply only a single process at once, except for "Partial heating method". For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P12781EJ2V0DS00
27
PC8129GR
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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