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| S D S ARF1502 D G S ARF1500 BeO 135-05 RF POWER MOSFET Specified 65 Volt, 27.12 MHz Characteristics: Output Power = 900 Watts. Gain = 17dB (Class C) Efficiency > 75% MAXIMUM RATINGS Symbol VDSS VDGO ID VGS PD TJ,TSTG TL Parameter N - CHANNEL ENHANCEMENT MODE S G S 65V 1500W 40MHz The ARF1500 is an RF power transistor designed for class C/E operation in very high power scientific, commercial, medical and industrial RF power generator and amplifier applications up to 40 MHz. A IN D FO VA R NC M AT ED IO N 200 200 70 30 1500 300 MIN TYP High Performance Power RF Package. Very High Breakdown for Improved Ruggedness. Low Thermal Resistance. Nitride Passivated Die for Improved Reliability. All Ratings: TC = 25C unless otherwise specified. ARF 1500 UNIT Volts Amps Volts Watts C Drain-Source Voltage Drain-Gate Voltage Continuous Drain Current @ TC = 25C Gate-Source Voltage Total Device Dissipation @ TC = 25C Operating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec. -55 to 200 STATIC ELECTRICAL CHARACTERISTICS Symbol BVDSS VDS(ON) IDSS IGSS g fs V isolation VGS(TH) Characteristic / Test Conditions On State Drain Voltage 1 MAX UNIT Volts A nA mhos Volts Drain-Source Breakdown Voltage (VGS = 0V, ID = 250 A) (I D(ON) = 35A, VGS = 10V) Zero Gate Voltage Drain Current (VDS = VDSS, VGS = 0V) Gate-Source Leakage Current (VGS = 30V, VDS = 0V) Forward Transconductance (VDS = 25V, ID = 35A) RMS Voltage 200 4.0 100 1000 400 Zero Gate Voltage Drain Current (VDS = 0.8 VDSS, VGS = 0V, TC = 125C) 8 2500 3 11 5 (60Hz Sinewave from terminals to mounting surface for 1 minute) Gate Threshold Voltage (VDS = VGS, ID = 50mA) Volts THERMAL CHARACTERISTICS Symbol RJC RCS Characteristic (per package unless otherwise noted) Junction to Case Case to Sink (Use High Efficiency Thermal Joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT C/W 050-5600 Rev - 7-01 0.12 0.09 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - http://www.advancedpower.com USA: EUROPE: 405 S.W. Columbia Street Chemin de Magret Bend, Oregon 97702 -1035 F-33700 Merignac - France Phone: (541) 382-8028 Phone: (33) 5 57 92 15 15 FAX: (541) 388-0364 FAX: (33) 5 56 47 97 61 DYNAMIC CHARACTERISTICS Symbol Ciss Coss Crss td(on) tr td(off) tf Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Test Conditions VGS = 0V MIN TYP MAX ARF1502 UNIT 4820 800 210 5 3.0 15 3 6000 1100 290 10 7 25 7 ns pF VDS = 50V f = 1 MHz VGS = 15V VDD = 0.5 VDSS ID = ID[Cont.] @ 25C RG = 1.6 FUNCTIONAL CHARACTERISTICS A IN D FO VA R NC M AT ED IO N Test Conditions f = 27.12 MHz Pout = 900W MIN TYP Symbol GPS Characteristic MAX UNIT dB % Common Source Amplifier Power Gain Drain Efficiency 15 70 17 75 VGS = 0V VDD = 65V Electrical Ruggedness VSWR 10:1 No Degradation in Output Power 1 Pulse Test: Pulse width < 380 S, Duty Cycle < 2%. APT Reserves the right to change, without notice, the specifications and information contained herein. 1.065 .160 D S D S .500 HAZARDOUS MATERIAL WARNING The ceramic portion of the device between leads and mounting surface is beryllium oxide. Beryllium oxide dust is highly toxic when inhaled. Care must be taken during handling and mounting to avoid damage to this area. These devices must never be thrown away with general industrial or domestic waste. G S ARF1500 BeO 135-05 1.065 dims: inches .045 S G S .500 .005 .207 .375 .207 .105 typ. 050-5600 Rev - 7-01 yy ;; yyyy ;;;; Clamp ARF 1500 Compliant layer Heat Sink Thermal Considerations and Package Mounting: The rated 1500W power dissipation is only available when the package mounting surface is at 25C and the junction temperature is 200C. The thermal resistance between junctions and case mounting surface is 0.12 C/W. When installed, an additional thermal impedance of 0.09 C/W between the package base and the mounting surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint compound must be used to reduce the effects of small surface irregularities. The heatsink should incorporate a copper heat spreader to obtain best results. The package is designed to be clamped to a heatsink. A clamped joint maintains the required mounting pressure while allowing for thermal expansion of both the device and the heat sink. A simple clamp, a compliant layer of plastic or rubber, and two 6-32 (M3.5) screws can provide the minimum 85 lb required mounting force. T = 6 in-lb. |
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