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19-2075; Rev 2; 10/02
Integrated Cellular RF-Section Power-Management IC
General Description
The MAX8890 is a power-management IC intended for cellular handsets using a single lithium-ion (Li+) cell battery with input voltages from +2.5V to +5.5V. The IC contains three identical, low-noise, low-dropout (LDO) linear regulators to provide all of the supply voltage requirements for the RF portion of the handset. The first LDO is intended to power the transmitter, receiver, and synthesizer. The second LDO is intended to power the TCXO, and high-power voltage-controlled oscillators (VCOs). The third LDO is intended to power the UHF offset VCO. Each LDO has its own individual enable (ON/OFF) control to maximize design flexibility. The reference is powered on if any of the enable inputs (EN1, EN2, EN3) are logic high. The high-accuracy output voltage of each LDO is preset at an internally trimmed voltage (1.8V to 3.3V in 50mV increments). Each LDO is capable of supplying 100mA with a low 50mV dropout and is optimized for low noise and high crosstalk-isolation. Designed with internal P-channel MOSFET pass transistors, the MAX8890's low 180A operating supply current is independent of load. Other features include short-circuit and thermal-overload protection. The MAX8890 is available in a compact, high-power, 12-pin 4mm 4mm QFN package with a metal pad on the underside.
Features
o Three 100mA Low-Dropout Linear Regulators o Low 50mV Dropout Voltage at 100mA o 1% Output Voltage Accuracy Over Temperature o Preset 1.8V to 3.3V Output Voltages (in 50mV Increments) o Low 45VRMS Output Voltage Noise o Low 180A Operating Supply Current o 2.5V to 5.5V Input Voltage Range o 67dB PSRR o 10VP-P Channel-to-Channel Crosstalk o Short-Circuit Protection o Thermal-Overload Protection o 0.01A Shutdown Current o Tiny 12-Pin 4mm x 4mm QFN Package
MAX8890
Ordering Information
PART TEMP RANGE PIN PACKAGE 12 (4mm x 4mm) QFN MAX8890ETCxyz* -40C to +85C
Applications
Cellular Handsets Single-Cell Li+ Systems 3-Cell NiMH, NiCD, or Alkaline Systems Personal Digital Assistants (PDAs)
*Each preset output voltage of these devices is factory trimmed to one of ten voltages. Replace "xyz" with the letters corresponding to the desired output voltages (see Standard Preset Output Voltage Suffixes table), where the three letter suffix corresponds to the following output voltages: "x" = VOUT1, "y" = VOUT2, and "z" = VOUT3. Note: There are five standard versions available (see Standard Versions table). Sample stock is generally held on standard versions only. Standard versions have an order increment requirement of 2500 pieces. Nonstandard versions have an order increment requirement of 10,000 pieces. Contact the factory for availability of nonstandard versions.
Standard Preset Output Voltage Suffixes
SUFFIX A B D F G OUTPUT VOLTAGE (V) 3.30 3.00 2.90 2.85 2.80 SUFFIX H J K L M OUTPUT VOLTAGE (V) 2.75 2.70 2.50 2.00 1.80
Typical Operating Circuit
INPUT IN1 OUT1 OUTPUT #1
IN2
OUT2
OUTPUT #2
MAX8890
IN3 ON EN1 OFF EN2 EN3 GND BP OUT3
OUTPUT #3
*Nonstandard output voltages between 1.80V and 3.30V are available in 50mV increments. Standard Versions table and Pin Configuration appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
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Integrated Cellular RF-Section Power-Management IC MAX8890
ABSOLUTE MAXIMUM RATINGS
IN_, EN_ to GND.......................................................-0.3V to +6V OUT_, BP to GND ......................................-0.3V to (VIN_ + 0.3V) Output Short-Circuit Protection (Note A) .......................indefinite Continuous Power Dissipation (TA = +70C) 12-Pin 4 x 4 QFN (derate 16.9mW/C above +70C) .......1349mW Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C
Note A: As long as the maximum continuous power dissipation rating is not exceeded, the output can be shorted indefinitely.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN_ = 3.6V, EN_ = IN_, CIN = 6.8F, COUT_ = 2.2F, CBP = 0.01F, all ceramic capacitors TA = 0C to +85C, unless otherwise noted. Typical values are at TA = +25C.)
PARAMETER GENERAL Input Voltage Input Undervoltage Lockout Threshold Input Undervoltage Hysteresis SUPPLY CURRENT Quiescent Supply Current Shutdown Supply Current LINEAR REGULATORS VIN_ = 0.5V + the highest of (VOUT1, VOUT2, or VOUT3), IOUT_ = 1mA to 100mA OUT_ = GND EN_ = GND IOUT_ = 1mA IOUT_ = 50mA IOUT_ = 100mA VIN_ = (VOUT_+ 0.1V) to 5.5V for VOUT_ 2.4V, or VIN_ = 2.5V to 5.5V for VOUT_ < 2.4V, IOUT = 1mA 10Hz to 100kHz, COUT_ = 10F ceramic, VOUT_ = 2.8V, IOUT_ = 10mA 100Hz, COUT_ = 2.2F ceramic, IOUT_ = 10mA 10kHz, COUT_ = 2.2F ceramic, IOUT_ = 10mA -0.15 TA = +85C -1 +1 % TA = 0C +85C -2 120 3 250 5 1 25 50 100 +0.15 %/V mV +2 500 8 mA k IQ IOUT_ = 0 EN_ = OUT_ = GND 180 0.01 330 10 A A VIN_ VUVLO Rising and falling edge 2.5 2.10 2.25 45 5.5 2.45 V V mV SYMBOL CONDITIONS MIN TYP MAX UNITS
Output Voltage Accuracy
VOUT_
Current Limit Output Pulldown Resistance Dropout Voltage (Note 1)
ILIM ROUT_ VIN_ VOUT_
Line Regulation
Output Voltage Noise Output Voltage PSRR Channel-to-Channel Isolation
45 67 64
VRMS dB dB
2
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Integrated Cellular RF-Section Power-Management IC
ELECTRICAL CHARACTERISTICS (continued)
(VIN_ = 3.6V, EN_ = IN_, CIN = 6.8F, COUT_ = 2.2F, CBP = 0.01F, all ceramic capacitors TA = 0C to +85C, unless otherwise noted. Typical values are at TA = +25C.)
PARAMETER ENABLE LOGIC CONTROL EN_ Input Threshold EN_ Input Bias Current THERMAL PROTECTION Thermal-Shutdown Temperature Thermal-Shutdown Hysteresis TSHDN TSHDN Rising temperature 160 15 C C VEN_ IEN_ 2.5V VIN_ 5.5V VEN_ = 5.5V or 0, TA = +85C 0.4 -1 1.6 +1 V A SYMBOL CONDITIONS MIN TYP MAX UNITS
MAX8890
ELECTRICAL CHARACTERISTICS
(VIN_ = 3.6V, EN_ = IN_, CIN = 6.8F, COUT_ = 2.2F, CBP = 0.01F, all ceramic capacitors TA = -40C to +85C, unless otherwise noted.) (Note 2)
PARAMETER GENERAL Input Voltage Input Undervoltage Lockout Threshold SUPPLY CURRENT Quiescent Supply Current Shutdown Supply Current LINEAR REGULATORS Output Voltage Accuracy Current Limit Output Pulldown Resistance Dropout Voltage VOUT_ ILIM ROUT_ VIN_ VOUT_ VIN_ = 0.5V + the highest of (VOUT1, VOUT2, or VOUT3), IOUT_ = 1mA to 100mA OUT_ = GND EN_ = GND IOUT_ = 100mA (Note 1) VIN_ = (VOUT_+ 0.1V) to 5.5V for VOUT_ 2.4V, or VIN_ = 2.5V to 5.5V for VOUT_ < 2.4V, IOUT = 1mA VEN_ IEN_ 2.5V VIN_ 5.5V VEN_ = 5.5V or 0, TA = +85C -2 110 3 +2 500 8 100 % mA k mV IQ IOUT_ = 0 EN_ = OUT_ = GND 330 10 A A VIN_ VUVLO Rising and falling edge 2.5 2.10 5.5 2.45 V V SYMBOL CONDITIONS MIN MAX UNITS
Line Regulation ENABLE LOGIC CONTROL EN_ Input Threshold EN_ Input Bias Current
-0.15
+0.15
%/V
0.4 -1
1.6 +1
V A
Note 1: The dropout voltage is defined as VIN_ - VOUT_, when VOUT_ is 100mV below the set output voltage (the value of VOUT_ for VIN_ = VOUT_ + 500mV). Since the minimum input voltage range is 2.5V, this specification is only meaningful when the set output voltage exceeds 2.7V (VOUT_(NOM) 2.7V). Note 2: Specifications to -40C are guaranteed by design, not production tested.
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Integrated Cellular RF-Section Power-Management IC MAX8890
Typical Operating Characteristics
(Circuit of Figure 1, MAX8890ETCGGG, VIN = 3.3V, EN_ = IN_, TA = +25C, unless otherwise noted.)
OUTPUT VOLTAGE vs. INPUT VOLTAGE
MAX8890 toc01
OUTPUT VOLTAGE vs. LOAD CURRENT
MAX8890 toc02
OUTPUT VOLTAGE vs. TEMPERATURE
MAX8890 toc03
3.0 2.5 OUTPUT VOLTAGE (V) 2.0 1.5 1.0 0.5 IOUT = NO LOAD 0 0 1 2 3 4 5 6 INPUT VOLTAGE (V)
2.83 2.82 OUTPUT VOLTAGE (V) 2.81 2.80 2.79 2.78 2.77 0 20 40 60 80
2.83 2.82 OUTPUT VOLTAGE (V) 2.81 2.80 2.79 2.78 IOUT = 100mA 2.77
100
-40
-15
10
35
60
85
LOAD CURRENT (mA)
TEMPERATURE (C)
DROPOUT VOLTAGE vs. LOAD CURRENT
MAX8890 toc04
GROUND-PIN CURRENT vs. INPUT VOLTAGE
180 GROUND-PIN CURRENT (A) 160 140 120 100 80 60 40 IOUT = NO LOAD IOUT1 = 100mA ONLY ONE OUTPUT ENABLED (EN1 = IN, EN2 = EN3 = GND)
MAX8890 toc05
GROUND-PIN CURRENT vs. LOAD CURRENT
95 GROUND-PIN CURRENT (A) 90 85 80 75 70 65 60 55 50 ONLY ONE OUTPUT ENABLED (EN1 = IN, EN2 = EN3 = GND) 0 20 40 60 80 100
MAX8890 toc06
70 60 DROPOUT VOLTAGE (mV) 50 40 30 20 10 0 0 20 40 60 80 TA = -40C TA = +25C TA = +85C
200
100
20 0 100 0 1 2 3 4 5 6 LOAD CURRENT (mA) INPUT VOLTAGE (V)
LOAD CURRENT (mA)
GROUND-PIN CURRENT vs. TEMPERATURE
MAX8890 toc07
POWER-SUPPLY REJECTION RATIO
MAX8890 toc08
CHANNEL-TO-CHANNEL ISOLATION
70 60 ISOLATION (dB) 50 40 30 20 LOW-IMPEDANCE INPUT IOUT1 = 100mA SINUSOIDAL LOAD IOUT3 = 10mA 0.1 1 10 FREQUENCY (kHz) 100 1000
MAX8890 toc09
120 110 GROUND-PIN CURRENT (A) 100 90 80 70 60 50 -40 -15 10 35 60 IOUT1 = 100mA ONLY ONE OUTPUT ENABLED (EN1 = IN, EN2 = EN3 = GND)
80 70 60 PSRR (dB) 50 40 30 20 10 0 CIN = 1F + 0.1F IOUT = 10mA 0.01 0.1 1 10 100
80
10 0 1000
85
TEMPERATURE (C)
FREQUENCY (kHz)
4
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Integrated Cellular RF-Section Power-Management IC MAX8890
Typical Operating Characteristics (continued)
(Circuit of Figure 1, MAX8890ETCGGG, VIN = 3.3V, EN_ = IN_, TA = +25C, unless otherwise noted.)
LOAD TRANSIENT
MAX8890 toc10
LOAD TRANSIENT NEAR DROPOUT
MAX8890 toc11
LINE TRANSIENT RESPONSE
MAX8890 toc12
4.0V A A 3.5V A
B
B 2.8V B
20s/div A. IOUT_ = 1mA to 100mA, 50mA/div B. VOUT_ = 2.8V, 20mV/div VIN = 3.3V (VOUT_ +500mV)
20s/div A. IOUT_ = 1mA to 100mA, 50mA/div B. VOUT_ = 2.8V, 20mV/div VIN = 2.9V (VOUT_ + 100mV)
40s/div A. VIN = 3.5V to 4.0V, 200mV/div B. VOUT_ = 2.8V, 2mV/div IOUT = 100mA
CROSSTALK VOLTAGE
LOW-IMPEDANCE INPUT IOUT1 = 100mA SINUSOIDAL LOAD IOUT3 = 10mA CROSSTALK (Vp-p) 100
MAX8890 toc13
STARTUP WAVEFORM (CBP = 0.01F)
1000
MAX8890 toc14
STARTUP WAVEFORM (CBP = 0.1F)
MAX8890 toc15
A
A
B
B
10
C
1 0.1 1 10 FREQUENCY (kHz) 100 1000
C
20s/div A. VIN = 0 to 3.3V, 5V/div B. VOUT_ = 2.8V, 2V/div C. VBP = 1.25V, 1V/div ROUT_ = 28 (100mA)
5ms/div A. VIN = 0 to 3.3V, 5V/div B. VOUT_ = 2.8V, 2V/div C. VBP = 1.25V, 1V/div ROUT_ = 28 (100mA)
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Integrated Cellular RF-Section Power-Management IC MAX8890
Typical Operating Characteristics (continued)
(Circuit of Figure 1, MAX8890ETCGGG, VIN = 3.3V, EN_ = IN_, TA = +25C, unless otherwise noted.)
ENABLE WAVEFORM (1ST OUTPUT)
MAX8890 toc16
ENABLE WAVEFORM (2ND OUTPUT)
MAX8890 toc17
A
A
B
B
C
C
D
D
20s/div A. VEN1 = 0 to 3.3V, 5V/div B. VOUT1 = 2.8V, ROUT1 = 28 (100mA), 2V/div C. VBP = 1.25V, 1V/div D. IIN, 200mA/div VIN = 3.3V, EN2 = EN3 = GND, CBP = 0.01F
20s/div A. VEN2 = 0 to 3.3V, 5V/div B. VOUT2 = 2.8V, ROUT2 = 28 (100mA), 2V/div C. VBP = 1.25V, 1V/div D. IIN, 200mA/div VIN = 3.3V, EN1 = IN, EN3 = GND, CBP = 0.01F
Pin Description
PIN 1 2 3 4 5 6 7 8 9 10 11 12 EP NAME IN1 IN2 OUT2 EN1 EN2 EN3 BP GND IN3 OUT3 GND OUT1 GND FUNCTION Regulator 1 Input. Supply voltage can range from 2.5V to 5.5V. Bypass with a capacitor to GND (see Capacitor Selection and Regulator Stability section). Regulator 2 Input. Supply voltage can range from 2.5V to VIN1. Bypass with a capacitor to GND (see Capacitor Selection and Regulator Stability section). Regulator 2 Output. Sources up to 100mA. Bypass with a 2.2F ceramic capacitor to GND. Active-High Enable Input for Regulator 1. A logic low shuts down the first linear regulator. In shutdown, OUT1 is pulled low through an internal 5k resistor. Connect to IN1 for normal operation. Active-High Enable Input for Regulator 2. A logic low shuts down the second linear regulator. In shutdown, OUT2 is pulled low through an internal 5k resistor. Connect to IN2 for normal operation. Active-High Enable Input for Regulator 3. A logic low shuts down the third linear regulator. In shutdown, OUT3 is pulled low through an internal 5k resistor. Connect to IN3 for normal operation. 1.25V Voltage Reference Bypass Pin. Connect a 0.01F ceramic bypass capacitor from BP to GND to minimize the output noise. Make no other connection to this pin. Ground. Connect both ground pins together externally, as close to the IC as possible. Regulator 3 Input. Supply voltage can range from 2.5V to VIN1. Bypass with a capacitor to GND (see Capacitor Selection and Regulator Stability section). Regulator 3 Output. Sources up to 100mA. Bypass with a 2.2F ceramic capacitor to GND. Ground. Connect both ground pins together externally, as close to the IC as possible. Regulator 1 Output. Sources up to 100mA. Bypass with a 2.2F ceramic capacitor to GND. Ground. THE EXPOSED PAD AND ALL FOUR CORNER TABS ON THE QFN PACKAGE ARE INTERNALLY CONNECTED TO GROUND. The exposed pad functions as a heatsink. Solder to a large pad or to the circuit board ground plane to maximize power dissipation. Do not use as device ground.
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Integrated Cellular RF-Section Power-Management IC MAX8890
INPUT 2.5V TO 5.5V IN1 CIN 4.7F IN2 OUT2 OUT1 COUT1 2.2F COUT2 2.2F OUTPUT #1 (1.8V TO 3.3V)* OUTPUT #2 (1.8V TO 3.3V)* OUTPUT #3 (1.8V TO 3.3V)* COUT3 2.2F
MAX8890
IN3 ON EN1 OFF EN2 EN3 GND BP CBP 0.01F OUT3
*See the Ordering Information and Standard Preset Output Voltage Suffixes sections
Figure 1. Typical Application Circuit
Detailed Description
The MAX8890 is an RF power-management IC for a cellular phone. The MAX8890 contains three low-noise, low quiescent current, low-dropout, linear regulators for powering the transmitter, receiver, synthesizer, TCXO, and voltage controlled oscillators (VCOs). Each lowdropout linear regulator (LDO) supplies loads up to 100mA and is available with preset output voltages from 1.8V to 3.3V in 50mV increments. Furthermore, the MAX8890's input voltage range of 2.5V to 5.5V is perfect for single-cell Li+ battery or 3-cell NiMH battery applications. As illustrated in Figure 2, each regulator consists of an error amplifier, internal feedback resistive-divider, and P-channel MOSFET pass transistor. The output voltage feeds back through the internal resistive-divider connected to OUT_. This feedback voltage connects to the error amplifier, which compares the feedback voltage with the internal 1.25V reference voltage and amplifies the difference. If the feedback voltage is lower than the reference voltage, the pass-transistor gate is pulled lower, which allows more current to flow to the output and increases the output voltage. If the feedback voltage is too high, the pass-transistor gate is pulled up, allowing less current to flow to the output. Clear transmission and reception in a cellular phone can only be achieved with a low-noise power supply. Therefore, all three LDOs on the MAX8890 feature low output voltage noise, high power-supply rejection ratios, and excellent load and line regulation characteristics. Designed for single-cell Li+ battery applications where a pulsed current demand is required from the
battery, each LDO is designed with 45VRMS noise from 10Hz to 100kHz and PSRR of 67dB. The MAX8890 also features output current limiting (short-circuit protection), a low-power shutdown mode, and thermal overload protection.
Internal P-Channel Pass MOSFET
Each linear regulator features a 0.5 P-channel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, P-channel MOSFETs require no base drive, which reduces the quiescent current. PNP based regulators also waste considerable current in dropout when the pass transistor saturates and use high base-drive currents under large loads. The MAX8890 does not suffer from these problems and consumes only 180A of quiescent current (all three regulators enabled).
Current Limit (Short-Circuit Protection)
The MAX8890 contains separate current-limit circuitry for each linear regulator. The device monitors and controls the gate voltage of each pass transistor, limiting the regulator's output current to 250mA (typ). The output can be shorted to ground for an indefinite period of time without damage to the part as long as the maximum continuous power dissipation rating is not exceeded.
Output Voltage Selection
The MAX8890 is supplied with factory-set output voltages from 1.8V to 3.3V in 50mV increments. The threeletter part number suffix identifies the output voltage for each regulator. For example, the MAX8890ETCAKM's output voltages are preset to 3.3V (V OUT1 ), 2.5V (VOUT2), and 1.8V (VOUT3).
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Integrated Cellular RF-Section Power-Management IC MAX8890
LINEAR REGULATOR #1 IN1 RSENSE OUT1
THERMAL SHDN ERROR AMPLIFIER CURRENT LIMIT CONTROL LOCIC
IN1 EN1 STARTUP CIRCUITRY REF 1.25V
BP
GND
IN2 LINEAR REGULATOR #2 EN2 OUT2
IN3 LINEAR REGULATOR #3 EN3 OUT3
Figure 2. Functional Diagram
Enable
If any one of the three low-dropout linear regulators (LDOs) is enabled, the internal 1.25V reference powers up. Therefore, all three LDOs must be disabled to shut down the internal reference, reducing the supply current to 0.01A. Pull EN_ low to enter shutdown. When any one of the linear regulators is shutdown, the corresponding MAX8890 output disconnects from the corresponding input, and the output discharges through an internal
8
5k resistor. The capacitance and load determine the rate at which VOUT_ decays. Do not leave EN_ floating. Connect EN_ to IN_ for normal operation. EN_ can be pulled as high as 6V, regardless of the input and output voltages.
Thermal-Overload Protection
Thermal-overload protection limits the MAX8890's total power dissipation in the event of fault conditions. Each linear regulator has its own thermal-shutdown circuitry.
_______________________________________________________________________________________
Integrated Cellular RF-Section Power-Management IC
When the junction temperature exceeds TJ = 160C, a thermal sensor activates the shutdown logic, disabling the overheated regulator. The thermal sensor turns the linear regulator on again after the regulator's junction temperature cools by 15C, resulting in a pulsed output during continuous thermal-overload conditions. For continuous operation, do not exceed the absolute maximum junction-temperature rating of TJ = 150C.
Noise, PSRR, and Transient Response
The MAX8890 is designed to operate with low dropout voltages and low quiescent currents in battery-powered systems while providing low noise, fast transient response, and high AC rejection. See the Typical Operating Characteristics for a plot of Power-Supply Rejection Ratio (PSRR) vs. Frequency. When operating from noisy sources, improved supply-noise rejection and transient response can be achieved by increasing the values of the input and output bypass capacitors and through passive filtering techniques. The MAX8890 load-transient response graphs (see Typical Operating Characteristics) show two components of the output response: a DC shift from the output impedance due to the load current change and the transient response. Increasing the output capacitor's value and decreasing the ESR reduces the transient under/overshoot.
MAX8890
Applications Information
Capacitor Selection and Regulator Stability
Capacitors are required at each input and each output of the MAX8890 for stable operation over the full load range and full temperature range. Connect a minimum 2.2F ceramic capacitor between OUT_ and ground to ensure stability and optimum transient response. Use larger 10F ceramic output capacitors for lower noise requirements. The input capacitor (CIN_) lowers the source impedance of the input supply, thereby reducing the input noise and improving transient response. Connect a minimum 1F ceramic capacitance between each IN_ and ground. Place all input and output capacitors as close to the MAX8890 as possible to minimize the impact of PC board trace impedance. Because IN1 and IN2 are next to each other, they may easily share a single 2.2F or larger ceramic capacitor. Surface-mount ceramic capacitors have very low ESR and are commonly available in values up to 10F. However, note that some ceramic dielectrics exhibit large capacitance and ESR variation with temperature. Z5U and Y5V dielectrics may require a minimum 3.3F nominal output capacitance, especially with low temperature operation.
Input-Output (Dropout) Voltage
A regulator's minimum input-to-output voltage differential (dropout voltage) determines the lowest useable input supply voltage. Once the linear regulator reaches dropout, the series pass transistor is fully on and regulation ceases. The output voltage tracks the input voltage as the input voltage drops lower. Because the MAX8890 uses P-channel MOSFET pass transistors, its dropout voltage is a function of the MOSFET's drain-tosource on-resistance (RDS(ON)) multiplied by the load current (see Typical Operating Characteristics): VDROPOUT = VIN_ - VOUT_ = RDS(ON) IOUT_
Reference Bypass Capacitor
An external bypass capacitor is connected to BP to reduce the inherent reference noise. The capacitor forms a lowpass filter in conjunction with an internal network. Use a 0.01F or greater ceramic capacitor connected as close to BP as possible. Capacitance values greater than 0.01F will increase the startup time. (See Typical Operating Characteristics for startup waveforms.) For the lowest noise, increase the bypass capacitor to 0.1F. Values above 0.1F provide no performance improvement and are therefore not recommended. Do not place any additional loading on this reference bypass pin.
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Integrated Cellular RF-Section Power-Management IC MAX8890
Pin Configuration
TOP VIEW
VERSION
OUT1 12 IN1 IN2 OUT2 1 2 GND 11 OUT3 10 9 8 7 IN3 GND BP
Standard Versions
TOP MARK AABG AABH AABI AABJ AABK AABN MAX8890ETCAAA MAX8890ETCDDD MAX8890ETCGGG MAX8890ETCMMM MAX8890ETCAKM MAX8890ETCABK
MAX8890
3
4 EN1
5 EN2 4 4 QFN
6 EN3
Chip Information
TRANSISTOR COUNT: 1472 PROCESS: BiCMOS
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Integrated Cellular RF-Section Power-Management IC
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)
24L QFN THIN.EPS
MAX8890
PACKAGE OUTLINE 12,16,20,24L QFN THIN, 4x4x0.8 mm
21-0139
A
PACKAGE OUTLINE 12,16,20,24L QFN THIN, 4x4x0.8 mm
21-0139
A
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Integrated Cellular RF-Section Power-Management IC MAX8890
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2002 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

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