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PI3B3253
3.3V, Dual 4:1 Mux/DeMux NanoSwitchTM
Features
* Near-Zero propagation delay * 5 switches connect inputs to outputs * * * Fast Switching Speed: 5.2ns max. Ultra Low Quiescent Power (0.2A typical) - Ideally suited for notebook applications Pin compatible with 74 series 253 logic devices
Description
Pericom Semiconductor's PI3B3253 is a 3.3V, Dual4:1 Multiplexer/ Demultiplexer with Hi-Z outputs that is pinout compatible with the PI74FCT253T, 74F253, and 74ALS/AS/LS 253. Inputs can be connected to outputs with low On-Resistance (5) with no additional ground bounce noise or propagation delay.
* Packaging (Pb-free & Green available): - 16-pin 150-mil wide plastic QSOP (Q) - 16-pin 150-mil wide plastic SOIC (W) - 16-pin 173-mil wide plastic TSSOP (L)
Block Diagram
IA0
SW
Pin Configuration
IA1 IA2 IA3 IB0 IB1 IB2 IB3
EA EB S0 S1
SW SW SW SW SW SW SW
SW
I E Y
EA
1
16
VCC
S1
2
15
EB
IA3
3
14
S0
IA2
4
13
IB3
IA1
5
12 11 10 9
IB2
IA0
6
IB1
YA
7
IB0
GND
8
YB
YA
YB
Truth Table(1)
Enable EA H X L L L L EB X H L L L L Select S1 X X L L H H S0 X X L H L H YA Hi-Z X
IA 0 IA 1 IA 2 IA 3
Pin Description
YB X Hi-Z
IB0 IB1 IB2 IB3
Function Disable A Disable B S1-0 = 0 S1-0 = 1 S1-0 = 2 S1-0 = 3
Pin Name IAN, IBN S0-1 EA, EB YA, YB GND VCC
Description Data Inputs Select Inputs Enable Data Outputs Ground Power
Note: 1. H = High Voltage Level, L = Low Voltage Level
PS8147G 09/09/04
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PI3B3253 3.3V, Dual 4:1 Mux/DeMux NanoSwitchTM Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ..................................................................... -65C to +150C Ambient Temperature with Power Applied .................................... -40C to +85C Supply Voltage to Ground Potential ................................................-0.5V to +4.6V DC Input Voltage .............................................................................-0.5V to +4.6V DC Output Current........................................................................................ 120mA Power Dissipation ............................................................................................ 0.5W
Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
DC Electrical Characteristics (Over the Operating Range, TA = -40C to +85C, VCC =3.3V 10%)
Parameters VIH VIL IIH IIL IOZH VIK RON Description Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current High Impedance Output Current Clamp Diode Voltage Switch On-Resistance(3) Test Conditions(1) Min. 2.0 -0.5 Guaranteed Logic HIGH Level Guaranteed Logic LOW Level VCC = Max., VIN = VCC VCC = Max., VIN = GND 0 IN, YN VCC VCC = Min., IIN = -18mA VCC = Min., VIN = 0.0V, ION = 48mA or 64mA VCC = Min., VIN = 2.4V, ION = 15mA
Typ.(2)
Max. 0.8 1 1 1 -1.2
Units V
A V
5 10
8 17
Capacitance (TA = 25C, f = 1 MHz)
Parameters(4) Description Input Capacitance IA/IB Capacitance, Switch Off IA/IB Capacitance, Switch On VIN = 0V Test Conditions Typ. 3.0 8.0 36.0 pF Units CIN COFF CON
Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 3.3V, TA = 25C ambient and maximum loading. 3. Measured by the voltage drop between I and Y pin at indicated current through the switch. On-Resistance is determined by the lower of the voltages on the two (I,Y) pins. 4. This parameter is determined by device characterization but is not production tested.
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PI3B3253 3.3V, Dual 4:1 Mux/DeMux NanoSwitchTM Power Supply Characteristics
Parameters ICC ICC Description Quiescent Power Supply Current Supply Current per Input @ TTL HIGH Test Conditions(1) VCC = Max. VCC = Max. VIN = GND or VCC VIN = 3.0V(3) Min. Typ.(2) 0.1 Max. 3.0 A 750 Units
Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device. 2. Typical values are at VCC = 3.3V, +25C ambient. 3. Per TTL driven input (control inputs only); I and Y pins do not contribute to ICC.
Switching Characteristics over Operating Range
Parameters tIY tSY tPZH tPHZ tPLZ Description Propagation Delay(2,3) In to Yn Bus Select Time, Sn to Yn Bus Enable Time, E to Yn Bus Disable Time, En to Y CL = 50pF RL = 500 1 1 1 Test Conditions(1) Com. Min. Max. 0.25 4.0 3.8 5.2 ns Units
Notes: 1. See test circuit and waveforms. 2. This parameter is guaranteed but not tested on Propagation Delays. 3. The bus switch contributes no propagational delay other than the RC delay of the On-Resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25ns for 50pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side.
Applications Information
Logic Inputs
The logic control inputs can be driven up to +3.6V regardless of the supply voltage. For example, given a +3.3V supply, IN may be driven low to 0V and high to 3.6V. Driving IN Rail-to-Rail(R) minimizes power consumption.
Power-Supply Sequencing and Hot Plug Information
Proper power-supply sequencing is recommended for all CMOS devices. Always apply VCC and GND before applying signals to input/output or control pins.
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd
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PI3B3253 3.3V, Dual 4:1 Mux/DeMux NanoSwitchTM Packaging Mechanical: 16-Pin QSOP (Q)
16
.008 0.20 MIN.
.150 .157
3.81 3.99
.008 .013 0.20 0.33
Guage Plane
.010 0.254
1
.189 .197 4.80 5.00
Detail A
.016 .035 0.41 0.89
.041 1.04 REF
0-6
.015 x 45 0.38
.053 1.35 .069 1.75
SEATING PLANE
Detail A
.008 0.203 REF
.007 .010
0.178 0.254
0.41 .016 1.27 .050
.228 .244 5.79 6.19
.025 BSC 0.635
.008 .012 0.203 0.305
.004 0.101 .010 0.254
X.XX DENOTES DIMENSIONS IN MILLIMETERS X.XX
Packaging Mechanical: 16-Pin SOIC (W)
16
.149 .157
3.78 3.99
.0099 .0196
0.25 x 45 0.50
1
.386 .393 9.80 10.00
.0155 .0260 0.393 0.660 REF
0-8
0.41 1.27
.016 .050
.0075 .0098
0.19 0.25
.053 .068
1.35 1.75
SEATING PLANE
.2284 .2440 5.80 6.20
.050 BSC 1.27
.013 .020 0.330 0.508
.0040 0.10 .0098 0.25
X.XX DENOTES DIMENSIONS X.XX IN MILLIMETERS
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PI3B3253 3.3V, Dual 4:1 Mux/DeMux NanoSwitchTM Packaging Mechanical: 16-Pin TSSOP (L)
16
.169 .177
4.3 4.5
1
.193 .201 4.9 5.1
.004 .008
0.09 0.20
.047 max. 1.20
SEATING PLANE
0.45 .018 0.75 .030
.252 BSC 6.4
.0256 BSC 0.65
.007 .012
.002 .006
0.05 0.15
X.XX DENOTES CONTROLLING X.XX DIMENSIONS IN MILLIMETERS
0.19 0.30
Ordering Information
Ordering Code PI3B3253Q PI3B3253QE PI3B3253W PI3B3253WE PI3B3253L PI3B3253LE Package Code Q Q W W L L 16-pin QSOP Pb-free & Green, 16-pin QSOP 16-pin SOIC Pb-free & Green, 16-pin SOIC 16-pin TSSOP Pb-free & Green, 16-pin TSSOP Package Desciption
Notes: 1. Thermal Characteristics can be found on the web at www.pericom.com/packaging/
Pericom Semiconductor Corporation * 1-800-435-2336 * www.pericom.com
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