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INTEGRATED CIRCUITS
DATA SHEET
TDA8775 Triple 10-bit video Digital-to-Analog Converter (DAC)
Preliminary specification File under Integrated Circuits, IC02 1996 Aug 14
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
FEATURES * 10-bit resolution * Sampling rate up to: - 50 MHz for normal mode; RL = 37.5 - 35 MHz for LOW power mode; RL = 150 * Internal current reference * Current reference selector for: - normal mode, RL = 37.5 (typ.) - low-power mode, RL = 150 (typ.) * No deglitching circuit required * SYNC and BLANK control inputs * 0.66 V output voltage range on red and blue channels * 1 V output voltage range on green channel (including sync) * BLANK control input on the 3 channels * + 5 V power supply. QUICK REFERENCE DATA SYMBOL VDDA VDDD IDDA IDDD INL DNL fclk(max) Ptot PARAMETER analog supply voltage digital supply voltage analog supply current digital supply current DC integral non-linearity DC differential non-linearity maximum clock frequency total power dissipation SLT = 1; RL = 37.5 SLT = 0; RL = 150 SLT = 1; RL = 37.5 ; fclk = 50 MHz SLT = 0; RL = 150 ; fclk = 35 MHz ORDERING INFORMATION TYPE NUMBER TDA8775G PACKAGE NAME LQFP48 DESCRIPTION plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SLT = 1; RL = 37.5 SLT = 0; RL = 150 SLT = 1; RL = 37.5 SLT = 0; RL = 150 CONDITIONS MIN. 4.5 4.5 - - - - - - 50 35 - - TYP. 5.0 5.0 67 16 15 10 1 0.7 - - 410 130 GENERAL DESCRIPTION APPLICATIONS
TDA8775
* General purpose high-speed digital-to-analog conversion * Digital TV * Graphic display * Desktop video processing.
The TDA8775 consists of three 10-bit video Digital-to-Analog Converters (DACs). They convert the digital input signals into current outputs at a maximum conversion rate of 50 MHz. The DACs are based on current source architecture with selectable current reference. The devices are fabricated in a 5 V CMOS process that ensures high functionality with low power dissipation.
MAX. 5.5 5.5 tbf tbf tbf tbf 2 1.0 - - tbf tbf
UNIT V V mA mA mA mA LSB LSB MHz MHz mW mW
VERSION SOT313-2
1996 Aug 14
2
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
BLOCK DIAGRAM
TDA8775
handbook, full pagewidth
VDDA1 38 10-7
VDDA2 41
VDDA3 45
VDDD1 11 4
VDDD2 37
red digital inputs (bits R0 to R3)
TDA8775
LSB DECODER
25
CLK
red digital inputs (bits R4 to R9) green digital inputs (bits G0 to G3)
6-1
6
MSB DECODER
CURRENT SOURCE
46
OUTR
24-21 4
LSB DECODER
green digital inputs (bits G4 to G9) blue digital inputs (bits B0 to B3)
20-15
6
MSB DECODER
CURRENT SOURCE
44
OUTG
35-32 4
47
VSSA3
43 LSB DECODER
VSSA2
40
VSSA1
blue digital inputs (bits B4 to B9) BLANK control input SYNC control input
31-26
6
MSB DECODER
CURRENT SOURCE
42
OUTB
14 13 CONTROL REGISTER 48 CURRENT REFERENCE 39 12 36
MGE965
SLT
reference current decoupling input (Iref)
VSSD1
VSSD2
Fig.1 Block diagram.
1996 Aug 14
3
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
PINNING SYMBOL R9 R8 R7 R6 R5 R4 R3 R2 R1 R0 VDDD1 VSSD1 SYNC BLANK G9 G8 G7 G6 G5 G4 G3 G2 G1 G0 CLK B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 VSSD2 VDDD2 VDDA1 Iref VSSA1 1996 Aug 14 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 red digital input data; bit 9 (MSB) red digital input data; bit 8 red digital input data; bit 7 red digital input data; bit 6 red digital input data; bit 5 red digital input data; bit 4 red digital input data; bit 3 red digital input data; bit 2 red digital input data; bit 1 red digital input data; bit 0 (LSB) digital supply voltage 1 digital supply ground 1 composite sync control input; for green channel only (active LOW) composite blank control input (active LOW) green digital input data; bit 9 (MSB) green digital input data; bit 8 green digital input data; bit 7 green digital input data; bit 6 green digital input data; bit 5 green digital input data; bit 4 green digital input data; bit 3 green digital input data; bit 2 green digital input data; bit 1 green digital input data; bit 0 (LSB) clock input blue digital input data; bit 9 (MSB) blue digital input data; bit 8 blue digital input data; bit 7 blue digital input data; bit 6 blue digital input data; bit 5 blue digital input data; bit 4 blue digital input data; bit 3 blue digital input data; bit 2 blue digital input data; bit 1 blue digital input data; bit 0 (LSB) digital supply ground 2 digital supply voltage 2 analog supply voltage 1 decoupling pin for reference current analog supply ground 1 4 DESCRIPTION
TDA8775
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
SYMBOL VDDA2 OUTB VSSA2 OUTG VDDA3 OUTR VSSA3 SLT PIN 41 42 43 44 45 46 47 48 analog supply voltage 2 blue analog output analog supply ground 2 green analog output analog supply voltage 3 red analog output analog supply ground 3 DESCRIPTION
TDA8775
mode selection; normal mode, RL = 37.5 (active HIGH); low power mode, RL = 150 (active LOW)
46 OUTR
44 OUTG
42 OUTB
handbook, full pagewidth
37 VDDD2
38 VDDA1
41 VDDA2
45 VDDA3
40 VSSA1
43 VSSA2
47 VSSA3
48 SLT
39 Iref
R9
1
36 VSSD2 35 B0 34 B1 33 B2 32 B3
R8 2 R7 3 R6 4 R5 5 R4 6 R3 7 R2 8
TDA8775
31 B4 30 B5 29 B6 28 B7 27 B8 26 B9 25 CLK
R1 9 R0 10 VDDD1 11 VSSD1 12
SYNC 13
BLANK 14
G6 18
G2 22
G7 17
G0 24
G8 16
G5 19
G4 20
G3 21
G9 15
G1 23
MGE964
Fig.2 Pin configuration.
1996 Aug 14
5
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDDA VDDD VDD Tstg Tamb Tj PARAMETER analog supply voltage digital supply voltage supply voltage difference between VDDA and VDDD storage temperature operating ambient temperature junction temperature MIN. -0.5 -0.5 -1.0 -55 0 -
TDA8775
MAX. +6.5 +6.5 +1.0 +150 70 125 V V V C C C
UNIT
THERMAL CHARACTERISTICS SYMBOL Rth j-a HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. CHARACTERISTICS TDA8775 operating at 50 MHz; SLT = 1 and RL = 37.5 . VDDA = VDDD = 4.5 to 5.5 V; VSSA and VSSD shorted together; VDDA - VDDD = -0.5 to +0.5 V; Tamb = 0 to +70 C; typical values measured at VDDA = VDDD = 5 V and Tamb = 25 C; unless otherwise specified. SYMBOL Supplies VDDA VDDD IDDA IDDD Inputs CLOCK INPUT (PIN 25) VIL VIH VIL VIH VIL VIH LOW level input voltage HIGH level input voltage VSSD - 0.5 2.0 VSSD - 0.5 2.0 VSSD - 0.5 2.0 - - - - - - 0.8 V VDDD + 0.5 V 0.8 V analog supply voltage digital supply voltage analog supply current digital supply current SLT = 1; RL = 37.5 SLT = 0; RL = 150 SLT = 1; RL = 37.5 SLT = 0; RL = 150 4.5 4.5 - - - - 5.0 5.0 67 16 15 10 5.5 5.5 tbf tbf tbf tbf V V mA mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT PARAMETER thermal resistance from junction to ambient in free air VALUE (TYP.) 72 UNIT K/W
BLANK AND SYNC INPUTS (PINS 13 AND 14; ACTIVE LOW) LOW level input voltage HIGH level input voltage VDDD + 0.5 V 0.8 V
R, G AND B DIGITAL INPUTS (PINS 1 TO 10, 15 TO 24 AND 26 TO 35) LOW level input voltage HIGH level input voltage VDDD + 0.5 V
1996 Aug 14
6
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
SYMBOL PARAMETER CONDITIONS SLT = 1; RL = 37.5 SLT = 0; RL = 150 tCPH tCPL tr tf tSU;DAT tHD;DAT Outputs clock pulse width HIGH clock pulse width LOW clock rise time clock fall time input data set-up time input data hold time MIN. TYP. - - - - - - - - - - - - 4 4 - -
TDA8775
MAX.
UNIT
Timing (CL = 25 pF); see Fig.4 fclk(max) maximum clock frequency 50 35 6 6 - - 4 2.5 MHz MHz ns ns ns ns ns ns
OUTB, OUTR AND OUTG ANALOG OUTPUTS (PINS 42, 46 AND 44, REFERENCED TO VSSA) FOR 37.5 LOAD VOUTmax maximum output voltage BLANK and SYNC active R and B channels G channel THD total harmonic distortion fi = 4.43 MHz; SLT = 1; fclk = 50 MHz; RL = 37.5 fi = 4.43 MHz; SLT = 0; fclk = 35 MHz; RL = 150 ZL output load impedance SLT = 1 SLT = 0 Transfer function INL DNL ct DC integral non-linearity DC differential non-linearity crosstalk DAC to DAC DAC to DAC matching Switching characteristics; see Fig.5 td input to 50% output delay time full-scale change; SLT = 1; RL = 37.5 full-scale change; SLT = 0; RL = 150 ts1 settling time 10 to 90% full-scale change; SLT = 1; RL = 37.5 10 to 90% full-scale change; SLT = 0; RL = 150 ts2 settling time to 1 LSB; SLT = 1; RL = 37.5 to 1 LSB; SLT = 0; RL = 150 Output transients (glitches) Vg area for 1 LSB change - tbf - LSB.ns - - - - - - tbf tbf 4 10 tbf tbf - - - - - - ns ns ns ns ns ns - - tbf - 1 0.7 - 1.0 2 1.0 - tbf LSB LSB dB % - - - - tbf tbf 0.714 1.0 -52 -50 37.5 150 - - - - tbf tbf V V dB dB
1996 Aug 14
7
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
Table 1 Input coding and DAC output currents (typical values) DAC OUTPUT CURRENT (mA) SLT = 1; RL = 37.5 SYNC 0 1 0 BLANK 0 0 1 DATA XXH XXH 00H - 3FFH 1 1 00H - 3FFH CODE - - 0 - 1023 0 - 1023 R, B Channels 0 0 1.44 - 19.05 1.44 - 19.05 G Channel 0 7.62 1.44 - 19.05 9.05 - 26.67
TDA8775
BINARY INPUT
DAC OUTPUT CURRENT (mA) SLT = 0; RL = 150 R, B Channels 0 0 0.36 - 4.76 0.36 - 4.76 G Channel 0 1.90 0.36 - 4.76 2.26 - 6.67
handbook, full pagewidth
SYNC PERIOD REFERENCE WHITE
VIDEO PICTURE DATA
660 mV 1 V SET-UP LEVEL REFERENCE BLACK BLANKING LEVEL 330 mV SYNC LEVEL (1)
GREY SCALE
100 IRE UNITS
40 IRE UNITS
BLANK
SYNC (1)
MGD630
(1) Sync only on green channel.
Fig.3 Video signal diagram.
1996 Aug 14
8
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
TIMING
TDA8775
andbook, full pagewidth
t SU; DAT
t HD; DAT V IH
data input
stable
50 % V IL
clock input
MBB656 - 1
50 % V IL t CPL t CPH
Fig.4 Input timing.
handbook, full pagewidth
clock input
50 % code 1023 code 0
input code (example of a full-scale input data transition)
714 mV (code 1023)
1 LSB 10 %
td
50 %
Vo(1)
90 % 54 mV (code 0) t s1 t s2 1 LSB
MBB662 - 3
(1) Output level conditions, SYNC = 0; BLANK = 1.
Fig.5 Switching timing.
1996 Aug 14
9
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
INTERNAL PIN CIRCUITRY
TDA8775
handbook, full pagewidth
VDDA VDDD
VDDA
GND
bitn
bitn
VSSD
VSSA
VSSA
MGE967
(a)
(b)
(c)
(a) Digital inputs; pins 1 to 10, 13 to 25 and 26 to 35. (b) Iref; pin 39. (c) OUTR, OUTG and OUTB; pins 46, 44 and 42.
Fig.6 Internal circuitry.
1996 Aug 14
10
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
APPLICATION INFORMATION
TDA8775
+5 V
handbook, full pagewidth
R = 37.5 or 150 +5 V
(1) (2)
100 nF
+5 V +5 V 22 nF 22 nF 100 nF
R
R
R
48 1 2 3 4 red input 5 6
47
46
45
44
43
42
41
40
39
38
37 36 35 34 33 32 31
TDA8775
7 8 9 10 +5 V 100 nF 11 12 13 14 15 16 17 18 19 20 21 22 23 24 30 29 28 27 26 25
blue input
CLK
green input
MGE966
Analog and digital supplies should be separated and decoupled. Supplies are not connected internally. All ground pins must be connected. One ground plane is preferred although it depends on the application. (1) R = 37.5 ; SLT = 1. (2) R = 150 ; SLT = 0.
Fig.7 Application diagram.
1996 Aug 14
11
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
TDA8775
handbook, full pagewidth
video outputs from TDA8775 R1 75
3.3 H
video output R3 75
27 pF
2.7 H
R2
75
180 pF
330 pF
330 pF
MGE968
Fig.8 Example of reconstruction filter for 1 V output swing.
MGE969
handbook, full pagewidth
att (dB) 0
(2) (1)
-10
-20
-30
-40
0
5
10
15
20
f (MHz)
25
(1) R2 = 75 . (2) R2 = 0 .
Fig.9 Frequency response for filter shown in Fig.8.
1996 Aug 14
12
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
PACKAGE OUTLINE LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
TDA8775
SOT313-2
c
y X
36 37
25 24 ZE
A
e
Q E HE A A2 A1 (A 3) Lp L detail X
wM pin 1 index 48 1 12 ZD bp D HD wM B vM B vM A 13 bp
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT313-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A max. 1.60 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 7.1 6.9 E (1) 7.1 6.9 e 0.5 HD 9.15 8.85 HE 9.15 8.85 L 1.0 Lp 0.75 0.45 Q 0.69 0.59 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 7 0o
o
ISSUE DATE 93-06-15 94-12-19
1996 Aug 14
13
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all LQFP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
TDA8775
If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions, do not consider wave soldering LQFP packages LQFP48 (SOT313-2), LQFP64 (SOT314-2) or LQFP80 (SOT315-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Aug 14
14
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog Converter (DAC)
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8775
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Aug 14
15
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/50/01/pp16
Date of release: 1996 Aug 14
Document order number:
9397 750 01021

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