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| August 1998 FDC6325L Integrated Load Switch General Description This device is particularly suited for compact power management in portable electronic equipment where 2.5V to 8V input and 1.8A output current capability are needed. This load switch integrates a small N-Channel power MOSFET (Q1) which drives a large P-Channel power MOSFET (Q2) in one tiny SuperSOTTM-6 package. Features VDROP=0.2V @ VIN=5V, IL=1.5A. R(ON) = 0.13 VDROP=0.2V @ VIN=3.3V, IL=1.2A. R(ON) = 0.16 VDROP=0.2V @ VIN=2.5V, IL=1A. R(ON) = 0.18. SuperSOTTM-6 package design using copper lead frame for superior thermal and electrical capabilities. SOT-23 SuperSOTTM-6 SuperSOTTM-8 SO-8 SOT-223 SOIC-16 EQUIVALENT CIRCUIT Vin,R1 4 Q2 3 Vout,C1 5 .32 pin 1 ON/OFF 5 Q1 2 IN + VDROP - OUT Vout,C1 ON/OFF R1,C1 6 See Application Circuit 1 R2 SuperSOT -6 TM Absolute Maximum Ratings Symbol VIN VON/OFF IL Parameter Input Voltage Range On/Off Voltage Range Load Current T A = 25C unless otherwise noted FDC6325L 2.5 - 8 1.5 - 8 - Continuous - Pulsed (Note 1) (Note 1 & 3) (Note 2) Units V V A 1.8 5 0.7 -55 to 150 6 PD TJ,TSTG ESD Maximum Power Dissipation Operating and Storage Temperature Range W C kV Electrostatic Discharge Rating MIL-STD-883D Human Body Model (100pf/1500Ohm) THERMAL CHARACTERISTICS RJA RJC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note 2) (Note 2) 180 60 C/W C/W (c) 1998 Fairchild Semiconductor Corporation FDC6325L Rev.D1 Electrical Characteristics (TA = 25C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS IFL VDROP Forward Leakage Current VIN = 8 V, VON/OFF = 0 V VIN = 5 V, VON/OFF = 3.3 V, IL = 1.5 A VIN = 3.3 V, VON/OFF = 3.3 V, IL = 1.2 A VIN = 2.5 V, VON/OFF = 3.3 V, IL = 1 A R(ON) Q2 - Static On-Resistance VGS = -5 V, ID = -1.8 A VGS = -3.3 V, ID = -1.6 A VGS = -2.5 V, ID = -1.5 A IL Load Current VDROP = 0.13 V, VIN = 5 V, VON/OFF = 3.3 V VDROP = 0.16 V, VIN = 3.3 V, VON/OFF = 3.3 V VDROP = 0.2 V, VIN = 2.5V, VON/OFF = 3.3 V Notes: 1. VIN=8V, VON/OFF=8V, TA=25o C 2. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. 3. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%. 1 A ON CHARACTERISTICS (Note 3) Conduction Voltage Drop 0.15 0.145 0.13 0.115 0.13 0.155 1 1 1 0.2 0.2 0.2 0.13 0.16 0.18 A V FDC6325L Load Switch Application APPLICATION CIRCUIT Q2 IN R1 C1 OUT ON/OFF Ci Q1 Co LOAD R2 External Component Recommendation For Co 1uF applications: First select R2, 100 - 1kW, for Slew Rate control. C1 1000pF can be added in addition to R2 for further In-rush current control. Then select R1 such that R1/R2 ratio maintains between 10 - 100. R1 is required to turn Q2 off. For SPICE simulation, users can download a "FDC6325L.MOD" Spice model from Fairchild Web Site at www.fairchildsemi.com FDC6325L Rev.D1 Typical Electrical Characteristics (TA = 25 OC unless otherwise noted ) 0.5 0.5 0.4 0.4 T = 125C A V DROP , (V) V DROP , (V) 0.3 0.3 T = 125C A TA =25C 0.2 0.2 TA =25C 0.1 V IN = 5V V ON/OFF = 1.5 - 8V PW =300us, D 2% 0.1 V IN =3.3V V ON/OFF = 1.5 - 8V PW =300us, D 2% 0 0 1 2 I L ,(A) 3 4 0 0 1 2 I L ,(A) 3 4 Figure 1. Conduction Voltage Drop Variation with Load Current. Figure 2. Conduction Voltage Drop Variation with Load Current. 0.5 0.6 T = 125C A 0.4 V DROP , (V) V DROP ,(V) / R ON ,(Ohm) 0.5 0.4 0.3 0.2 0.1 0 T =125C A I L = 1A V ON/OFF = 1.5 - 8V PW =300us, D 2% TA =25C 0.3 0.2 V IN =2.5V V ON/OFF = 1.5 - 8V PW =300us, D 2% 0.1 TA = 25C 0 0 1 2 I L ,(A) 3 4 1 2 3 V IN ,(V) 4 5 Figure 3. Conduction Voltage Drop Variation with Load Current. Figure 4. On-Resistance Variation with Input Voltage. 1 r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0.00001 D = 0.5 0.2 0.1 0.05 0.02 0.01 Single Pulse P(pk) RJA (t) = r(t) * R JA RJA = See Note 2 t1 t2 TJ - TA = P * R JA(t) Duty Cycle, D = t 1 / t 2 0.001 0.01 0.1 t 1, TIME (sec) 1 10 100 300 0.0001 Figure 5. Transient Thermal Response Curve. Thermal characterization performed on the conditions described in Note 2. Transient thermal response will change depends on the circuit board design. FDC6325L Rev.D1 SuperSOTTM-6 (FS PKG Code 31, 33) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0158 (c) 1998 Fairchild Semiconductor Corporation 9/98 Rev A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM DISCLAIMER ISOPLANARTM MICROWIRETM POPTM PowerTrenchTM QSTM Quite SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 TinyLogicTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The data sheet is printed for reference information only. |
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