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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
PACKAGE
0.050 (1.27) TYP
FODM453
0.181 (4.60) 0.165 (4.20) SEATING PLANE
Pin 1 0.169 (4.30) 0.153 (3.90)
SCHEMATIC
0.008 (0.2) TYP
0.094 (2.40) 0.079 (2.00) 0.287 (7.30) 0.248 (6.30)
ANODE 1
0.008 (0.20) 0 (0.00)
6 VCC
0.020 (0.50) 0.011 (0.30)
5 VO
Lead Coplanarity : 0.004 (0.10) MAX
CATHODE 3
4 GND
Note: All dimensions are in inches (millimeters)
DESCRIPTION
The FODM452 and FODM453 optocouplers consist of an AlGaAs LED optically coupled to a high speed photodetector transistor. The devices are housed in a compact 5-pin mini flat package for optimum mounting density. The FODM453 features a high CMR rating for optimum common mode transient immunity.
FEATURES
* * * * * * Compact 5-pin mini flat package High speed-1 MBit/s Superior CMR-15kV/s at VCM = 1500V (FODM453) Performance guaranteed over temperature (0-70C) U.L. recognized (File # E90700) VDE0884 recognized (File # 136480) - Ordering option V, e.g., FODM452V
APPLICATIONS
* * * * Line receivers Pulse transformer replacement Output interface to CMOS-LSTTL-TTL Wide bandwidth analog coupling
(c) 2003 Fairchild Semiconductor Corporation
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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise specified)
Parameter Storage Temperature Operating Temperature EMITTER DC/Average Forward Input Current Peak Forward Input Current (50% duty cycle, 1 ms P.W.) Peak Transient Input Current - (1 s P.W., 300 pps) Reverse Input Voltage Input Power Dissipation (No derating required over specified operating temp range) DETECTOR Average Output Current Peak Output Current Supply Voltage Output Voltage Output power dissipation (No derating required over specified operating temp range) IO (avg) IO (pk) VCC VO PD IF (avg) IF (pk) IF (trans) VR PD Symbol TSTG TOPR
FODM453
Value -40 to +125 -40 to +85 25 50 1.0 5 45 8 16 -0.5 to 30 -0.5 to 20 100
Units C C mA mA A V mW mA mA V V mW
ELECTRICAL CHARACTERISTICS (TA = 0 to 70C Unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter EMITTER Input Forward Voltage Input Reverse Breakdown Voltage Temperature coefficient of forward voltage DETECTOR (IF = 0 mA, VO = VCC = 5.5 V) (TA =25C) Logic high output current (IF = 0 mA, VO = VCC = 15 V) (TA =25C) (IF = 0 mA, VO = VCC = 15 V) Logic low supply current (IF = 16 mA, VO = Open) (VCC = 15 V) (IF = 0 mA, VO = Open, VCC = 15 V) (TA =25C) (IF = 0 mA, VO = Open) (VCC = 15 V) ICCL 100 0.05 ICCH 2 IOH .001 .001 0.5 1 50 200 1 A A A Test Conditions (IF = 16 mA, TA =25C) (IF = 16 mA) (IR = 10 A) (IF = 16 mA) Symbol VF BVR (VF/TA) 5.0 -1.8 Min Typ** 1.60 Max 1.7 1.8 Unit V V mV/C
Logic high supply current
** All Typicals at TA = 25C
(c) 2003 Fairchild Semiconductor Corporation
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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
TRANSFER CHARACTERISTICS (TA = 0 to 70C Unless otherwise specified)
Parameter COUPLED Current transfer ratio (Note 1) (IF = 16 mA, VCC = 4.5 V) TA = 25C VOL=0.4V VOL=0.5V (IF = 16 mA, IO = 3 mA) (VCC = 4.5 V, TA =25C) (IF = 16 mA, IO = 2.4 mA) (VCC = 4.5 V) CTR 20 15 Test Conditions Symbol Min
FODM453
Typ**
Max
Unit
50
%
Logic low output voltage output voltage ** All Typicals at TA = 25C
0.4 VOL 0.5 V
SWITCHING CHARACTERISTICS (TA = 0 to 70C unless otherwise specified., VCC = 5 V)
Parameter Propagation delay time to logic low Propagation delay time to logic high Common mode transient immunity at logic high Common mode transient immunity at logic low Bandwidth ** All Typicals at TA = 25C Test Conditions (RL = 1.9 k, IF = 16 mA) (Note 2) (Fig. 9) TA = 25C (RL = 1.9 k, IF = 16 mA) (Note 2) (Fig. 9) (RL = 1.9 k, IF = 16 mA) (Note 2) (Fig. 9) TA = 25C (RL = 1.9 k, IF = 16 mA) (Note 2) (Fig. 9) (IF = 0 mA, VCM = 10 VP-P, RL = 1.9 k) (Note 3) (Fig. 10) TA = 25C (IF = 0 mA, VCM = 1500 VP-P) TA = 25C, (RL = 1.9 k) (Note 3) (Fig. 10) (IF = 16 mA, VCM = 10 VP-P, RL = 1.9 k) (Note 3) (Fig. 10) TA = 25C (IF = 16 mA, VCM = 1500 VP-P) (RL = 1.9 k) (TA = 25C)(Note 3) (Fig. 10) RL = 100 |CML| FODM453 BW 15 40 3 KV/s MHz |CMH| FODM453 15 40 KV/s FODM452 5 15 Symbol TPHL Device Min Typ** Max 0.40 0.8 1.0 0.35 0.8 1.0 Unit s s s s KV/s
TPLH
FODM452
5
15
KV/s
(c) 2003 Fairchild Semiconductor Corporation
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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
ISOLATION CHARACTERISTICS (TA = 0 to 70C Unless otherwise specified)
Characteristics Withstand insulation test voltage Capacitance (input to output) ** All Typicals at TA = 25C Test Conditions (RH 50%, TA = 25C) (Note 4) ( t = 1 min.) (Note 4) (f = 1 MHz) Symbol VISO CI-O Min 3750 0.2 Typ**
FODM453
Max
Unit VRMS pF
Notes 1. Current Transfer Ratio is defined as a ratio of output collector current, IO, to the forward LED input current, IF, times 100%. 2. The 1.9 k load represents 1 TTL unit load of 1.6 mA and 5.6 k pull-up resistor. 3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dVcm/dt on the leading edge of the common mode pulse signal VCM, to assure that the output will remain in a logic high state (i.e., VO>2.0 V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dVcm/dt on the trailing edge of the common mode pulse signal, VCM, to assure that the output will remain in a logic low state (i.e., VO<0.8 V). 4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted together.
(c) 2003 Fairchild Semiconductor Corporation
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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
TYPICAL PERFORMANCE CURVES
Fig. 1 Input Forward Current vs Forward Voltage
NORMALIZED CURRENT TRANSFER RATIO
100 TA = 25C
FODM453
Fig. 2 Normalized Current Transfer Ratio vs. Input Current
1.20 VO = 0.4V VCC = 5 V TA = 25C Normalized to IF = 16mA
IF - FORWARD CURRENT (mA)
10
1.15
1.10
1
1.05
0.1
1.00
0.01
0.95
0.001 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
0.90 1 10
VF - FORWARD CURRENT (mA)
I F - INPUT CURRENT (mA)
Fig. 3 Normalized Current Transfer Ratio vs. Ambient Temperature
NORMALIZED CURRENT TRANSFER RATIO
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 IF = 16mA VO = 0.4V VCC = 5 V Normalized to TA = 25C
Fig. 4 Logic High Output Current vs. Ambient Temperature
IOH - LOGIC HIGH OUTPUT CURRENT (nA)
VO = VCC = 5V IF = 0 V 10
1
-20
0
20
40
60
80
100
0.1 -40
-20
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE
TA - TEMPERATURE (C)
Fig. 5 DC and Pulsed Transfer Characteristics
14 TA = 25C VCC = 5 V IF = 40mA 10 35mA 30mA 8 25mA 6 20mA 15mA 4 10mA 2 5mA 10
Fig. 6 Propagation Delay vs. Load Resistance
TA = 25C VCC = 5 V
PROPAGATION DELAY - tP (s)
12
IO - OUTPUT CURRENT (mA)
IF = 16mA IF = 10mA
1
tPLH
tPHL
0 0 2 4 6 8 10 12 14 16
0.1 1 2 3 4 5 6 7 8 9 10
VO - OUTPUT VOLTAGE (V)
RL = LOAD RESISTANCE (k)
(c) 2003 Fairchild Semiconductor Corporation
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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
TYPICAL PERFORMANCE CURVES
Fig. 7 Propagation Delay vs. Ambient Temperature
1400 IF = 16 mA VCC = 5V RL = 1.9K 5 IF = 16 mA VCC = 5V TA = 25C 0
FODM453
Fig. 8 Frequency Response
1200
tP - PROPAGATION DELAY (ns)
1000
NORMALIZED RESPONSE (dB)
RL = 220 RL = 100
800
-5 RL = 470
600 tPHL 400 tPLH 200
-10 RL = 1k
0 -40 -20 0 20 40 60 80 100
-15 0.01
0.1
1
10
TA - AMBIENT TEMPERATURE (C)
f - FREQUENCY (MHz)
(c) 2003 Fairchild Semiconductor Corporation
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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
Pulse Generator I F tr = 5ns Z O = 50 10% D.C. I/f < 100s Noise Shield
FODM453
+
1
6 5
VCC RL
+5 V
VO
VO 0.1 F
I F Monitor Rm
3
4
GND
C L = 1.5 F
IF 0
VO
5V
1.5 V
1.5 V VOL
TPHL
TPLH
Fig. 9 Switching Time Test Circuit
IF Noise Shield
+
1
A B VFF
6 5
VCC
+5 V RL VO 0.1 F
VO
3
+
VCM
4
-
GND
-
Pulse Gen
VCM 10 V 10% tr VO Switch at A : IF = 0 mA VO
90%
90% 10% tf
0V
5V
VOL
Switch at A : IF = 16 mA
Fig. 10 Common Mode Immunity est Circuit T
(c) 2003 Fairchild Semiconductor Corporation
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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
FOOTPRINT DRAWING FOR PCB LAYOUT
FODM453
0.024 (0.61)
0.050 0.050 0.050 (1.27) (1.27) (1.27)
Device `A'
Device `B'
0.190 (4.83)
0.310 (7.87)
Pin 1 0.060 (1.52)
Pin 1
0.100 (2.54) End Stacking Configuration Dimensions in inches (mm) Unutilized Solder Pad
(c) 2003 Fairchild Semiconductor Corporation
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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
ORDERING INFORMATION
Option R1 R2 V R1V R2V Tape and Reel (500 per reel) Tape and Reel (2500 per reel) VDE0884 VDE0884, Tape and Reel (500 per reel) VDE0884, Tape and Reel (2500 per reel) Description
FODM453
MARKING INFORMATION
1
M453 V
3 4
2 6
X YY M
5
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code, e.g., `3' Two digit work week ranging from `01' to `53' Assembly package code
(c) 2003 Fairchild Semiconductor Corporation
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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
Carrier Tape Specifications
3.5 0.2 4.0 0.1 8.0 0.1 2 0.05 0.3 MAX O1.5 MIN
FODM453
1.75 0.10
5.5 0.05 8.3 0.1 12.0 0.3 5.2 0.2
0.1 MAX
6.4 0.2 User Direction of Feed
O1.5 + 0.1/-0
Reflow Profile
(Heating) to 30 s Package Surface Temperature T (C) 230C (peak temperature) 210C 180C to 60 s
150 s Time (s)
90 s
80 s
* Peak reflow temperature: 230C (package surface temperature) for 30 seconds * Time of temperature higher than 210C: 60 seconds or less * One time soldering reflow is recommended
(c) 2003 Fairchild Semiconductor Corporation
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5-PIN MINI FLAT PACKAGE HIGH SPEED TRANSISTOR OPTOCOUPLERS
FODM452
FODM453
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
(c) 2003 Fairchild Semiconductor Corporation
Page 11 of 11
4/12/04

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