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| Silicon Spreading Resistance Temperature Sensor in Robust Threaded Metal Housing Features * Temperature dependent Resistor with Positive Temperature Coefficient * Selected at 25 C, R25 = 2000 1% * Corrosion resistant stainless steel housing with connector socket * Fast response * High long-term stability * excellent linearity * Robust threaded housing * Mating splash-proof connector set available Test voltage: Isolation voltage: Test duration: Insertion torque: Type KTY 19-6M KTY 19-6Z Marking 1000 V ~ 100 V ~ 1s max. 30 Nm Thread Ordering Code Q62705K271 Pin Configuration 1 2 KTY 19-6 M/Z Package KTY 19M ISO M10x1 electrical electrical BSS303 contact contact DIN 1.4305 electrical electrical stainless contact contact steel - - housing: potential free KTY 19Z NPTF Q627051/8" x 27 K272 - Q62901B80 Connector Set - (Splash-proof) Absolute Maximum Ratings Parameter Maximum operating voltage 1) TA 25 C, t 10 ms Maximum operating current Peak operating current TA 25 C, t 10 ms Operating temperature range Storage temperature range 1) Symbol Limit Values 25 5 7 - 50 ... + 150 - 50 ... + 150 Unit V mA mA C C Vopmax Iopmax Iopp Top Tstg ESD Class 1. When the temperature sensor is operated with long supply leads, it should be protected through the parallel connection of a > 10 nF capacitor to prevent damage to the sensor through induced voltage peaks. Semiconductor Group 1 1997-10-01 KTY 19-6 M/Z Electrical Characteristics at TA = 25 C unless otherwise specified Parameter Temperature sensor resistance IB = 1 mA KTY 19-6M/Z Thermal time constant (63 % of TA) in still air in still oil (Freon FC40/PP7) Package Outline Stainless Steel Housing, BSS303 (equiv. DIN 1.4305) 48.6 0.5 9 6 12 b SW17 12 Symbol min. Limit Values typ. max. Unit R25 1980 air oil - - 40 4 2020 - - s 17 45 No undercut Plug-in socket connects with AMP Junior Timer a Spade terminals A2.8x0.8 DIN 46244 without hole SW17 13.5 Weight approx. 20 g 5 30 M10x1 or NPTF 1/8x27 O3.8 GMX05639 Dimensions in mm Exterior Packaging I.e. tubes, trays, boxes are shown in our Data Book "Package Information". Semiconductor Group 2 1997-10-01 5 |
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