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Datasheet File OCR Text: |
Advanced Power MOSFET FEATURES n Avalanche Rugged Technology n Rugged Gate Oxide Technology n Lower Input Capacitance n Improved Gate Charge n Extended Safe Operating Area n Lower Leakage Current : 25 A (Max.) @ VDS = 900V n Low RDS(ON) : 4.679 (Typ.) SSS3N90A BVDSS = 900 V RDS(on) = 6.2 ID = 2 A TO-220F 1 2 3 1.Gate 2. Drain 3. Source Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt PD TJ , TSTG TL Characteristic Drain-to-Source Voltage Continuous Drain Current (TC=25) Continuous Drain Current (TC=100) Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (TC=25) Linear Derating Factor Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8? from case for 5-seconds Value 900 2 1.3 12 30 286 2 3.5 1.5 35 0.28 - 55 to +150 Units V A A V mJ A mJ V/ns W W/ 300 Thermal Resistance Symbol RJC RJA Characteristic Junction-to-Case Junction-to-Ambient Typ. --Max. 3.57 62.5 Units /W Rev. A SSS3N90A Electrical Characteristics (TC=25 unless otherwise specified) Symbol BVDSS BV/TJ VGS(th) IGSS IDSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd Characteristic Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coeff. Gate Threshold Voltage Gate-Source Leakage , Forward Gate-Source Leakage , Reverse Drain-to-Source Leakage Current Static Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain(iller? Charge Min. Typ. Max. Units 900 -2.0 -----------------1.13 ------1.78 590 55 22 16 26 47 24 28 5.5 11.9 --3.5 100 -100 25 250 6.2 -770 65 28 40 60 105 60 37 --nC ns pF V V/ V nA N-CHANNEL POWER MOSFET Test Condition VGS=0V,ID=250A ID=250A VGS=30V VGS=-30V VDS=900V VDS=720V,TC=125 VGS=10V,ID=1A VDS=50V,ID=1A See Fig 7 VDS=5V,ID=250A A S VGS=0V,VDS=25V,f =1MHz See Fig 5 VDD=450V,ID=3A, RG=16 See Fig 13 VDS=720V,VGS=10V, ID=3A See Fig 6 & Fig 12 Source-Drain Diode Ratings and Characteristics Symbol IS ISM VSD trr Qrr Characteristic Continuous Source Current Pulsed-Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Min. Typ. Max. Units --------380 1.9 2 12 1.4 --A V ns C Test Condition Integral reverse pn-diode in the MOSFET TJ=25,IS=2A,VGS=0V TJ=25,IF=3A diF/dt=100A/s Notes ; Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature L=135mH, IAS=2A, VDD=50V, RG=27, Starting TJ =25 ISD3A, di/dt90A/s, VDDBVDSS , Starting TJ =25 Pulse Test : Pulse Width = 250s, Duty Cycle 2% Essentially Independent of Operating Temperature N-CHANNEL POWER MOSFET Fig 1. Output Characteristics 11 0 Top : VGS 15V 10 V 8.0 V 7.0 V 6.0 V 5.5V 5.0 V Bottom : 4.5V SSS3N90A Fig 2. Transfer Characteristics 1 0 1 ID , Drain Current [A] 10 0 ID , Drain Current [A] 10 0 1 0 oC 5 2 oC 5 @Nts: oe 1 V =0V . GS 2 V =5 V . DS 0 us et 3 2 0 s P l e T s .5 6 8 1 0 1 -1 0 @Nts: oe 1 2 0 s P l e T s .5 us et 2 T = 2 oC .C 5 10 0 11 0 - 5 oC 5 1 -1 0 1 -2 -1 0 1 0 2 4 VDS , Drain-Source Voltage [V] VGS , Gate-Source Voltage [V] Fig 3. On-Resistance vs. Drain Current 2 5 11 0 Fig 4. Source-Drain Diode Forward Voltage IDR , Reverse Drain Current [A] RDS(on) , [ ] Drain-Source On-Resistance 2 0 V =1 V 0 GS 1 5 10 0 1 0 V =2 V 0 GS 5 @ N t : T = 2 oC oe J 5 0 0 3 6 9 1 2 1 -1 0 @Nts: oe 1 V =0V . GS 2 2 0 s P l e T s .5 us et 08 . 10 . 12 . 1 0 oC 5 2 oC 5 1 -2 0 02 . 04 . 06 . ID , Drain Current [A] VSD , Source-Drain Voltage [V] Fig 5. Capacitance vs. Drain-Source Voltage 10 00 C =C +C (C =sotd) iss gs gd ds h r e C =C +C oss ds gd C =C rss gd Fig 6. Gate Charge vs. Gate-Source Voltage V =10V 8 DS V =40V 5 DS V =70V 2 DS 80 0 1 0 C iss 60 0 VGS , Gate-Source Voltage [V] Capacitance [pF] 40 0 @Nts: oe 1 V =0V . GS 2 f=1Mz . H 5 20 0 C oss C rss @Nts:I =30A oe . D 0 0 5 1 0 1 5 2 0 2 5 3 0 00 1 0 11 0 VDS , Drain-Source Voltage [V] QG , Total Gate Charge [nC] SSS3N90A Fig 7. Breakdown Voltage vs. Temperature 12 . 30 . N-CHANNEL POWER MOSFET Fig 8. On-Resistance vs. Temperature BVDSS , (Normalized) Drain-Source Breakdown Voltage 11 . RDS(on) , (Normalized) Drain-Source On-Resistance 25 . 20 . 10 . 15 . 10 . @Nts: oe 1 V =1 V . GS 0 2 I =15A .D . -0 5 -5 2 0 2 5 5 0 7 5 10 0 15 2 10 5 15 7 09 . @Nts: oe 1 V =0V . GS 2 I = 2 0 A .D 5 -0 5 -5 2 0 2 5 5 0 7 5 10 0 15 2 10 5 15 7 05 . 08 . -5 7 00 . -5 7 TJ , Junction Temperature [oC] TJ , Junction Temperature [oC] Fig 9. Max. Safe Operating Area 12 0 Oeaini Ti Ae prto n hs ra i L m t d b R DS(on) s iie y Fig 10. Max. Drain Current vs. Case Temperature 25 . ID , Drain Current [A] 11 0 1 0 s 0 1m s 1 0 0 1 s 0 ID , Drain Current [A] 20 . 15 . 1m 0s 10m 0s D C 10 . 1 -1 0 @Nts: oe 1 T = 2 oC .C 5 2 T = 1 0 oC .J 5 3 Snl Ple . ige us 05 . 1 -2 0 11 0 12 0 13 0 00 . 2 5 5 0 7 5 10 0 15 2 10 5 VDS , Drain-Source Voltage [V] Tc , Case Temperature [oC] Fig 11. Thermal Response Thermal Response D=0.5 100 0.2 0.1 0.05 10- 1 0.02 0.01 single pulse 10 -2 @ Notes : 1. Z J C (t)=3.57 o C/W Max. 2. Duty Factor, D=t1 /t2 3. TJ M -TC =PD M *Z J C (t) PDM t1 t2 Z (t) , JC 10- 5 10- 4 10- 3 10- 2 10- 1 100 101 t1 , Square Wave Pulse Duration [sec] N-CHANNEL POWER MOSFET Fig 12. Gate Charge Test Circuit & Waveform SSS3N90A Current Regulator 50K 12V 200nF 300nF Same Type as DUT VDS VGS Qg 10V VGS DUT 3mA Qgs Qgd R1 Current Sampling (IG) Resistor R2 Current Sampling (ID) Resistor Charge Fig 13. Resistive Switching Test Circuit & Waveforms Vout Vin RG DUT 10V RL Vout VDD ( 0.5 rated VDS ) 90% Vin 10% td(on) t on tr td(off) t off tf Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms LL VDS Vary tp to obtain required peak ID BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD BVDSS IAS C VDD VDD tp ID RG DUT 10V tp ID (t) VDS (t) Time SSS3N90A Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms N-CHANNEL POWER MOSFET DUT + VDS -- IS L VGS RG VGS Driver Same Type as DUT VDD * dv/dt controlled by "RG" * IS controlled by Duty Factor "D" VGS ( Driver ) Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) IRM di/dt Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf VDD Body Diode Forward Voltage Drop |
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