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T1620W T1630W
SNUBBERLESS TRIAC
FEATURES ITRMS = 16 A VDRM = VRRM = 400V to 700V EXCELLENT SWITCHING PERFORMANCES INSULATING VOLTAGE = 1500V(RMS) U.L. RECOGNIZED : E81734 DESCRIPTION The T1620/1630W triacs use high performance glass passivated chip technology, housed in a fully molded plastic ISOWATT220AB package. The SNUBBERLESSTM concept offers suppression of R-C network, and is suitable for applications such as phase control and static switch on inductive and resistive loads. ABSOLUTE RATINGS (limiting values) Symbol IT(RMS) ITSM RMS on-state current (360 conduction angle) Non repetitive surge peak on-state current (Tj initial = 25C ) Parameter Tc= 75C tp = 16.7 ms (1 cycle, 60 Hz) tp = 10 ms (1/2 cycle, 50 Hz) I2 t dI/dt I2t Value (half-cycle, 50 Hz) Critical rate of rise of on-state current Gate supply : IG = 500 mA dIG /dt = 1 A/s. tp = 10 ms Repetitive F = 50 Hz Non Repetitive Tstg Tj Tl Storage temperature range Operating junction temperature range Maximum lead temperature for soldering during 10s at 4.5 mm from case Parameter 400 VDRM VRRM
April 1995
A2
A1
G
A1 A2 G
ISOWATT220AB (Plastic)
Value 16 165 195 190 20 100 - 40 to + 150 - 40 to + 125 260
Unit A A
A2s A/s
C C
Symbol
T1620 / 1630-xxxW 600 600 700 700
Unit
Repetitive peak off-state voltage Tj = 125C
400
V
1/5
T1620W / 1630W
THERMAL RESISTANCES Symbol Rth(j-a) Rth(j-c) Junction to ambient Junction to case for A.C (360 conduction angle) Parameter Value 50 2.5 Unit C/W C/W
GATE CHARACTERISTICS (maximum values) PG (AV)= 1 W PGM = 10 W (tp = 20 s) ELECTRICAL CHARACTERISTICS Symbol IGT VGT VGD tgt IH * VTM * IDRM IRRM dV/dt * (dV/dt)c * Test Conditions VD=12V (DC) RL=33 VD=12V (DC) RL=33 VD=VDRM RL=3.3k VD=VDRM IG = 500mA dlG/dt= 3As IT= 250mA Gate open Tj= 25C Tj= 25C Tj= 125C Tj= 25C Tj= 25C Tj= 25C Tj= 25C Tj= 125C Linear slope up to Gate open VD=67%VDRM (dI/dt)c = 9 A/ms (see note) Tj= 125C Tj= 125C Quadrant I-II-III I-II-III I-II-III I-II-III MAX MAX MIN TYP MAX MAX MAX MAX MIN MIN 200 10 35 1.5 10 2 300 20 T1620 20 1.5 0.2 2 50 V A mA V/s V/s T1630 30 Unit mA V V s IGM = 4 A (tp = 20 s)
ITM= 22.5A tp= 380s VDRM rated VRRM rated
* For either polarity of electrode A2 voltage with reference to electrode A1. Note : In usual applications where (dI/dt)c is below 9 A/ms, the (dV/dt)c is always lower than 10V/s, and, therefore, it is unnecessary to use a snuber R-C network accross T1620W / T1630W triacs.
2/5
(R)
T1620W / 1630W
Fig.1 : Maximum power dissipation versus RMS on-state current. Fig.2 : Correlation between maximum power dissipation and maximum allowable temperature (Tamb and Tcase) for different thermal resistances heatsink + contact.
P (W)
180 O
P(W)
Tcase (o C) Rth = 0 o C/W 1 o C/W o 2 C/W 4 o C/W
25 20 15 10 5
= 180 = 120 = 90
o o o
o
25 20 15
-60 -70 -80 -90
= 60 = 30
o
10 5
-100 -110
Tamb ( C)
o
I T(RMS) (A)
0 012 345 678 9 10 11 12 13 14 15 16
-120 40 60 80 100 120 140
0 0
20
Fig.3 : RMS on-state current versus case temperature.
Fig.4 : Thermal transient impedance junction to case and junction to ambient versus pulse duration.
Zth/Rth 1
Zth (j-c)
20
I T(RMS) (A)
15
= 180
o
0.1
Zt h( j-a)
10
0.01
5 Tcase ( C) 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130
1E-3 1E-2 1E-1 1E +0 1E +1
o
tp (s)
1 E+2 5 E +2
Fig.5 : Relative variation of gate trigger current and holding current versus junction temperature.
Igt[Tj] o Igt[Tj=25 C] Ih[Tj] o Ih[Tj=25 C]
Fig.6 : Non repetitive surge peak on-state current versus number of cycles.
ITSM(A)
200
2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 Igt
Tj initial = 25 C
150
o
100
Ih
50
Tj(oC)
Number of cycles
-40
-20
0
20
40
60
80
100
120 140
0
1
10
100
1000
3/5
(R)
T1620W / 1630W
Fig.7 : Non repetitive surge peak on-state current for a sinusoidal pulse with width : tp 10ms, and corresponding value of I2t.
I TSM (A). I2 t (A 2 s)
Fig.8 : On-state characteristics (maximum values).
I TM (A)
Tj initial = 25oC
1000
1000
I TSM
I2 t
Tj initial o 25 C
100 100
Tj max
10
Tj max Vto =0.9V Rt =0.02 4
tp(ms)
VTM (V)
10 1
10
1 0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
4/5
(R)
T1620W / 1630W
PACKAGE MECHANICAL DATA ISOWATT220AB REF.
A B B1 C D E H I J L M N N1 O P
DIMENSIONS Millimeters Inches Min.
10 15.9 9.8 28.6 16 typ 9 4.4 3 2.5 0.4 2.5 4.95 2.4 1.15 0.75 9.3 4.6 3.2 2.7 0.7 2.75 5.2 2.7 1.7 1
Max.
10.4 16.4 10.6 30.6
Min.
0.393 0.626 0.385 1.126 0.630 0.354 0.173 0.118 0.098 0.015 0.098 0.195 0.094 0.045 0.030
Max.
0.409 0.645 0.417 1.204 typ 0.366 0.181 0.126 0.106 0.027 0.108 0.204 0.106 0.067 0.039
Cooling method : C Marking : Type number Weight : 2.1g Recommended torque value : 0.55 m.N. Maximum torque value : 0.70 m.N.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THO MSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.
(c) 1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
5/5
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