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| Advanced Technical Information DSEP 30-12CR HiPerDynFREDTM with soft recovery (Electrically Isolated Back Surface) IFAV = 30 A VRRM = 1200 V trr = 20 ns VRSM V 1200 VRRM V 1200 Type A C ISOPLUS 247TM C A Isolated back surface * DSEP 30-12CR A = Anode, C = Cathode * Patent pending Symbol IFRMS IFAVM IFRM IFSM EAS IAR TVJ TVJM Tstg Ptot VISOL Weight Conditions TC = 85C; rectangular, d = 0.5 tP < 10 s; rep. rating, pulse width limited by TVJM TVJ = 45C; tp = 10 ms (50 Hz), sine TVJ = 25C; non-repetitive IAS = 1.3 A; L = 180 H VA = 1.25*VR typ.; f = 10 kHz; repetitive Maximum Ratings 70 30 tbd 250 0.2 0.1 -55...+175 175 -55...+150 A A A A mJ A C C C W kV N/lb. g Features q q q q q q q q q q TC = 25C 50/60 Hz RMS; IISOL 1 mA typical 165 2.5 10...50/2...10 6 Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation Low cathode to tab capacitance (<25pF) International standard package Planar passivated chips Very short recovery time Extremely low switching losses Low IRM-values Soft recovery behaviour Epoxy meets UL 94V-0 Isolated and UL registered E153432 Mounting force with clip Applications q q q q Symbol IR x Conditions TVJ = 25C VR = VRRM TVJ = 150C VR = VRRM IF = 30 A; TVJ = 150C TVJ = 25C Characteristic Values typ. max. 250 2 3.1 5.0 0.9 0.25 20 4.0 A mA V V K/W K/W ns q q q q VF y RthJC RthCH t rr IRM Antiparallel diode for high frequency switching devices Antisaturation diode Snubber diode Free wheeling diode in converters and motor control circuits Rectifiers in switch mode power supplies (SMPS) Inductive heating Uninterruptible power supplies (UPS) Ultrasonic cleaners and welders Advantages q with heatsink compound IF = 1 A; -di/dt = 200 A/s; VR = 30 V; TVJ = 25C VR = 100 V; IF = 50 A; -diF/dt = 100 A/s TVJ = 100C q q A Pulse test: x Pulse Width = 5 ms, Duty Cycle < 2.0 % y Pulse Width = 300 s, Duty Cycle < 2.0 % Data according to IEC 60747 and per diode unless otherwise specified q Avalanche voltage rated for reliable operation Soft reverse recovery for low EMI/RFI Low IRM reduces: - Power dissipation within the diode - Turn-on loss in the commutating switch ISOPLUS 247TM package for clip or spring mounting Dimensions see IXYS CD 2000 008 IXYS reserves the right to change limits, test conditions and dimensions. (c) 2000 IXYS All rights reserved 1-1 |
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