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FDG6331L April 2001 FDG6331L Integrated Load Switch General Description This device is particularly suited for compact power management in portable electronic equipment where 2.5V to 8V input and 0.8A output current capability are needed. This load switch integrates a small N-Channel power MOSFET (Q1) that drives a large P-Channel power MOSFET (Q2) in one tiny SC70-6 package. Features * -0.8 A, -8 V. RDS(ON) = 260 m @ VGS = -4.5 V RDS(ON) = 330 m @ VGS = -2.5 V RDS(ON) = 450 m @ VGS = -1.8 V Applications * Power management * Load switch * Control MOSFET (Q1) includes Zener protection for ESD ruggedness (>6KV Human body model) * High performance trench technology for extremely low RDS(ON) * Compact industry standard SC70-6 surface mount package Q2 Equivalent Circuit 3 2 Q1 Vin,R1 ON/OFF R1,C1 4 5 6 Vout,C1 IN Vout,C1 R2 + V DROP - OUT 1 See Application Circuit Pin 1 ON/OFF SC70-6 Absolute Maximum Ratings Symbol VIN VON/OFF ILoad PD TJ, TSTG Gate-Source Voltage (Q2) Gate-Source Voltage (Q1) Load Current - Continuous - Pulsed Maximum Power Dissipation TA=25oC unless otherwise noted Parameter Ratings 8 -0.5 to 8 (Note 2) (Note 2) (Note 1) Units V V A W C -0.8 -2.4 0.3 -55 to +150 Operating and Storage Junction Temperature Range Thermal Characteristics RJA Thermal Resistance, Junction-to-Ambient (Note 1a) 415 C/W Package Marking and Ordering Information Device Marking .31 Device FDG6331L Reel Size 7'' Tape width 8mm Quantity 3000 units 2001 Fairchild Semiconductor Corporation FDG6331L Rev B(W) FDG6331L Electrical Characteristics Symbol BVIN ILoad IFL IRL TA = 25C unless otherwise noted Parameter Vin Breakdown Voltage Zero Gate Voltage Drain Current Leakage Current, Forward Leakage Current, Reverse (Note 2) Test Conditions VON/OFF = 0 V, ID = -250 A VIN = -6.4 V, VON/OFF = 0 V VON/OFF = 0 V, VIN = 8 V VON/OFF = 0 V, VIN = -8 V VIN = VON/OFF, ID = -250 A VIN = 4.5 V, VIN =2.5 V, VIN = 1.8 V, VIN = 4.5 V, VIN = 2.7 V, ID = -0.8 A ID = -0.7 A ID = -0.6 A ID = 0.4A ID = 0.2 A Min 8 Typ Max Units V -1 100 -100 A nA nA Off Characteristics On Characteristics VON/OFF (th) RDS(on) Gate Threshold Voltage Static Drain-Source On-Resistance (Q2) Static Drain-Source On-Resistance (Q1) 0.4 0.9 155 193 248 310 380 1.5 260 330 450 400 500 -0.25 -1.2 V m RDS(on) m Drain-Source Diode Characteristics and Maximum Ratings IS VSD Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage VON/OFF = 0 V, IS = -0.25 A(Note 2) A V Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RJA is determined by the user's board design. 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%. FDG6331L Load Switch Application Circuit IN R1 Q2 C1 OUT Q1 LOAD ON/OFF R2 External Component Recommendation: For additional in-rush current control, R2 and C1 can be added. For more information, see application note AN1030. FDG6331L Rev B (W) FDG6331L Typical Characteristics 1 VIN = -1.8V VON/OFF = -1.5-8V PW = 300us, D < 2% 1 VIN = -2.5V VON/OFF = -1.5-8V PW = 300us, D < 2% 0.8 0.8 TJ = 125OC -VDROP, (V) 0.6 TJ = 125OC 0.4 TJ = 25OC 0.2 0.2 -VDROP, (V) 0.6 TJ = 25OC 0.4 0 0 0.4 0.8 1.2 -IL, (A) 1.6 2 2.4 0 0 0.4 0.8 1.2 -IL, (A) 1.6 2 2.4 Figure 1. Conduction Voltage Drop Variation with Load Current. 1 VIN = -4.5V VON/OFF = -1.5-8V PW = 300us, D < 2% 0.6 Figure 2. Conduction Voltage Drop Variation with Load Current. I L = -1A V ON/OFF = 1.5 - 8V PW = 300us, D < 2% RDS(ON), ON-RESISTANCE () 0.8 0.5 0.4 T J = 125 O C 0.3 -VDROP, (V) 0.6 TJ = 125 C 0.4 O 0.2 T J = 25 O C 0.1 0.2 TJ = 25OC 0 0 0.4 0.8 1.2 -IL, (A) 1.6 2 2.4 0 1.25 2 2.75 3.5 -V IN, INPUT VOLTAGE (V) 4.25 5 Figure 3. Conduction Voltage Drop Variation with Load Current. Figure 4. On-Resistance Variation With Input Voltage FDG6331L Rev B (W) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM DISCLAIMER FAST FASTrTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM PowerTrench QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER SMART STARTTM Star* PowerTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM UltraFET VCXTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H1 |
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