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E2A0014-16-X0
Semiconductor MSM7512B
Semiconductor 1200 bps Half Duplex FSK Modem - ITU-T V.23
This version: MSM7512B Jan. 1998 Previous version: Nov. 1996
GENERAL DESCRIPTION
The MSM7512B is useful for the ITU-T V.23 modem, for examples, low cost built-in modems, telecontrol systems, home security systems, etc. The family version, MSM7510 for ITU-T V.21, will be available following this device. Oki has been mass-producing and delivering the MSM6926 and 6927 for a long time, but these devices need two power supplies, +5 V for digital and +12 V for analog. New generation devices, MSM7510/7512B, work with single rail +3 V to +5 V and low power consumption.
FEATURES
* Conforms to ITU-T V.23, 1200 bps Half Duplex * Conforms to ITU-T V.23, 75 bps transmitter * Single Power Supply: +3 V to +5 V * Low Power Consumption Operating Mode: 25 mW Typ. Power Down Mode: 0.1 mW Max. * Line Hybrid Circuit on Chip * Line Direct Drive Capability of Analog Output * 3.579545 MHz Crystal Oscillator * Digital Interface: TTL * Package options: 16-pin plastic DIP (DIP16-P-300-2.54) (Product name: MSM7512BRS) 24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM7512BGS-K)
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Semiconductor
MSM7512B
BLOCK DIAGRAM
AI (2)
+ -
Demodulator FSK & ANS Bandpass Filter Modulator *R3 *R2
-
*R1
*R1 *R2 *R2
+
AOG
RD (9) CD (10) XD (11) RS (12)
AO (3) EAI (4) X1 (6) X2 (7) CLK (8) VDD (1) GND (5)
TEST (13) OSC CLK GEN. CONT. MOD2 (15) SG GEN. AOG (16) MOD1 (14)
* R1 to R3 50 kW ( ) : for MSM7512BRS
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Semiconductor
MSM7512B
PIN CONFIGURATION (TOP VIEW)
VDD 1 AI 2 AO 3 EAI 4 GND 5 X1 6 X2 7 CLK 8 16-Pin Plastic DIP
16 AOG 15 MOD2 14 MOD1 13 TEST 12 RS 11 XD 10 CD 9 RD
VDD 1 NC 2 AI 3 NC 4 AO 5 EAI 6 GND 7 X1 8 NC 9 X2 10 NC 11 CLK 12 24-Pin Plastic SOP NC : No connect pin
24 AOG 23 NC 22 MOD2 21 NC 20 MOD1 19 TEST 18 RS 17 XD 16 NC 15 CD 14 NC 13 RD
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Semiconductor
MSM7512B
PIN DESCRIPTION
No. RS GS-VK 1 2 3 4 5 6 7 8 9 1 3 5 6 7 8 10 12 13
Name VDD AI AO EAI GND X1 X2 CLK RD
I/O -- I O I -- I O O O +3 V to +5 V Power Supply Analog receive signal input.
Description
Analog transmit signal output. External analog signal input. The signal applied to this pin is transmitted from AO via transmit output amplifier. When not using this pin, it should be left open. Ground, 0 V. 3.579545 MHz crystal resonator should be connected to X1 and X2. When applying external clock 3.579545 MHz to the device, it should be applied to X2 (not X1) via an AC-coupling capacitor of 100 pF and X1 has to be opened. 3.579545 MHz clock signal output. Modem receive serial data output. Digital "1" and "0" correspond to "Mark" and "Space", respectively. When CD (Carrier Detect) is off, RD is held at "Mark" state. FSK Receive signal and answer tone detect. Digital "0" and "1" represent "Detect" and "Non-detect", respectively. Modem transmit serial data input. Digital "1" and "0" correspond to "Mark" and "Space", respectively. FSK signal and answer tone transmit enable. When digital "0" is applied to RS, transmitting becomes enable. Chip test input. TEST should be open or digital "1". Operation mode select. Refer to Table 1. Analog transmit signal amplitude select. Digital "1" AE -10 dBm Typ. at AO Digital "0" AE -4 dBm Typ. at AO
10 11 12 13 14 15 16
15 17 18 19 20 22 24
CD XD RS TEST MOD1 MOD2 AOG
O I* I* I* I* I* I*
Note :
I* : Internally pulled-up input pin.
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Semiconductor
MSM7512B
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol VDD VIN TSTG Condition Ta = 25C, With respect to GND -- Rating -0.3 to +7 -0.3 to VDD + 0.3 -55 to +150 Unit V V C
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Operating Temperature Input Clock Frequency VDD Bypass Capacitor Oscillation Frequency Frequency Deviation Temperature Characteristics Equivalent Series Resistance Load Capacitance Symbol VDD Top fCLK CVDD -- -- -- -- -- Condition -- -- To 3.579545 MHz VDD - GND -- +25C 5C -40C to +85C -- -- Min. +2.7 -40 -0.1 10 -- -100 -50 -- -- Typ. -- -- -- -- 3.579545 -- -- -- 16 Max. +5.5 +85 +0.1 -- -- +100 +50 50 -- Unit V C % mF MHz ppm ppm W pF
ELECTRICAL CHARACTERISTICS
DC Characteristics
( VDD = +2.7 V to +5.5 V, Top = -40C to +85C) Parameter Power Supply Current Digital Input Voltage Digital Input Leakage Current Digital Output Voltage Symbol IDD ISS VIL VIH IIL IIH VOL VOH Condition Operating Mode Power Down Mode -- -- VI = 0 V * VI = 5 V IOL = 1.6 mA IOH = -0.4 mA Min. -- -- 0 2.2 -80 -10 0 2.4 Typ. 5.0 5.0 -- -- -- -- 0.2 -- Max. 10.0 20.0 0.8 VDD 10 10 0.4 VDD Unit mA mA V V mA mA V V
Crystal
*
Internally pulled-up pins
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Semiconductor AC Characteristics Modulator/analog output (AO) characteristics
MSM7512B
(VDD = +2.7 V to +5.5 V, Top = -40C to +85C) Parameter FSK Transmit Signal Frequency FSK Transmit Signal Answer Tone amplitude Analog External Input Signal Gain FSK Transmit Signal Amplitude Ratio Out-of-band Energy Output Offset Voltage Output Load Resistance 4 kHz to 8 kHz VSPS VOFF RAO P : In-band Signal Energy To VDD/2 -- 8 kHz to 12 kHz More than12 kHz -- -- -- -150 600 -- -- -- -- -- P-20 P-40 P-60 +150 -- dB dB dB mV W VAOD VAO(MARK) - VAO(SPACE) -2 0 2 dB Symbol fDM fDS fBM fBS VAO1 VAO2 VEA1 VEA2 Condition 1200 bps Transmit Mode 75 bps Transmit Mode VO VAO - VEAI XD = "1" XD = "0" XD = "1" XD = "0" AOG = "0" AOG = "1" AOG = "0" AOG = "1" Min. 1296 2096 386 446 -6 -12 -2 -8 Typ. 1300 2100 390 450 -4 -10 0 -6 Max. 1304 2104 394 454 -2 -8 2 -4 Unit Hz Hz Hz Hz dBm dBm dB dB
*
0 dBm = 0.775 Vrms
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Semiconductor Demodulator analog input (Al, EAI) characteristics
MSM7512B
( VDD = +2.7 V to +5.5 V, Top = -40C to +85C) Parameter Receive Signal Amplitude Receive Signal Detect Amplitude (CD) Hysteresis (CD) CD Delay Time CD Hold Time Receive Data (RD) Bias Distortion Input Resistance Symbol VAI VON VOFF VHYS tCDD tCDH DBS RAI REAI Condition FSK Signal, at AI FSK Signal, (1:1) at AI VON AE VOFF See Fig. 1 1200 bps, 1:1 Pattern AI EAI OFF AE ON OFF AE OFF Min. -- -- -48 -- 5 20 -10 -- 20 Typ. -- -- -- 2 15 40 -- 10 -- Max. -6 -42 -- -- 20 60 10 -- -- Unit dBm dBm dBm dB ms ms % MW kW
*
0 dBm = 0.775 Vrms
AI
CD tCDD tCDH
Figure 1 Carrier Detect (CD) Timing
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Semiconductor
MSM7512B
OPERATION MODE
Table 1 Operation Mode
MOD2 0 0 1 1 MOD1 0 1 0 1 FSK Transmit Mode (Fig.2) FSK Receive & 75 bps Transmit Mode (Fig.3) Analog Loop Back Test Mode (Fig. 4) Power Down Mode Mode
AI
Phone Line SG
Receive Filter
Demodulator VDD
RD DTE XD
AO
Transmit Filter
Modulator
Figure 2 FSK Transmit Mode
AI
Phone Line
Receive Filter
Demodulator
RD DTE
AO
Transmit Filter
Modulator
XD
Figure 3 FSK Receive Mode
AI
Phone Line
Receive Filter
Demodulator
RD DTE
AO
Transmit Filter Modulator
XD SG
Figure 4 Analog Loop Back Test Mode 8/12
Semiconductor
MSM7512B
APPLICATION CIRCUIT
MSM7512BRS 600 W : 600 W 2.2 mF Line VDD AI AO 600 W EAI GND 10 mF X1 X2 3.58 MHz CLK 8
+ -
1
AOG 16 MOD2 MOD1 TEST RS XD CD RD 9
CONT.
To other circuit
MSM7512BRS 600 W : 600 W 2.2 mF Line VDD AI AO 600 W EAI GND 10 mF X1 X2 100 pF CLK 8
+ -
1
External Clock
AOG 16 MOD2 MOD1 TEST RS XD CD RD 9
CONT.
3.58 MHz
2.2 mF
External Analog Transmit Signal
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Semiconductor
MSM7512B
An Example of the External Adjustment for a transmitting Level and detecting Level If you desire to change the transmitting level or detecting level, adjust the external circuit by referring to the following circuit.
51 kW VAOL Line 600 W VAIL 51 kW
- +
R2
- +
R1
2.2 mF
VAO AO
600 W R3
R4
- +
51 kW 51 kW AI 2.2 mF VAI
Line transmitting level : VAOL = VAO (R2/R1) IC input level : VAI = VAIL (R4/R3)
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Semiconductor
MSM7512B
PACKAGE DIMENSIONS
(Unit : mm)
DIP16-P-300-2.54
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.99 TYP.
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Semiconductor
MSM7512B
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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