View TDA8927_188946.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TDA8927 Power stage 2 x 80 W class-D audio amplifier
Objective specification File under Integrated Circuits, IC01 2001 Dec 11
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.2.1 8.2.2 8.3 9 10 11 12 13 14 14.1 FEATURES APPLICATIONS GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAMS PINNING INFORMATION FUNCTIONAL DESCRIPTION Power stage Protections Overtemperature Short-circuit across the loudspeaker terminals BTL operation LIMITING VALUES THERMAL CHARACTERISTICS QUALITY SPECIFICATION DC CHARACTERISTICS AC CHARACTERISTICS SWITCHING CHARACTERISTICS Duty factor 15 15.1 15.2 15.3 15.4 15.5 15.6 16 17 17.1 17.2 17.2.1 17.2.2 17.3 17.3.1 17.3.2 17.3.3 17.4 18 19 20
TDA8927
TEST AND APPLICATION INFORMATION BTL application Remarks Output power Reference designs Reference design bill of material Curves measured in reference design PACKAGE OUTLINES SOLDERING Introduction Through-hole mount packages Soldering by dipping or by solder wave Manual soldering Surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of IC packages for wave, reflow and dipping soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS
2001 Dec 11
2
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
1 FEATURES * Multimedia systems * All mains fed audio systems * Car audio (boosters). 3 GENERAL DESCRIPTION
TDA8927
* High efficiency (>94%) * Operating voltage from 15 to 30 V * Very low quiescent current * High output power * Short-circuit proof across the load, only in combination with controller TDA8929T * Diagnostic output * Usable as a stereo Single-Ended (SE) amplifier or as a mono amplifier in Bridge-Tied Load (BTL) * Electrostatic discharge protection (pin to pin) * Thermally protected, only in combination with controller TDA8929T. 2 APPLICATIONS
The TDA8927 is the switching power stage of a two-chip set for a high efficiency class-D audio power amplifier system. The system is split into two chips: * TDA8927J/ST/TH; a digital power stage in a DBS17P, RDBS17P or HSOP24 power package * TDA8929T; the analog controller chip in a SO24 package. With this chip set a compact 2 x 80 W audio amplifier system can be built, operating with high efficiency and very low dissipation. No heatsink is required, or depending on supply voltage and load, a very small one. The system operates over a wide supply voltage range from 15 up to 30 V and consumes a very low quiescent current.
* Television sets * Home-sound sets 4 QUICK REFERENCE DATA SYMBOL General; VP = 25 V VP Iq(tot) Po supply voltage total quiescent current efficiency PARAMETER
CONDITIONS
MIN. 15
TYP. 25 35 94
MAX. 30 45 - - - - -
UNIT
V mA %
no load connected Po = 30 W RL = 4 ; THD = 10%; VP = 25 V RL = 4 ; THD = 10%; VP = 27 V
- - 60 74
Stereo single-ended configuration output power 65 80 W W
Mono bridge-tied load configuration Po output power RL = 4 ; THD = 10%; VP = 17 V RL = 8 ; THD = 10%; VP = 25 V 5 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8927J TDA8927ST TDA8927TH DBS17P RDBS17P HSOP24 DESCRIPTION plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) plastic, heatsink small outline package; 24 leads; low stand-off height VERSION SOT243-1 SOT577-1 SOT566-2 90 120 110 150 W W
2001 Dec 11
3
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
6 BLOCK DIAGRAMS
TDA8927
handbook, full pagewidth
VDD2 VDD1 13 5 6 DRIVER HIGH 7 DRIVER LOW VSS1 VDD2 12 DRIVER HIGH 11 DRIVER LOW 8 10
MGW138
TDA8927J TDA8927ST
EN1 SW1 REL1 STAB DIAG POWERUP 4 1 2 9 3 15 CONTROL AND HANDSHAKE
BOOT1
OUT1
TEMPERATURE SENSOR AND current CURRENT PROTECTION
temp
BOOT2
EN2 SW2 REL2
14 17 16 CONTROL AND HANDSHAKE
OUT2
VSS1 VSS2
Fig.1 Block diagram of TDA8927J and TDA8927ST.
2001 Dec 11
4
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
handbook, full pagewidth
VDD2 VDD1 11 LIM 17 2 3 DRIVER HIGH 4 DRIVER LOW VSS1 VDD2 10 DRIVER HIGH 9 DRIVER LOW OUT2 BOOT2 OUT1 BOOT1
TDA8927TH
EN1 SW1 REL1 STAB DIAG POWERUP
24 21 22 6 23 14 CONTROL AND HANDSHAKE
TEMPERATURE SENSOR AND current CURRENT PROTECTION
temp
EN2 SW2 REL2 STAB n.c. 4
13 16 15 7 1, 12, 18, 20 CONTROL AND HANDSHAKE
19 VSS(sub)
5
8
MGW140
VSS1 VSS2
Fig.2 Block diagram of TDA8927TH.
2001 Dec 11
5
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
7 PINNING INFORMATION PIN SYMBOL TDA8927J SW1 n.c. REL1 DIAG EN1 VDD1 BOOT1 STAB OUT1 STAB VSS1 STAB VSS2 OUT2 BOOT2 n.c. VDD2 EN2 POWERUP REL2 SW2 LIM n.c. VSS(sub) n.c. 1 - 2 3 4 5 6 - 7 - 8 9 10 11 12 - 13 14 15 16 17 - - - - TDA8927ST 1 - 2 3 4 5 6 - 7 - 8 9 10 11 12 - 13 14 15 16 17 - - - - TDA8927TH 21 1 22 23 24 2 3 6 4 7 5 - 8 9 10 12 11 13 14 15 16 17 18 19 20 digital switch input channel 1 not connected digital control output channel 1 DESCRIPTION
TDA8927
digital open-drain output for overtemperature and overcurrent report digital enable input for channel 1 positive power supply channel 1 bootstrap capacitor channel 1 decoupling internal stabilizer for logic supply PWM output channel 1 decoupling internal stabilizer for logic supply negative power supply channel 1 decoupling internal stabilizer for logic supply negative power supply channel 2 PWM output channel 2 bootstrap capacitor channel 2 not connected positive power supply channel 2 digital enable input for channel 2 enable input for switching-on internal reference sources digital control output channel 2 digital switch input channel 2 current input for setting maximum load current limit not connected negative supply (substrate) not connected
2001 Dec 11
6
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
handbook, halfpage
handbook, halfpage
SW1 REL1 DIAG EN1 VDD1 BOOT1 OUT1 VSS1 STAB
1 2 3 4 5 6 7 8 9 EN1 24 DIAG 23 REL1 22 SW1 21 n.c. 20 VSS(sub) 19 1 n.c. 2 VDD1 3 BOOT1 4 OUT1 5 VSS1 6 STAB
TDA8927TH
n.c. 18 7 STAB 8 VSS2 9 OUT2 10 BOOT2 11 VDD2 12 n.c.
TDA8927J TDA8927ST
LIM 17 SW2 16 REL2 15 POWERUP 14 EN2 13
VSS2 10 OUT2 11 BOOT2 12 VDD2 13 EN2 14 POWERUP 15 REL2 16 SW2 17
MGW142
MGW144
Fig.3
Pin configuration of TDA8927J and TDA8927ST.
Fig.4 Pin configuration of TDA8927TH.
2001 Dec 11
7
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
8 FUNCTIONAL DESCRIPTION 8.2 Protections
TDA8927
The combination of the TDA8927J and the TDA8929T produces a two-channel audio power amplifier system using the class-D technology (see Fig.5). In the TDA8929T controller device the analog audio input signal is converted into a digital Pulse Width Modulation (PWM) signal. The power stage TDA8927 is used for driving the low-pass filter and the loudspeaker load. It performs a level shift from the low-power digital PWM signal, at logic levels, to a high-power PWM signal that switchs between the main supply lines. A second-order low-pass filter converts the PWM signal into an analog audio signal across the loudspeaker. See the specification of the TDA8929T for a description of the controller. 8.1 Power stage
Temperature and short-circuit protection sensors are included in the TDA8927 power stage. These protections are only operational in combination with the TDA8929T. In the event that the maximum current or maximum temperature is exceeded the diagnostic output is activated. The controller has to take appropriate measures by shutting down the system. 8.2.1 OVERTEMPERATURE
If the junction temperature (Tj) exceeds 150 C, then pin DIAG becomes LOW. The diagnostic pin is released if the temperature is dropped to approximately 130 C, so there is a hysteresis of approximately 20 C. 8.2.2 SHORT-CIRCUIT ACROSS THE LOUDSPEAKER
TERMINALS
The power stage contains the high-power DMOS switches, the drivers, timing and handshaking between the power switches and some control logic. For protection, a temperature sensor and a maximum current detector are built-in on the chip. For interfacing with the controller chip the following connections are used: * Switch (pins SW1 and SW2): digital inputs; switching from VSS to VSS + 12 V and driving the power DMOS switches * Release (pins REL1 and REL2): digital outputs to indicate switching from VSS to VSS + 12 V, follows pins SW1 and SW2 with a small delay * Enable (pins EN1 and EN2): digital inputs; at a level of VSS the power DMOS switches are open and the PWM output is floating; at a level of VSS + 12 V the power stage is operational and controlled by the switch pin if pin POWERUP is at VSS + 12 V * Power-up (pin POWERUP): must be connected to a continuous supply voltage of at least VSS + 5 V with respect to VSS * Diagnostics (pin DIAG): digital open-drain output; pulled to VSS if temperature or maximum current is exceeded.
When the loudspeaker terminals are short-circuited it will be detected by the current protection. If the output current exceeds the maximum output current of 7.5 A, then pin DIAG becomes LOW. The controller should shut down the system to prevent damage. Using the TDA8929T the system is shut down within 1 s, and after 220 ms, it will attempt to restart the system again. During this time the dissipation is very low, so the average dissipation during a short-circuit is practically zero. For the TDA8927TH the limit value can be externally adjusted using a resistor. For the maximum value of 7.5 A pin LIM should be connected to VSS. When a resistor Rext is connected between pin LIM and VSS the maximum output current can be set at a lower value, using: 2.1 x 10 I O(max) = -------------------------------R ext + 28 k Example 1: with Rext = 27 k the current is limited at 3.8 A. Example 2: with Rext = 0 the current is limited at 7.5 A. In the TDA8927J and the TDA8927ST pin LIM is internally connected to VSS, so IO(max) = 7.5 A.
5
2001 Dec 11
8
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 2001 Dec 11
VDDA VSSA VDDA VSS1 VDD1 1 IN1- 4 23 REL1 Vi(1) IN1+ 5 SGND1 2 INPUT STAGE PWM MODULATOR 24 SW1 21 EN1 mute SGND VSSA ROSC OSC 7 OSCILLATOR MANAGER STABI 19 STAB STAB 9 22 DIAGCUR 15 DIAGTMP DIAG 3 VMODE MODE 6 MODE POWERUP 15 SGND SGND2 11 IN2+ 8 13 SW2 Vi(2) IN2- 9 17 PWM2 R fb 12 VSS2(sub) 10 VDD2 18 VSSD 8 10 VSS1 VSS2 -25 V VSSD
handbook, full pagewidth
Philips Semiconductors
Power stage 2 x 80 W class-D audio amplifier
VDDD VDD2 VDD1 13 5 R fb 20 PWM1 REL1 2 SW1 1 EN1 4 CONTROL AND HANDSHAKE
+25 V
3
TDA8929T
TDA8927J
DRIVER HIGH
6
BOOT1
7 DRIVER LOW OUT1
VSS1 TEMPERATURE SENSOR AND CURRENT PROTECTION VDD2 12 BOOT2
9
mute
16 EN2
EN2 14 CONTROL AND 16 HANDSHAKE REL2 SW2 17
DRIVER HIGH
11 OUT2
SGND (0 V)
INPUT STAGE
PWM MODULATOR
14 REL2
DRIVER LOW
VSSA VDDA VSSA
Objective specification
MGU388
TDA8927
Fig.5 Typical application schematic of the class-D system using TDA8929T and the TDA8927J.
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
8.3 BTL operation
TDA8927
In this way the system operates as a mono BTL amplifier and with the same loudspeaker impedance a four times higher output power can be obtained. For more information see Chapter 15.
BTL operation can be achieved by driving the audio input channels of the controller in the opposite phase and by connecting the loudspeaker with a BTL output filter between the two PWM output pins of the power stage (see Fig.6).
handbook, full pagewidth
VDD2 VDD1 13 5 6 DRIVER HIGH 7 OUT1 DRIVER LOW VSS1 VDD2 12 DRIVER HIGH 11 OUT2 DRIVER LOW 8 10
MGU386
TDA8927J
4 1 2 9 3 15 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp CONTROL AND HANDSHAKE
BOOT1
EN1 SW1 REL1 STAB DIAG POWERUP
SGND (0 V) BOOT2
EN2 SW2 REL2
14 17 16 CONTROL AND HANDSHAKE
VSS1 VSS2
Fig.6 Mono BTL application.
2001 Dec 11
10
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
9 LIMITING VALUES In accordance with the Absolute Maximum Rate System (IEC 60134). SYMBOL VP VP(sc) IORM Tstg Tamb Tvj Ves(HBM) PARAMETER supply voltage supply voltage for short-circuits across the load repetitive peak current in output pins storage temperature ambient temperature virtual junction temperature electrostatic discharge voltage (HBM) note 1 all pins with respect to VDD (class A) all pins with respect to each other (class A1) Ves(MM) electrostatic discharge voltage (MM) note 2 all pins with respect to VDD (class B) all pins with respect to VSS (class B) all pins with respect to each other (class B) Notes 1. Human Body Model (HBM); Rs = 1500 ; C = 100 pF. 2. Machine Model (MM); Rs = 10 ; C = 200 pF; L = 0.75 H. 10 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) TDA8927J TDA8927ST TDA8927TH Rth(j-c) thermal resistance from junction to case TDA8927J TDA8927ST TDA8927TH 11 QUALITY SPECIFICATION In accordance with "SNW-FQ611-part D" if this type is used as an audio amplifier. in free air 1.0 1.0 1 PARAMETER thermal resistance from junction to ambient CONDITIONS in free air 40 40 40 VALUE -250 -250 -250 -500 -1500 CONDITIONS - - - -55 -40 - MIN.
TDA8927
MAX. 30 30 7.5 +150 +85 150 +500 +1500 +1500
UNIT V V A C C C V V V
all pins with respect to VSS (class A1) -1500
+250 +250 +250
V V V
UNIT K/W K/W K/W K/W K/W K/W
2001 Dec 11
11
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
12 DC CHARACTERISTICS VP = 25 V; Tamb = 25 C; measured in test diagram of Fig.8; unless otherwise specified. SYMBOL Supply VP Iq(tot) supply voltage total quiescent current note 1 no load connected outputs floating Internal stabilizer logic supply (pin STAB or pins STAB1 and STAB2) VO(STAB) VIH VIL VOH VOL VOL ILO VIH VIL VEN(hys) II(EN) VPOWERUP II(POWERUP) Tdiag Thys Notes 1. The circuit is DC adjusted at VP = 15 to 30 V. 2. Temperature sensor or maximum current sensor activated. stabilizer output voltage 11 13 - - - - - - 9 5 4 - - 100 - 20 15 - - 25 35 5 PARAMETER CONDITIONS MIN. TYP.
TDA8927
MAX. 30 45 10
UNIT
V mA mA
15
V
Switch inputs (pins SW1 and SW2) HIGH-level input voltage LOW-level input voltage referenced to VSS referenced to VSS referenced to VSS referenced to VSS IDIAG = 1 mA; note 2 no error condition 10 0 VSTAB 2 V V
Control outputs (pins REL1 and REL2) HIGH-level output voltage LOW-level output voltage 10 0 VSTAB 2 V V
Diagnostic output (pin DIAG, open-drain) LOW-level output voltage leakage output current 0 - - 0 - - referenced to VSS VPOWERUP = 12 V 5 - 150 - 1.0 50 V A V V V A V A C C
Enable inputs (pins EN1 and EN2) HIGH-level input voltage LOW-level input voltage hysteresis voltage input current referenced to VSS referenced to VSS VSTAB - - 300
Switching-on input (pin POWERUP) operating voltage input current 12 170 - -
Temperature protection temperature activating diagnostic VDIAG = VDIAG(LOW) hysteresis on temperature diagnostic VDIAG = VDIAG(LOW)
2001 Dec 11
12
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
13 AC CHARACTERISTICS SYMBOL PARAMETER CONDITIONS RL = 4 ; THD = 0.5%; VP = 25 V RL = 4 ; THD = 10%; VP = 25 V RL = 4 ; THD = 0.5%; VP = 27 V RL = 4 ; THD = 10%; VP = 27 V THD total harmonic distortion Po = 1 W; note 3 fi = 1 kHz fi = 10 kHz Gv(cl) Po closed-loop voltage gain efficiency Po = 30 W; fi = 1 kHz; note 4 RL = 8 ; THD = 0.5%; VP = 25 V RL = 8 ; THD = 10%; VP = 25 V RL = 4 ; THD = 0.5%; VP = 17 V RL = 4 ; THD = 10%; VP = 17 V THD total harmonic distortion Po = 1 W; note 3 fi = 1 kHz fi = 10 kHz Gv(cl) Notes closed loop voltage gain efficiency Po = 30 W; fi = 1 kHz; note 4 - - 35 - 0.01 0.1 36 94 - - 29 - 100(2) 128(2) 80(2) 100(2) 0.01 0.1 30 94 MIN. TYP.
TDA8927
MAX. - - - - 0.05 - 31 - - - - - 0.05 - 37 -
UNIT
Single-ended application; note 1 Po output power 50(2) 60(2) 60(2) 74(2) 55 65 65 80 W W W W % % dB %
Mono BTL application; note 5 output power 112 140 87 110 W W W W % % dB %
1. VP = 25 V; RL = 4 ; fi = 1 kHz; Tamb = 25 C; measured in reference design in Figs 9 and 11; unless otherwise specified. 2. Indirectly measured; based on Rds(on) measurement. 3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 22 kHz. When distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio band. 4. Efficiency for power stage; output power measured across the loudspeaker load. 5. VP = 25 V; RL = 8 ; fi = 1 kHz; Tamb = 25 C; measured in reference design in Figs 9 and 11; unless otherwise specified.
2001 Dec 11
13
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
14 SWITCHING CHARACTERISTICS VP = 25 V; Tamb = 25 C; measured in Fig.8; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. - - - from pin SW to pin PWM note 1 - - - TYP.
TDA8927
MAX. - - - - 270 0.3
UNIT
PWM outputs (pins OUT1 and OUT2); see Fig.7 tr tf tblank tPD tW(min) Rds(on) Note 1. When used in combination with the TDA8929T controller, the effective minimum pulse width during clipping is 0.5tW(min). 14.1 Duty factor rise time fall time blanking time propagation delay minimum pulse width on-resistance of the output transistors 30 30 70 20 220 0.2 ns ns ns ns ns
For the practical useable minimum and maximum duty factor () which determines the maximum output power: t W(min) x f osc t W(min) x f osc ------------------------------- x 100% < < 1 - ------------------------------ x 100% - 2 2 Using the typical values: 3.5% < < 96.5%.
2001 Dec 11
14
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
handbook, full pagewidth
1/f osc VDD PWM output (V) 0V
VSS tr t PD VSTAB VSW (V) VSS tf t blank
VSTAB VREL (V) VSS 100 ns
MGW145
Fig.7 Timing diagram PWM output, switch and release signals.
2001 Dec 11
15
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
andbook, full pagewidth
2001 Dec 11
12 k
15 TEST AND APPLICATION INFORMATION
Philips Semiconductors
Power stage 2 x 80 W class-D audio amplifier
VDD2 13
VDD1 5 6 BOOT1 15 nF 7 OUT1
TDA8927J
EN1 4 SW1 1 REL1 2 STAB 9 DIAG 3 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp CONTROL AND HANDSHAKE DRIVER HIGH
DRIVER LOW VSS1 VDD2 12 DRIVER HIGH 11 DRIVER LOW 8 VSS1 10 VSS2 VOUT2 V BOOT2 VOUT1 V 2VDD
16
12 V POWERUP 15 EN2 14 100 nF SW2 17 REL2 16 V VEN VSW1
12 V 0
15 nF OUT2
CONTROL AND HANDSHAKE
V VREL1 VSTAB
V VDIAG VSW2
12 V 0
V VREL2
MGW184
Objective specification
TDA8927
Fig.8 Test diagram.
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
15.1 BTL application
TDA8927
When using the system in a mono BTL application (for more output power), the inputs of both channels of the PWM modulator must be connected in parallel; the phase of one of the inputs must be inverted. In principle the loudspeaker can be connected between the outputs of the two single-ended demodulation filters. 15.2 Remarks
The case of the package of the TDA8927J/ST and the heatsink of the TDA8927TH are internally connected to VSS. 15.3 Output power
The output power in single-ended applications can be estimated using the formulae:
2 RL ------------------------------------------------ x V P x ( 1 - t W(min) x f osc ) ( R L + R ds(on) + R s ) = -------------------------------------------------------------------------------------------------------------------------2 x RL
P o(1%)
[ V P x ( 1 - t W(min) x f osc ) ] The maximum current I O(max) = --------------------------------------------------------------- should not exceed 7.5 A. R L + R ds(on) + R s The output power in BTL applications can be estimated using the formulae:
2 RL --------------------------------------------------------- x 2V P x ( 1 - t W(min) x f osc ) R L + 2 x ( R ds(on) + R s ) = --------------------------------------------------------------------------------------------------------------------------------------2 x RL
P o(1%)
[ 2V P x ( 1 - t W(min) x f osc ) ] The maximum current I O(max) = -------------------------------------------------------------------- should not exceed 7.5 A. R L + 2 x ( R ds(on) + R s ) Where: RL = load impedance Rs = series resistance of filter coil Po(1%) = output power just at clipping The output power at THD = 10%: Po(10%) = 1.25 x Po(1%). 15.4 Reference designs
The reference design for a two-chip class-D audio amplifier for TDA8926J or TDA8927J and TDA8929T is shown in Fig.9. The Printed-Circuit Board (PCB) layout is shown in Fig.10. The bill of materials is given in Table 1. The reference design for a two-chip class-D audio amplifier for TDA8926TH or TDA8927TH and TDA8929T is shown in Fig.11. The PCB layout is shown in Fig.12.
2001 Dec 11
17
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 2001 Dec 11
C25 470 nF
Philips Semiconductors
Power stage 2 x 80 W class-D audio amplifier
VDDA R19 39 k
mode select
VDDA R20 39 k 3 MODE 6 S1 C44 220 nF R1 VSSA 27 k C3 220 nF SGND1 GND SGND2 2 OSC
C1 C2
220 nF 220 nF VSSA
VDDD C10 560 pF R11 5.6 SW2 REL2 EN2 VDDD R24 200 k C4 220 nF D2 (7.5 V) 17 16 14 U1 12 11 OUT2 C8 15 nF
VSSD C11 560 pF R12 5.6
VDD1 VDD2 10
VSS2 VSS1 12 1 PWM2 17 SW2 13 REL2 14 EN2 16
QGND C18 1 nF
D1 (5.6 V)
on mute off
L2
OUT2-
1 2
Sumida 33 H CDRH127-330 R15 24 C15 220 nF C19 1 nF QGND
4 or 8 SE
GND
7
U2
BOOT2 VDD1 VDD2 C7 220 nF VSS2 VSS1 C6 220 nF C14 470 nF VDDD
OUT2+
TDA8929T
19
STAB
POWERUP C5 STAB
15 9
18 11 22 5 CONTROLLER
VSSD
TDA8926J or TDA8927J
5 13
OUT2-
2
VSSA VSSD C43 R10 180 pF 1 k
GND
1
220 nF DIAG
8 BTL
10 3 POWER STAGE 8
IN1+ C22 330 pF
DIAGCUR
VSSD
C17 220 nF C16 470 nF R16 24
OUT1+ QGND C20 1 nF
IN1- IN2+
4 8
21 23 24
EN1 REL1 SW1 PWM1
EN1 REL1 SW1
4 2 1
6
BOOT1 C9 15 nF Sumida 33 H CDRH127-330 L4 R13 5.6 C12 560 pF R14 5.6 C13 560 pF VSSD
OUT1-
2 1
J5 J6 C24 470 nF R5 10 k C28 1 nF C26 470 nF R4 10 k
C23 330 pF
OUT1 7
4 or 8 SE
IN2-
9 15
20
C21 1 nF QGND
OUT1+
C27 470 nF R6 10 k C29 1 nF +25 V R7 10 k
outputs
n.c. QGND C30 1 nF VDD 1 2 3 VSS C31 1 nF QGND R22 9.1 k bead L6 C33 220 nF C35 1500 F (35 V) VSSD C38 220 nF C39 220 nF L5 bead R21 10 k C32 220 nF C34 1500 F (35 V) VDDD C36 220 nF C37 220 nF L7 bead
handbook, full pagewidth
18
VDDD VDDA C40 47 F (35 V) GND C41 47 F (35 V) VSSA
input 1 J1 QGND J2 VSS J3 J4
input 2
GND -25 V
QGND
inputs
power supply
MLD633
Objective specification
R21 and R22 are only necessary in BTL applications with asymmetrical supply. BTL: remove R6, R7, C23, C26 and C27 and close J5 and J6. C22 and C23 influence the low-pass frequency response and should be tuned with the real load (loudspeaker). Inputs floating or inputs referenced to QGND (close J1 and J4) or referenced to VSS (close J2 and J3) for an input signal ground reference.
TDA8927
Fig.9 Two-chip class-D audio amplifier application diagram for TDA8926J or TDA8927J and TDA8929T.
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
handbook, full pagewidth
2001 Dec 11
C16 C14
Philips Semiconductors
Power stage 2 x 80 W class-D audio amplifier
TDA8926J/27J & TDA8929T
U1 D1 C24 C34 C35 C41 L7 D2 L6 C27 C40 C25 C26
state of D art Version 21 03-2001
L5 S1 ON MUTE OFF
Out1
Out2
VDD
Silk screen top, top view
GND
VSS
In1
In2
Copper top, top view
19
L4 C6 R16 C17 C15 R15 C9 C32 C12 R13 C5 R11 C33 C10 C8 C7 C43 C13 R10 R14 U2 R12 C11 C4 C3 C39 R1 C2 R5 R19 C1 R20 C38 C36 C22 C23 C37 J5 J6 C44 R24 L2
In1
R21 R22 C28 VDD GND VSS C31 J2 J1
In2
R7 R6
Out1
C21 C20
Out2
C19
R4 C29 J3 J4
Objective specification
C18 C30
QGND
MLD634
TDA8927
Silk screen bottom, top view
Copper bottom, top view
Fig.10 Printed-circuit board layout for TDA8926J or TDA8927J and TDA8929T.
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 2001 Dec 11
VDDA R1 30 k on mute off
Philips Semiconductors
Power stage 2 x 80 W class-D audio amplifier
mode select
VDDA R2 39 k 3 6
C11 C12
100 nF 100 nF VSSA VSS(sub) SW2 REL2 EN2 VDDD R18 200 k C13 100 nF VSSA C15 180 pF D2 (7.5 V) VSSD R8 1 k EN1 REL1 SW1 PWM1 VSSD LIM 17 1, 12, 18, 20 n.c. EN1 REL1 SW1 POWERUP C14 STAB
VDDD C24 560 pF VSSD 19 16 15 13 U1 10 9 OUT2 C26 15 nF R12 5.6
VSSD C25 560 pF R13 5.6 L1 bead
VDD1 VDD2 MODE 10
VSS2 VSS1 12 1 PWM2 17 SW2 13 REL2 14 EN2 16
QGND C40 1 nF
D1 (5.6 V)
S1
C1 220 nF R3 OSC
L2 Sumida 33 H CDRH127-330 C36 470 nF VDDD R16 5.6 C38 220 nF
OUT2-
1 2
4 or 8 SE
GND VSSA
7
27 k C2 220 nF SGND1 GND SGND2 2
U2
BOOT2 VDD1 VDD2 C27 100 nF VSS2 VSS1 C28 100 nF C29 100 nF C31 1500 F (35 V) C32 1500 F (35 V)
C41 1 nF QGND
OUT2+
TDA8929T
19
STAB
14 TDA8926TH 6 7
2
18 11 22
VSSD
or 11 TDA8927TH
8
OUT2-
2
100 nF STAB DIAG
GND C30 100 nF
1
8 BTL
IN1+ C3 330 pF
DIAGCUR
5
CONTROLLER
23 POWER STAGE
5
VSSD C37 470 nF C33 15 nF L3 bead R15 5.6 C35 560 pF Sumida 33 H CDRH127-330 L4 R14 5.6
C39 220 nF R17 5.6
OUT1+ QGND C42 1 nF
IN1- IN2+
4 8
21 23 24
24 22 21
3
BOOT1
OUT1-
2 1
J5 J6 C5 1 F C6 1 F R4 10 k C9 1 nF C7 1 F R5 10 k
C4 330 pF
OUT1 4
4 or 8 SE
R9 and R10 are only necessary in BTL applications with asymmetrical supply. BTL: remove R6, R7, C4, C7 and C8 and close J5 and J6. Demodulation coils L2 and L4 should be matched in BTL. Inputs floating or inputs referenced to QGND (close J1 and J4) or referenced to VSS (close J2 and J3).
handbook, full pagewidth
20
input 1 J1 QGND J2 VSS
IN2-
9 15
20
C43 1 nF QGND
OUT1+
C8 1 F R6 10 k C10 1 nF R7 10 k
n.c.
C34 560 pF
outputs
VDDD VSSD QGND C16 1 nF +25 V VDD 1 GND -25 V 2 3 VSS C17 1 nF QGND QGND L5 bead VDDD R9 10 k L7 bead R11 5.6 C18 100 nF C19 100 nF C22 47 F (35 V) GND R10 9.1 k bead L6 VSSD C20 100 nF C21 100 nF C23 47 F (35 V) VSSA VDDA
input 2 J3 J4 QGND
inputs
power supply
MGW232
Objective specification
TDA8927
Fig.11 Two-chip class-D audio amplifier application diagram for TDA8926TH or TDA8927TH and TDA8929T.
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
dbook, full pagewidth
2001 Dec 11
C37 C31 L3
Philips Semiconductors
Power stage 2 x 80 W class-D audio amplifier
TDA8926TH/27TH TDA8929T
C22
D1 C23
C36
L1 C32 L6 L5
State of D art Version 2CTH1
Out1
Out2
S1 ON MU OFF
VDD GND VSS
In2
In1
Silk screen top, top view
Copper top, top view
21
L4 C29 C14 C30 L5 C25 R13 R12 C26 C24 R9 R10 C10 J2 C43 C42 C41 C40 C16 C17 QGND J4 J3 J1
MGW147
R14 R15 C35
C34
Jan 2001 C33 U1 C28 C27
R8
C1 C15 C11 C20 R1 R2 U2 C3 C18 C4 C12 C19
C13 L7 R11
C2 R3 C8 C7 R4 R5
C21 J6 J5 C5 C6
R17 C39 C38 R16
C9 R7 R6
Silk screen bottom, top view
Copper bottom, top view
Objective specification
TDA8927
Fig.12 Printed-circuit board layout for TDA8926TH or TDA8927TH and TDA8929T.
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
15.5 Reference design bill of materials
TDA8927
Table 1
Two-chip class-D audio amplifier PCB (Version 2.1; 03-2001) for TDA8926J or TDA8927J and TDA8929T (see Figs 9 and 10) DESCRIPTION Cinch input connectors VALUE COMMENTS 2 x Farnell: 152-396 2 x Augat 5KEV-02; 1 x Augat 5KEV-03 PCB switch Knitter ATE 1 E M-O-M TDA8926J/27J TDA8929T 33 H 220 nF/63 V 220 nF/63 V 220 nF/63 V 220 nF/63 V 220 nF/63 V 15 nF/50 V 560 pF/100 V 470 nF/63 V 220 nF/63 V 1 nF/50 V 330 pF/50 V 470 nF/63 V 1 nF/50 V 220 nF/63 V 1500 F/35 V 220 nF/63 V 47 F/35 V 180 pF/50 V 220 nF/63 V BZX79C5V6 BZX79C7V5 27 k 22 DBS17P package SO24 package 2 x Sumida CDRH127-330 3 x Murata BL01RN1-A62 2 x SMD1206 SMD1206 SMD1206 SMD1206 SMD1206 2 x SMD0805 4 x SMD0805 2 x MKT 2 x SMD1206 4 x SMD0805 2 x SMD1206 4 x MKT 2 x SMD0805 2 x SMD1206 2 x Rubycon ZL very low ESR (large switching currents) 4 x SMD1206 2 x Rubycon ZA low ESR SMD1206 SMD1206 DO-35 DO-35 SMD1206
COMPONENT In1 and In2
Out1, Out2, VDD, supply/output connectors GND and VSS S1 U1 U2 L2 and L4 L5, L6 and L7 C1 and C2 C3 C4 C5 C6 and C7 C8 and C9 C10, C11, C12 and C13 C14 and C16 C15 and C17 C18, C19, C20 and C21 C22 and C23 C24, C25, C26 and C27 C28, C29, C30 and C31 C32 and C33 C34 and C35 C36, C37, C38 and C39 C40 and C41 C43 C44 D1 D2 R1 2001 Dec 11 on/mute/off switch power stage IC controller IC demodulation filter coils power supply ferrite beads supply decoupling capacitors for VDD to VSS of the controller clock decoupling capacitor 12 V decoupling capacitor of the controller 12 V decoupling capacitor of the power stage supply decoupling capacitors for VDD to VSS of the power stage bootstrap capacitors snubber capacitors demodulation filter capacitors resonance suppress capacitors common mode HF coupling capacitors input filter capacitors input capacitors common mode HF coupling capacitors power supply decoupling capacitors power supply electrolytic capacitors analog supply decoupling capacitors analog supply electrolytic capacitors diagnostic capacitor mode capacitor 5.6 V zener diode 7.5 V zener diode clock adjustment resistor
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
COMPONENT R4, R5, R6 and R7 R10 R11, R12, R13 and R14 R15 and R16 R19 R20 R21 R22 R24 DESCRIPTION input resistors diagnostic resistor snubber resistors resonance suppression resistors mode select resistor mute select resistor resistor needed when using an asymmetrical supply resistor needed when using an asymmetrical supply bias resistor for powering-up the power stage Curves measured in reference design VALUE 10 k 1 k 5.6 ; >0.25 W 24 39 k 39 k 10 k 9.1 k 200 k
TDA8927
COMMENTS 4 x SMD1206 SMD1206 4 x SMD1206 2 x SMD1206 SMD1206 SMD1206 SMD1206 SMD1206 SMD1206
15.6
102 handbook, halfpage THD+N (%) 10
MLD627
102 handbook, halfpage THD+N (%) 10
MLD628
1
(1)
1
10-1
10-1
(2)
(1)
10-2
(3)
10-2
(2)
10-3 -2 10
10-1
1
10
102 103 Po (W)
10-3 10
102
103
104
f i (Hz)
105
2 x 8 SE; VP = 25 V: (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
2 x 8 SE; VP = 25 V: (1) Po = 10 W. (2) Po = 1 W.
Fig.13 THD + N as a function of output power.
Fig.14 THD + N as a function of input frequency.
2001 Dec 11
23
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
102 handbook, halfpage THD+N (%) 10
MLD629
102 handbook, halfpage THD+N (%) 10
MLD630
1
(1)
1
(1)
10-1
10-1
(2)
(2)
10-2
(3)
10-2
10-3 -2 10
10-1
1
10
102 103 Po (W)
10-3 10
102
103
104
f i (Hz)
105
2 x 4 SE; VP = 25 V: (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
2 x 4 SE; VP = 25 V: (1) Po = 10 W. (2) Po = 1 W.
Fig.16 Fig.15 THD + N as a function of output power.
Fig.16 THD + N as a function of input frequency.
102 handbook, halfpage THD+N (%) 10
MLD631
102 handbook, halfpage THD+N (%) 10
MLD632
1
(1)
1
10-1
(2)
10-1
(1)
(2)
10-2
(3)
10-2
10-3 -2 10
10-1
1
10
102 103 Po (W)
10-3 10
102
103
104
f i (Hz)
105
1 x 8 BTL; VP = 25 V: (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
1 x 8 BTL; VP = 25 V: (1) Po = 10 W. (2) Po = 1 W.
Fig.17 THD + N as a function of output power.
Fig.18 THD + N as a function of input frequency.
2001 Dec 11
24
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
handbook, halfpage
25
MLD609
handbook, halfpage
100
MLD610
P (W) 20
(%)
(3)
(1) (2)
80
15
(1) (2)
60
10
40
(3)
5
20
0 10-2
10-1
1
10
103 102 Po (W)
0 0 30 60 90 120 150 Po (W)
VP = 25 V; fi = 1 kHz: (1) 2 x 4 SE. (2) 1 x 8 BTL. (3) 2 x 8 SE.
Fig.19 Power dissipation as a function of output power.
VP = 25 V; fi = 1 kHz: (1) 2 x 4 SE. (2) 1 x 8 BTL. (3) 2 x 8 SE.
Fig.20 Efficiency as a function of output power.
handbook, halfpage
200 Po
MLD611
handbook, halfpage
(2)
200 Po
MLD612
(W) 160
(2)
(W) 160
120
(1)
120
(1) (3) (3)
80
80
(4)
(4)
40
40
0 10
15
20
25
30 VP (V)
35
0 10
15
20
25
30 VP (V)
35
THD + N = 0.5%; fi = 1 kHz: (1) 1 x 4 BTL. (2) 1 x 8 BTL. (3) 2 x 4 SE. (4) 2 x 8 SE.
THD + N = 10%; fi = 1 kHz: (1) 1 x 4 BTL. (2) 1 x 8 BTL. (3) 2 x 4 SE. (4) 2 x 8 SE.
Fig.21 Output power as a function of supply voltage.
Fig.22 Output power as a function of supply voltage.
2001 Dec 11
25
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
handbook, halfpage
0
MLD613
cs (dB)
handbook, halfpage
0
MLD614
cs (dB)
-20
-20
-40
-40
-60
(1)
-60
(1)
-80
(2)
-80
(2)
-100
10
102
103
104
f i (Hz)
105
-100
10
102
103
104
f i (Hz)
105
2 x 8 SE; VP = 25 V: (1) Po = 10 W. (2) Po = 1 W.
2 x 4 SE; VP = 25 V: (1) Po = 10 W. (2) Po = 1 W.
Fig.23 Channel separation as a function of input frequency.
Fig.24 Channel separation as a function of input frequency.
handbook, halfpage
45
MLD615
handbook, halfpage
45
MLD616
G (dB) 40
G (dB) 40
(1)
35
(1)
35
(2)
30
(2)
30
(3)
25
(3)
25
20
10
102
103
104
f i (Hz)
105
20
10
102
103
104
f i (Hz)
105
VP = 25 V; Vi = 100 mV; Rs = 10 k/Ci = 330 pF: (1) 1 x 8 BTL. (2) 2 x 8 SE. (3) 2 x 4 SE.
VP = 25 V; Vi = 100 mV; Rs = 0 : (1) 1 x 8 BTL. (2) 2 x 8 SE. (3) 2 x 4 SE.
Fig.25 Gain as a function of input frequency.
Fig.26 Gain as a function of input frequency.
2001 Dec 11
26
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
handbook, halfpage
0
MLD617
handbook, halfpage
0
MLD618
SVRR (dB) -20
SVRR (dB) -20
-40
(1)
-40
(1)
-60
(2) (3)
-60
(2) (3)
-80
-80
-100
10
102
103
104
f i (Hz)
105
-100
0
1
2
3
5 4 Vripple (V)
VP = 25 V; Vripple = 2 V (p-p) with respect to GND: (1) Both supply lines in anti-phase. (2) Both supply lines in phase. (3) One supply line rippled.
VP = 25 V; Vripple with respect to GND: (1) fripple = 1 kHz. (2) fripple = 100 Hz. (3) fripple = 10 Hz.
Fig.27 SVRR as a function of input frequency.
Fig.28 SVRR as a function of Vripple (p-p).
handbook, halfpage
100 Iq
MLD619
handbook, halfpage
380
MLD620
(mA) 80
fclk (kHz)
372
60
364
40
356
20
348
0 0 10 20 30 37.5 VP (V)
340 0 10 20 30 VP (V) 40
RL = open.
RL = open.
Fig.29 Quiescent current as a function of supply voltage.
Fig.30 Clock frequency as a function of supply voltage.
2001 Dec 11
27
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
handbook, halfpage
5 Vripple (V) 4
MLD621
MLD622
handbook, halfpage
5
SVRR (%) 4
3
(1)
3
(1)
2
2
1
(2)
1
(2)
0 10-2
10-1
1
10
Po (W)
102
0 10
102
103
f i (Hz)
104
VP = 25 V; 1500 F per supply line; fi = 10 Hz: (1) 1 x 4 SE. (2) 1 x 8 SE.
Fig.31 Supply voltage ripple as a function of output power.
VP = 25 V; 1500 F per supply line: (1) Po = 30 W into 1 x 4 SE. (2) Po = 15 W into 1 x 8 SE.
Fig.32 SVRR as a function of input frequency.
handbook, halfpage
10
MLD623
handbook, halfpage
THD+N (%) 1
(1)
50 Po 40
MLD624
(W)
30 10-1
(2) (3)
20
10-2
10
10-3 100
200
300
400
500 600 fclk (kHz)
0 100
200
300
400
500 600 fclk (kHz)
VP = 25 V; Po = 1 W in 2 x 8 : (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
VP = 25 V; RL = 2 x 8 ; fi = 1 kHz; THD + N = 10%.
Fig.33 THD + N as a function of clock frequency.
Fig.34 Output power as a function of clock frequency.
2001 Dec 11
28
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
handbook, halfpage
150 Iq 120
MLD625
handbook, halfpage
1000
MLD626
Vr(PWM) (mV) 800
(mA)
90
600
60
400
30
200
0 100
200
300
400
500 600 fclk (kHz)
0 100
200
300
400
500 600 fclk (kHz)
VP = 25 V; RL = open.
VP = 25 V; RL = 2 x 8 .
Fig.35 Quiescent current as a function of clock frequency.
Fig.36 PWM residual voltage as a function of clock frequency.
2001 Dec 11
29
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
16 PACKAGE OUTLINES DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
TDA8927
SOT243-1
non-concave D x Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c vM
1 Z e e1 bp wM
17 m e2
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
1.27 5.08
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-12-16 99-12-17
2001 Dec 11
30
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm)
SOT577-1
non-concave D x Dh
Eh
view B: mounting base side
d
A2
B j E
A L e2 c Q
1 Z e e1 bp
17 wM
vM L1
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 13.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D(1) 24.0 23.6 d 20.0 19.6 Dh 10 E(1) 12.2 11.8 e 2.54 e1 1.27 e2 2.54 Eh 6 j 3.4 3.1 L 4.7 4.1 L1 4.7 4.1 Q 2.1 1.8 v 0.6 w 0.4 x 0.03 Z(1) 2.00 1.45
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT577-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 00-01-19 00-03-15
2001 Dec 11
31
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
TDA8927
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
SOT566-2
E D x
A X
c y E2 HE vM A
D1 D2 1 pin 1 index Q A2 E1 A4 Lp detail X 24 Z e bp 13 wM (A3) A 12
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1.0 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.7 2.2 8 0
+0.12 0.53 0.32 16.0 13.0 -0.02 0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT566-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 00-03-24
2001 Dec 11
32
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
17 SOLDERING 17.1 Introduction
TDA8927
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. 17.3.2 WAVE SOLDERING
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 17.2 17.2.1 Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 17.3.3 MANUAL SOLDERING
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 17.2.2 MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 17.3 17.3.1 Surface mount packages REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 33
2001 Dec 11
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
17.4 Suitability of IC packages for wave, reflow and dipping soldering methods
TDA8927
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -
2001 Dec 11
34
Philips Semiconductors
Objective specification
Power stage 2 x 80 W class-D audio amplifier
18 DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
TDA8927
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 19 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 20 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2001 Dec 11
35
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/01/pp36
Date of release: 2001
Dec 11
Document order number:
9397 750 08191

▲Up To Search▲

Price & Availability of TDA8927

	To Download TDA8927 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .