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| IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDI404PI / I404SI / I404SI-16 4 Ampere Dual Low-Side Ultrafast MOSFET Drivers Features * Built using the advantages and compatibility of CMOS and IXYS HDMOSTM processes * Latch-Up Protected Over Entire Operating Range * High Peak Output Current: 4A Peak * Wide Operating Range: 4.5V to 25V * High Capacitive Load Drive Capability: 1800pF in <15ns * Matched Rise And Fall Times * Low Propagation Delay Time * Low Output Impedance * Low Supply Current * Two Drivers in Single Chip General Description The IXDN404/IXDI404/IXDF404 is comprised of two 4 Ampere CMOS high speed MOSFET drivers. Each output can source and sink 4A of peak current while producing voltage rise and fall times of less than 15ns to drive the latest IXYS MOSFETs & IGBT's. The input of the driver is compatible with TTL or CMOS and is fully immune to latch up over the entire operating range. A patent-pending circuit virtually eliminates CMOS power supply cross conduction and current shoot-through. Improved speed and drive capabilities are further enhanced by very low, matched rise and fall times. The IXDN404 is configured as a dual non-inverting gate driver, the IXDI404 is a dual inverting gate driver, and the IXDF404 is a dual inverting + non-inverting gate driver. The IXDN404/IXDI404/IXDF404 family are available in the standard 8 pin P-DIP (PI), SOP-8 (SI) and SOP-16 (SI-16) packages. Applications * * * * * * * * * * Driving MOSFETs and IGBTs Motor Controls Line Drivers Pulse Generators Local Power ON/OFF Switch Switch Mode Power Supplies (SMPS) DC to DC Converters Pulse Transformer Driver Class D Switching Amplifiers Limiting di/dt Under Short Circuit Figure 1 - IXDN404 Dual 4A Non-Inverting Gate Driver Functional Block Diagram Vcc P IN A ANTI-CROSS CONDUCTION CIRCUIT * OUT A N P IN B ANTI-CROSS CONDUCTION CIRCUIT * OUT B N GND * Patent Pending Copyright (c) IXYS CORPORATION 2001 First Release IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDN404PI / N404SI / N404SI-16 Figure 2 - IXDI404 Dual Inverting 4A Gate Driver Functional Block Diagram Vcc P IN A ANTI-CROSS CONDUCTION CIRCUIT * OUT A N P IN B ANTI-CROSS CONDUCTION CIRCUIT * OUT B N GND Figure 3 - IXDF404 Inverting + Non-Inverting 4A Gate Driver Functional Block Diagram Vcc P IN A ANTI-CROSS CONDUCTION CIRCUIT * OUT A N P IN B ANTI-CROSS CONDUCTION CIRCUIT * OUT B N GND * Patent Pending 2 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 Absolute Maximum Ratings (Note 1) Parameter Supply Voltage All Other Pins Junction Temperature Storage Temperature Soldering Lead Temperature (10 seconds maximum) Value 25V -0.3V to VCC + 0.3V 150oC -65oC to 150oC 300oC IXDI404PI / I404SI / I404SI-16 Operating Ratings Parameter Operating Temperature Range Value -40oC to 85oC Thermal Impedance (Junction To Ambient) 8 Pin PDIP (PI) (JA) 120oC/W 8 Pin SOIC (SI) (JA) 110oC/W 16 Pin SOIC (SI-16) (JA) 110oC/W Electrical Characteristics Unless otherwise noted, TA = 25 oC, 4.5V VCC 25V . All voltage measurements with respect to GND. Device configured as described in Test Conditions. All specifications are for one channel. Symbol VIH VIL VIN IIN VOH VOL ROH ROL IPEAK IDC tR tF tONDLY tOFFDLY VCC ICC Parameter High input voltage Low input voltage Input voltage range Input current High output voltage Low output voltage Output resistance @ Output High Output resistance @ Output Low Peak output current Continuous output current Rise time Fall time On-time propagation delay Off-time propagation delay Power supply voltage Power supply current Test Conditions Min 3.5 Typ Max 0.8 Units V V V A V -5 0V VIN VCC -10 VCC - 0.025 VCC + 0.3 10 0.025 IOUT = 10mA, VCC = 18V IOUT = 10mA, VCC = 18V VCC is 18V 1.5 1.5 4 1 CL=1800pF Vcc=18V CL=1800pF Vcc=18V CL=1800pF Vcc=18V CL=1800pF Vcc=18V 11 12 33 28 4.5 VIN = 3.5V VIN = 0V VIN = + VCC 12 14 34 30 18 1 0 15 17 38 35 25 3 10 10 3 3 V A A ns ns ns ns V mA A A Ordering Information Part Number IXDN404PI IXDN404SI IXDN404SI-16 IXDI404PI IXDI404SI IXDI404SI-16 IXDF404PI IXDF404SI IXDF404SI-16 Package Type 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC Temp. Range -40C to +85C Configuration Dual Non Inverting -40C to +85C Dual Inverting -40C to +85C Inverting + Non Inverting NOTE: Mounting or solder tabs on all packages are connected to ground 3 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 Pin Description SYMBOL IN A GND IN B OUT B VCC OUT A FUNCTION A Channel Input Ground B Channel Input B Channel Output Supply Voltage A Channel Output IXDN404PI / N404SI / N404SI-16 DESCRIPTION A Channel Input signal-TTL or CMOS compatible. The system ground pin. Internally connected to all circuitry, this pin provides ground reference for the entire chip. This pin should be connected to a low noise analog ground plane for optimum performance. B Channel Input signal-TTL or CMOS compatible. B Channel Driver output. For application purposes, this pin is connected via a resistor to a gate of a MOSFET/IGBT. Positive power-supply voltage input. This pin provides power to the entire chip. The range for this voltage is from 4.5V to 25V. A Channel Driver output. For application purposes, this pin is connected via a resistor to a gate of a MOSFET/IGBT. CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when handling and assembling this component. Note 1: Operating the device beyond parameters with listed "Absolute Maximum Ratings" may cause permanent damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Figure 4 - Characteristics Test Diagram Vcc 10uF 25V 1 NC 2 In A 3 Gnd 4 In B NC 8 7 Out A Vcc 6 Out B 5 Agilent 1147A Current Probe 1800 pF Agilent 1147A Current Probe 1800 pF 4 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDI404PI / I404SI / I404SI-16 Typical Performance Characteristics Fig. 5 40 35 50 30 40 25 Rise Time vs. Supply Voltage Fig. 6 60 Fall Time vs. Supply Voltage Rise Time (ns) CL=4700 pF 20 15 10 5 0 8 10 12 14 16 18 200 pF 1800 pF Fall Time (ns) 30 CL=4700 pF 20 1800 pF 10 200 pF 0 8 10 12 14 16 18 Supply Voltage (V) Fig. 7 25 Supply Voltage (V) Fig. 8 80 70 8V Rise And Fall Times vs. Case Temperature CL=1nF VCC=18V Rise Time vs. Load Capacitance 20 60 50 10V Rise Time (ns) Time (ns) 15 tF tR 12V 40 30 20 10 18V 14V 16V 10 5 0 -40 -20 0 20 40 60 80 100 120 0 0k 2k 4k 6k 8k 10k Temperature (C) Fig. 9 100 90 80 2.8 Load Capacitance (pF) Fig. 10 3.2 Fall Time vs. Load Capacitance 8V Max / Min Input vs. Case Temperature VCC=18V CL=1nF 3.0 Minimum Input High 70 Fall Time (ns) 60 50 40 10V 12V Max / Min Input (V) 2.6 2.4 2.2 Maximum Input Low 2.0 1.8 18V 30 20 10 0 0k 14V 16V 2k 4k 6k 8k 10k 1.6 -60 -40 -20 0 20 40 o 60 80 100 Load Capacitance (pF) 5 Temperature ( C) IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDN404PI / N404SI / N404SI-16 Fig. 11 100 Supply Current vs. Load Capacitance Vcc=18V Fig. 12 100 Supply Current vs. Frequency Vcc=18V 80 10 CL= 1800 pF Supply Current (mA) 60 Supply Current (mA) 1000 pF 200 pF 1 2 MHz 40 1 MHz 500 KHz 20 100 kHz 50 kHz 10 kHz 0.1 0 0.1k 0.01 1.0k 10.0k 1 10 100 1000 Load Capacitance (pF) Fig. 13 100 Frequency (kHz) Fig. 14 100 Supply Current vs. Load Capacitance Vcc=12V Supply Current vs. Frequency Vcc=12V 80 10 CL= 1800 pF Supply Current (mA) 60 Supply Current (mA) 1000 pF 1 200 pF 2 MHz 40 1 MHz 500 KHz 0.1 20 100 kHz 50 kHz 10 kHz 1.0k 10.0k 0 0.1k 0.01 1 10 100 1000 Load Capacitance (pF) Fig. 15 100 Frequency (kHz) Fig. 16 100 Supply Current vs. Load Capacitance Vcc=8V Supply Current vs. Frequency Vcc=8V 80 10 CL= 1800 pF Supply Current (mA) 60 Supply Current (mA) 1000 pF 1 200 pF 40 2 MHz 1 MHz 500 KHz 0.1 20 100 kHz 50 kHz 10 kHz 0.01 1.0k 10.0k 1 10 100 1000 0 0.1k Load Capacitance (pF) 6 Frequency (kHz) IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDI404PI / I404SI / I404SI-16 Fig. 17 50 Propagation Delay vs. Supply Voltage CL=1800pF VIN=5V@1kHz Fig. 18 60 Propagation Delay vs. Input Voltage CL=1800pF VCC=15V 50 40 Propagation Delay (ns) tONDLY 30 Propagation Delay (ns) tONDLY 40 tOFFDLY 20 30 tOFFDLY 20 10 10 0 8 10 12 14 16 18 0 0 2 4 6 8 10 12 Supply Voltage (V) Fig. 19 60 55 Input Voltage (V) Fig. 20 0.26 Propagation Delay Times vs. Temperature CL=1800pF VCC=18V Quiescent Supply Current vs. Temperature VCC=18V VIN=5V@1kHz CL=1000pF 45 tONDLY Quiescent Vcc Input Current (mA) 50 0.24 0.22 Time (ns) 40 35 30 25 20 15 10 -40 -20 0 20 40 60 80 100 120 tOFFDLY 0.20 0.18 0.16 0.14 -40 -20 0 20 o 40 60 80 Temperature (C) Fig. 21 6 Temperature ( C) Fig. 22 6 P Channel Output Current Vs. Temperature VCC=18V, CL=1000pF N Channel Output Current Vs. Temperature VCC=18V, CL=1000pF 5 N Channel Output Current (A) -40 -20 0 20 40 o 60 80 100 P Channel Output Current (A) 5 4 4 3 3 -40 -20 0 20 40 o 60 80 100 Temperature ( C) Temperature ( C) 7 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDN404PI / N404SI / N404SI-16 Fig. 23 5 High State Output Resistance vs. Supply Voltage Fig. 24 Fig. 22 3.0 Low-State Output Resistance Vs. Supply Voltage High State Output Resistance (Ohm) 4 Low-State Output Resistance (Ohms) 2.0 3 2 1.0 1 0 8 10 15 20 25 0.0 8 10 15 20 25 Supply Voltage (V) Supply Voltage (V) Fig. 25 0 Vcc vs. P Channel Output Current Fig. 26 8 VCC vs. N Channel Output Current P Channel Output Current (A) -4 -6 -8 8 10 15 20 25 30 N Channel Output Current (A) -2 6 4 2 0 8 10 15 20 25 30 Vcc Vcc 8 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 PIN CONFIGURATIONS 1 2 3 4 IXDI404PI / I404SI / I404SI-16 NC IN A GND INB NC OUT A 8 7 1 2 3 4 NC IN A GND INB NC OUT A 8 7 1 2 3 4 NC IN A GND INB NC OUT A 8 7 VS 6 OUT B 5 VS 6 OUT B 5 VS 6 OUT B 5 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDN404 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDI404 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDF404 1 NC 2 IN A 3 NC 4 GND 5 GND 6 NC 7 IN B 8 NC NC 16 OUT A 15 OUT A 14 VCC 13 VCC 12 OUT B 11 OUT B 10 NC 9 1 NC 2 IN A 3 NC 4 GND 5 GND 6 NC 7 IN B 8 NC NC 16 OUT A 15 OUT A 14 VCC 13 VCC 12 OUT B 11 OUT B 10 NC 9 1 NC 2 IN A 3 NC 4 GND 5 GND 6 NC 7 IN B 8 NC NC 16 OUT A 15 OUT A 14 VCC 13 VCC 12 OUT B 11 OUT B 10 NC 9 16 Pin SOIC IXDN404SI-16 16 Pin SOIC IXDI404SI-16 16 Pin SOIC IXDF404SI-16 Supply Bypassing, Grounding Practices And Output Lead inductance When designing a circuit to drive a high speed MOSFET utilizing the IXDN404/IXDI404/IXDF404, it is very important to observe certain design criteria in order to optimize performance of the driver. Particular attention needs to be paid to Supply Bypassing, Grounding, and minimizing the Output Lead Inductance. Say, for example, we are using the IXDN404 to charge a 2500pF capacitive load from 0 to 25 volts in 25ns. Using the formula: I= V C / t, where V=25V C=2500pF & t=25ns, we can determine that to charge 2500pF to 25 volts in 25ns will take a constant current of 2.5A. (In reality, the charging current won't be constant, and will peak somewhere around 4A). SUPPLY BYPASSING In order for our design to turn the load on properly, the IXDN404 must be able to draw this 2.5A of current from the power supply in the 25ns. This means that there must be very low impedance between the driver and the power supply. The most common method of achieving this low impedance is to bypass the power supply at the driver with a capacitance value that is a magnitude larger than the load capacitance. Usually, this would be achieved by placing two different types of bypassing capacitors, with complementary impedance curves, very close to the driver itself. (These capacitors should be carefully selected, low inductance, low resistance, high-pulse current-service capacitors). Lead lengths may radiate at high frequency due to inductance, so care should be taken to keep the lengths of the leads between these bypass capacitors and the IXDN404 to an absolute minimum. 9 GROUNDING In order for the design to turn the load off properly, the IXDN404 must be able to drain this 2.5A of current into an adequate grounding system. There are three paths for returning current that need to be considered: Path #1 is between the IXDN404 and its load. Path #2 is between the IXDN404 and its power supply. Path #3 is between the IXDN404 and whatever logic is driving it. All three of these paths should be as low in resistance and inductance as possible, and thus as short as practical. In addition, every effort should be made to keep these three ground paths distinctly separate. Otherwise, the returning ground current from the load may develop a voltage that would have a detrimental effect on the logic line driving the IXDN404. OUTPUT LEAD INDUCTANCE Of equal importance to Supply Bypassing and Grounding are issues related to the Output Lead Inductance. Every effort should be made to keep the leads between the driver and its load as short and wide as possible. If the driver must be placed farther than 2" (5mm) from the load, then the output leads should be treated as transmission lines. In this case, a twistedpair should be considered, and the return line of each twisted pair should be placed as close as possible to the ground pin of the driver, and connected directly to the ground terminal of the load. IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDN404PI / N404SI / N404SI-16 IXYS Corporation 3540 Bassett St; Santa Clara, CA 95054 Tel: 408-982-0700; Fax: 408-496-0670 e-mail: sales@ixys.net IXYS Semiconductor GmbH Edisonstrasse15 ; D-68623; Lampertheim Tel: +49-6206-503-0; Fax: +49-6206-503627 e-mail: marcom@ixys.de Directed Energy, Inc. An IXYS Company 2401 Research Blvd. Ste. 108, Ft. Collins, CO 80526 Tel: 970-493-1901; Fax: 970-493-1903 e-mail: deiinfo@directedenergy.com 10 Doc #9200-0234 R1 |
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