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| (R) STPS8H100D/F/G/R/FP HIGH VOLTAGE POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS s 8A 100 V 175 C 0.58 V A K K A s s s s s NEGLIGIBLE SWITCHING LOSSES HIGH JUNCTION TEMPERATURE CAPABILITY LOW LEAKAGE CURRENT GOOD TRADE OFF BETWEEN LEAKAGE CURRENT AND FORWARD VOLTAGE DROP INSULATED PACKAGE: ISOWATT220AC, TO-220FPAC Insulating voltage = 2000V DC Capacitance = 12pF AVALANCHE CAPABILITY SPECIFIED TO-220AC STPS8H100D K ISOWATT220AC STPS8H100F A NC D2PAK STPS8H100G DESCRIPTION Schottky barrier rectifier designed for high frequency compact Switched Mode Power Supplies such as adaptators and on board DC/DC converters. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) RMS forward current Average forward current = 0.5 TO-220AC / I2PAK / D2PAK ISOWATT220AC TO-220FPAC IFSM IRRM IRSM PARM Tstg Tj dV/dt Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature Critical rate of rise of rise voltage Parameter Repetitive peak reverse voltage A NC K K A I2PAK STPS8H100R TO-220FPAC STPS8H100FP Value 100 30 Tc= 165C Tc = 150C 250 1 3 10800 - 65 to + 175 175 10000 8 Unit V A A tp = 10 ms sinusoidal tp = 2 s F = 1kHz square tp = 100 s square tp = 1s Tj = 25C A A A W C C V/s 1/8 July 2003 - Ed: 6D STPS8H100D/F/G/R/FP THERMAL RESISTANCES Symbol Rth (j-c) Rth (j-c) Junction to case Junction to case Parameter TO-220AC / I PAK / D PAK ISOWATT220AC / TO-220FPAC 2 2 Value 1.6 4 Unit C/W C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * VF ** Parameter Reverse leakage current Forward voltage drop Tests Conditions Tj = 25C Tj = 125C Tj = 25C Tj = 25C Tj = 25C Tj = 125C Tj = 125C Tj = 125C Pulse test : * tp = 5 ms, < 2% ** tp = 380 s, < 2% Min. Typ. 2 Max. 4.5 6 0.71 0.77 0.81 Unit A mA V VR = VRRM IF = 8 A IF = 10 A IF = 16 A IF = 8 A IF = 10 A IF = 16 A 0.56 0.59 0.65 0.58 0.64 0.68 To evaluate the maximum conduction losses use the following equation : P = 0.48 x IF(AV) + 0.0125 x IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. (TO-220AC / ISOWATT220AC / I2PAK / D2PAK) PF(av)(W) 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 = 0.1 = 0.05 = 0.2 = 0.5 Fig. 2: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 =1 0.1 T 0.01 IF(av) (A) 0 1 2 3 4 5 6 7 =tp/T tp 0.001 tp(s) 0.1 1 10 100 1000 8 9 10 0.01 2/8 STPS8H100D/F/G/R/FP Fig. 3: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) Fig. 4-1: Average forward current versus ambient temperature (=0.5) (TO-220AC / I2PAK / D2PAK). IF(av)(A) 10 Rth(j-a)=Rth(j-c) 1.2 1 0.8 0.6 0.4 0.2 8 6 4 T Rth(j-a)=15C/W 2 Tj(C) =tp/T tp 0 0 25 50 75 100 125 150 Tamb(C) 60 80 100 120 140 160 180 0 0 20 40 Fig. 4-2: Average forward current versus ambient temperature (=0.5) (ISOWATT220AC, TO-220FPAC). IF(av)(A) Fig. 5-1: Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AC / I2PAK / D2PAK). IM(A) 160 10 Rth(j-a)=Rth(j-c) 8 6 Rth(j-a)=50C/W 140 120 100 80 60 40 Tc=100C IM t Tc=75C 4 T 2 =tp/T tp Tc=125C =0.5 Tamb(C) 20 t(s) 1E-2 1E-1 1E+0 0 0 20 40 60 80 100 120 140 160 180 0 1E-3 Fig. 5-2: Non repetitive surge peak forward current versus overload duration (maximum values) (ISOWATT220AC, TO-220FPAC). IM(A) 100 90 80 70 60 50 40 30 20 IM 10 0 1E-3 Fig. 6-1: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC / I2PAK / D2PAK). Zth(j-c)/Rth(j-c) 1.0 0.8 Tc=75C 0.6 0.4 = 0.5 Tc=100C Tc=125C t = 0.2 T Single pulse 0.2 = 0.1 =0.5 t(s) 1E-2 1E-1 1E+0 0.0 1E-4 1E-3 tp(s) 1E-2 =tp/T tp 1E-1 1E+0 3/8 STPS8H100D/F/G/R/FP Fig. 6-2: Relative variation of thermal impedance junction to case versus pulse duration (ISOWATT220AC, TO-220FPAC). Zth(j-c)/Rth(j-c) Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(A) 5E+3 1E+3 Tj=125C 1.0 0.8 1E+2 0.6 0.4 = 0.2 = 0.5 1E+1 T Single pulse 1E+0 Tj=25C 0.2 = 0.1 1E-1 tp(s) =tp/T tp 0.0 1E-3 1E-2 1E-1 1E+0 1E+1 1E-2 VR(V) 0 10 20 30 40 50 60 70 80 90 100 Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(nF) 1000 F=1MHz Tj=25C Fig. 9: Forward voltage drop versus forward current (maximum values). IFM(A) 50.0 10.0 Tj=125C 500 Tj=25C 200 VR(V) 100 1 10 100 1.0 VFM(V) 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35m)(D2PAK). Rth(j-a) (C/W) 80 70 60 50 40 30 20 10 0 0 4 8 12 S(Cu) (cm) 16 20 24 28 32 36 40 4/8 STPS8H100D/F/G/R/FP PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. H2 C L5 OI L6 L2 D L7 A Millimeters Min. Max. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 4.95 5.15 10.00 10.40 16.40 typ. 13.00 14.00 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Inches Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.194 0.202 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 L9 F1 L4 F G M E A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I PACKAGE MECHANICAL DATA ISOWATT220AC A H B DIMENSIONS REF. A B D E F F1 G H L2 L3 L6 L7 Diam Millimeters Min. 4.40 2.50 2.40 0.40 0.75 1.15 4.95 10.00 16.00 28.60 15.90 9.00 3.00 30.60 16.40 9.30 3.20 1.125 0.626 0.354 0.118 Typ. Max. 4.60 2.70 2.75 0.70 1.00 1.70 5.20 10.40 Min. 0.173 0.098 0.094 0.016 0.030 0.045 0.195 0.394 0.630 1.205 0.646 0.366 0.126 Inches Typ. Max. 0.181 0.106 0.108 0.028 0.039 0.067 0.205 0.409 L6 L2 L3 L7 F1 F G Diam D E 5/8 STPS8H100D/F/G/R/FP PACKAGE MECHANICAL DATA TO-220FPAC REF. A H B DIMENSIONS Millimeters Inches Min. Max. 0.173 0.181 0.098 0.106 0.098 0.108 0.018 0.027 0.030 0.039 0.045 0.067 0.195 0.205 0.094 0.106 0.393 0.409 0.63 Typ. 1.126 1.205 0.386 0.417 0.114 0.142 0.626 0.646 0.354 0.366 0.118 0.126 Min. Max. 4.4 4.6 2.5 2.7 2.5 2.75 0.45 0.70 0.75 1 1.15 1.70 4.95 5.20 2.4 2.7 10 10.4 16 Typ. 28.6 30.6 9.8 10.6 2.9 3.6 15.9 16.4 9.00 9.30 3.00 3.20 Dia L6 L2 L3 L5 D F1 L4 L7 F G1 G E A B D E F F1 G G1 H L2 L3 L4 L5 L6 L7 Dia. 6/8 STPS8H100D/F/G/R/FP PACKAGE MECHANICAL DATA D2PAK DIMENSIONS A E L2 C2 REF. A A1 A2 B B2 C C2 D E G L L2 L3 R V2 Millimeters Min. 4.30 2.49 0.03 0.70 1.40 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0.40 0 8 0 0.60 1.36 9.35 10.28 5.28 15.85 1.40 1.75 0.017 0.047 0.352 0.393 0.192 0.590 0.050 0.055 Typ. Max. Min. 4.60 2.69 0.23 0.93 0.169 0.098 0.001 0.027 Inches Typ. Max. 0.181 0.106 0.009 0.037 0.055 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 8 D L L3 A1 B2 B G A2 2.0 MIN. FLAT ZONE V2 C R FOOTPRINT (in millimeters)D2PAK 16.90 10.30 1.30 5.08 3.70 8.90 7/8 STPS8H100D/F/G/R/FP PACKAGE MECHANICAL DATA I2PAK DIMENSIONS REF. A A1 b b1 b2 C C2 D e E L L1 L2 Millimeters Min. 4.30 2.49 0.70 1.20 1.25 0.45 1.21 8.95 2.44 10.00 13.10 3.48 1.27 1.40 Typ. Max. Min. 4.60 0.169 2.69 0.098 0.93 0.028 1.38 0.047 0.049 0.055 0.60 0.018 1.36 0.048 9.35 0.352 2.64 0.096 10.28 0.394 13.60 0.516 3.78 0.137 1.40 0.050 0.024 0.054 0.368 0.104 0.405 0.535 0.149 0.055 Inches Typ. Max. 0.181 0.106 0.037 0.054 Ordering type STPS8H100D STPS8H100F STPS8H100FP STPS8H100R STPS8H100G STPS8H100G-TR s Marking STPS8H100D STPS8H100F STPS8H100FP STPS8H100R STPS8H100G STPS8H100G Package TO-220AC ISOWATT220AC TO-220FPAC I2PAK D PAK D PAK 2 2 Weight 1.86g 2.00g 1.9 g 1.49g 1.48g 1.48g Base qty 50 50 50 50 50 500 Delivery mode Tube Tube Tube Tube Tube Tape & reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 8/8 |
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