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| 3SK194 Silicon N-Channel Dual Gate MOS FET Application VHF/UHF TV tuner RF amplifier Outline MPAK-4 2 3 1 4 1. Source 2. Gate1 3. Gate2 4. Drain 3SK194 Absolute Maximum Ratings (Ta = 25C) Item Drain to source voltage Gate 1 to source voltage Gate 2 to source voltage Drain current Channel power dissipation Channel temperature Storage temperature Symbol VDS VG1S VG2S ID Pch Tch Tstg Ratings 15 10 10 35 150 125 -55 to +125 Unit V V V mA mW C C 2 3SK194 Electrical Characteristics (Ta = 25C) Item Drain to source breakdown voltage Gate 1 to source breakdown voltage Gate 2 to source breakdown voltage Gate 1 cutoff current Gate 2 cutoff current Symbol V(BR)DSX V(BR)G1SS V(BR)G2SS I G1SS I G2SS Min 15 10 10 -- -- -- -- 0 17 -- -- -- 12 -- -- 27 -- Typ -- -- -- -- -- -- -- -- -- 2.8 1.8 0.02 15 3.0 3.0 30 1.0 Max -- -- -- 100 100 -1.0 -1.5 10 -- 3.5 2.5 -- -- 4.5 4.0 -- 2.5 Unit V V V nA nA V V mA mS pF pF pF dB dB dB dB dB VDD = 12 V, VAGC = 10.5 V, f = 60 MHz VDS = 6 V, VG2S = 3 V, I D = 10 mA, f = 200 MHz VDS = 6 V, VG2S = 3 V, I D = 10 mA, f = 900 MHz Test conditions I D = 200 A, VG1S = VG2S = -5 V I G1 = 10 A, VG2S = VDS = 0 I G2 = 10 A, VG1S = VDS = 0 VG1S = 8 V, V G2S = VDS = 0 VG2S = 8 V, V G1S = VDS = 0 VDS = 10 V, VG2S = 3 V, I D = 100 A VDS = 10 V, VG1S = 3 V, I D = 100 A VDS = 6 V, VG1S = 0, VG2S = 3 V VDS = 6 V, VG2S = 3 V, I D = 10 mA, f = 1 kHz VDS = 6 V, VG2S = 3 V, I D = 10 mA, f = 1 MHz Gate 1 to source cutoff voltage VG1S(off) Gate 2 to source cutoff voltage VG2S(off) Drain current Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Power gain Noise figure Noise figure Power gain Noise figure Note: Marking is "IY-". I DSS |yfs| Ciss Coss Crss PG NF NF PG NF 3 3SK194 Maximum Channel Power Dissipation Curve Channel Power Dissipation Pch (mW) 300 20 0.8 0.6 Drain Current ID (mA) 16 0.4 Typical Output Characteristics VG2S = 3 V 200 12 8 0.2 VG1S = 0 100 4 0 50 100 150 Ambient Temperature Ta (C) 0 2 4 6 8 10 Drain to Source Voltage VDS (V) Drain Current vs. Gate 1 to Source Voltage 20 2 1.5 1 Drain Current vs. Gate 2 to Source Voltage 20 1.5 Drain Current ID (mA) 16 0.5 12 1 VDS = 6 V VDS = 6 V Drain Current ID (mA) 16 12 0.5 8 VG2S = 0 V 8 VG1S = 0 V 4 4 0 -1 0 1 2 3 4 Gate 1 to Source Voltage VG1S (V) 0 -1 0 1 2 3 4 Gate 2 to Source Voltage VG2S (V) 4 3SK194 Forward Transfer Admittance vs. Gate 1 to Source Voltage Forward Transfer Admittance yfs (mS) 30 VDS = 6 V f = 1 kHz Power Gain PG (dB) 50 Power Gain vs. Drain Current VDS = 6 V VG2S = 3 V f = 200 MHz 24 40 18 3 12 2.5 6 2 1.5 1 0.5 30 20 10 VG 2S =0 V 0 -1 0 1 2 3 4 Gate 1 to Source Voltage VG1S (V) Power Gain vs. Drain Current 0 4 8 12 16 Drain Current ID (mA) 20 Power Gain vs. Drain to Source Voltage 50 VG2S = 3 V ID = 10 mA f = 200 MHz 20 Power Gain PG (dB) 12 Power Gain PG (dB) VDS = 6 V VG2S = 3 V f = 900 MHz 4 8 12 16 Drain Current ID (mA) 20 16 40 30 8 20 4 10 0 0 4 8 12 16 20 Drain to Source Voltage VDS (V) 5 3SK194 Power Gain vs. Drain to Source Voltage 20 VG2S = 3 V ID = 10 mA f = 900 MHz 5 VDS = 6 V VG2S = 3 V f = 200 MHz Noise Figure vs. Drain Current 12 Noise Figure NF (dB) Power Gain PG (dB) 16 4 3 8 2 4 1 0 4 8 12 16 20 Drain to Source Voltage VDS (V) 0 4 8 12 16 Drain Current ID (mA) 20 Noise Figure vs. Drain Current 10 VDS = 6 V VG2S = 3 V f = 900 MHz 5 Noise Figure vs. Drain to Source Voltage VG2S = 3 V ID = 10 mA f = 200 MHz Noise Figure NF (dB) 6 Noise Figure NF (dB) 8 4 3 4 2 2 1 0 4 8 12 16 Drain Current ID (mA) 20 0 4 8 12 16 20 Drain to Source Voltage VDS (V) 6 3SK194 Noise Figure vs. Drain to Source Voltage 10 VG2S = 3 V ID = 10 mA f = 900 MHz Noise Figure NF (dB) 8 6 4 2 0 4 8 12 16 20 Drain to Source Voltage VDS (V) 7 Unit: mm 2.95 0.2 1.9 0.2 0.95 0.95 0.4 - 0.05 + 0.1 0.4 - 0.05 + 0.1 0.65 0.16 - 0.06 + 0.1 1.5 0.15 + 0.2 - 0.6 0 - 0.1 0.95 0.85 1.8 0.2 0.3 1.1 - 0.1 + 0.2 0.65 0.4 - 0.05 + 0.1 0.1 0.6 + 0.05 - 2.8 Hitachi Code JEDEC EIAJ Weight (reference value) MPAK-4 -- Conforms 0.013 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan. |
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