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| 486pga_temp4 Comparision Ceramic Packages Only AMD486DE2, DX2, DX4 & DX5 in PGA Packages with Heat Sink 100.0 80.0 degrees C 60.0 40.0 20.0 0.0 Max. Ambient Temp. at 3.3V 63.2 69.8 84.8 61.9 100.0 76.9 54.3 DE2 DX2 (Commercial) DX2 (Industrial) DX4 (Commercial) DX4 (Industrial) DX5 (Commercial) 80.0 degrees C 60.0 40.0 20.0 0.0 52.3 AMD486DE2, DX2, DX4 & DX5 in PGA Packages without Heat Sink 77.1 62.1 50.4 38.9 65.4 DE2 DX2 (Commercial) DX2 (Industrial) DX4 (Commercial) DX4 (Industrial) DX5 (Commercial) Max. Ambient Temp. at 3.3V Equations: Tj = Tcase + P * ThetaJC TA = Tj - P * ThetaJA Tcase = TA + P * (ThetaJA - ThetaJC) TA = Tcase - P * (ThetaJA - ThetaJC) 168 Pin Ceramic PGA with Heat Sink Theta JC Junction Theta JA (deg. C/Watt) Temp.(C) (deg. C/Watt) 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 88.5 89.4 89.8 102.7 103.0 103.3 87.7 88.0 88.3 104.1 104.6 105.0 89.1 89.6 90.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 AMD Am486 DE2 Commercial Typ. Max. Max. Typ. Max. Max. Typ. Max. Max. Typ. Max. Max. Typ. Max. Max. Typ. Max. Max. Typ. Max. Max. Enhanced AM486DX Data Sheet Specifications 168 Pin Ceramic PGA without Heat Spreader Voltage Icc Spec. Frequency Total Icc Power Case Temp. Theta JC Junction Theta JA Ambient (3.0-3.6V) (mA/MHz) (MHz) (mA) (Watts) (degrees C) (deg. C/Watt) Temp.(C) (deg. C/Watt) Temp.(C) 3.3 3.3 3.6 3.3 3.3 3.6 3.3 3.3 3.6 3.3 3.3 3.6 3.3 3.3 3.6 3.3 3.3 3.6 3.3 3.3 3.6 8.0 10.0 10.0 6.2 7.0 7.0 6.2 7.0 7.0 6.2 7.0 7.0 6.2 7.0 7.0 6.2 7.0 7.0 6.2 7.0 7.0 66 66 66 66 66 66 66 66 66 100 100 100 100 100 100 133 133 133 133 133 133 528.0 660.0 660.0 409.2 462.0 462.0 409.2 462.0 462.0 620.0 700.0 700.0 620.0 700.0 700.0 824.6 931.0 931.0 824.6 931.0 931.0 1.74 2.18 2.38 1.35 1.52 1.66 1.35 1.52 1.66 2.05 2.31 2.52 2.05 2.31 2.52 2.72 3.07 3.35 2.72 3.07 3.35 85 85 85 100 100 100 85 85 85 100 100 100 85 85 85 100 100 100 85 85 85 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 87.6 88.3 88.6 102.0 102.3 102.5 87.0 87.3 87.5 103.1 103.5 103.8 88.1 88.5 88.8 16.5 16.5 16.5 16.5 16.5 16.5 16.5 16.5 16.5 16.5 16.5 16.5 16.5 16.5 16.5 58.9 52.3 49.4 79.7 77.1 75.1 64.7 62.1 60.1 69.3 65.4 62.2 54.3 50.4 47.2 Ambient Temp.(C) 67.6 63.2 61.2 86.5 84.8 83.4 71.5 69.8 68.4 79.5 76.9 74.8 64.5 61.9 59.8 DX2 Industrial DX2 Commercial DX4 Industrial DX4 Commercial DX5 Industrial DX5 is Not Supported in Industrial Temp,, 168 PGA package 1.5 1.5 1.5 89.1 89.6 90.0 16.5 16.5 16.5 44.2 38.9 34.7 DX5 is Not Supported in Industrial Temp,, 168 PGA package 2.0 2.0 2.0 90.4 91.1 91.7 12.0 12.0 12.0 57.8 54.3 51.5 DX5 Commercial Table #1 Page 1 486pga_temp4 Comparision Ceramic Packages Only AMD's PDE-208 Standard SQFP Package Thermal Resistance Cooling Theta JA vs. Airflow in Linear ft/min. (m/sec) Mechanism Psi JT 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) No Heat Sink 1.5 14.0 8.7 7.4 6.4 5.8 Note 2. AMD's PDH-208 Low-Cost SQFP Package Thermal Resistance Cooling Theta JA vs. Airflow in Linear ft/min. (m/sec) Mechanism Psi JT 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) No Heat Sink 5.5 22.5 15.4 13.4 11.9 10.9 Note 2. AMD's 168 Pin PGA Package Thermal Resistance Cooling Theta JA vs. Airflow in Linear ft/min. (m/sec) Mechanism Theta JC 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) No Heat Sink 1.5 16.5 14.0 12.0 10.5 9.5 Note 2. Note: 1.) All data shown in Table #1 is based on No Airflow. 2.) Theta JA thermal resistance with Airflow is based on an average of measured values. Page 2 |
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