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FDC6901L May 2002 FDC6901L Integrated Load Switch General Description This device is particularly suited for compact power management. In portable electronic equipment where 2.5V to 6V input capability is needed. This load switch integrates a Slew Rate Control Driver that drives a P-Channel Power MOSFET in one tiny SuperSOT-6 package. The integrated slew rate control driver is specifically designed to control the turn on of the P-Channel MOSFET in order to limit the inrush current in battery switching applications with high capacitance loads. For turn-off, the IC pulls the MOSFET gate up quickly. Features * * * * * * Three programmable slew rates Reduces inrush current Minimizes EMI Normal turn-off speed Low-power CMOS operates over wide voltage range High performance trench technology for extremely low RDS(ON) Applications * * Load switch Power management D2 S1 D1 G2 SuperSOT Pin 1 TM -6 S2 G1 SuperSOTTM-6 Absolute Maximum Ratings Symbol VDD VIN PD TSTG TA=25oC unless otherwise noted Parameter Supply Voltage DC Input Voltage (Logic Inputs) Power Dissipation Storage Junction Temperature Range Ratings -0.5 to 10 -0.7 to 6 -55 to +150 Units V V C Recommended Operating Range VDD TJ Supply Voltage Operating Junction Temperature -0.5 to 10 -55 to +150 V C Thermal Characteristics RJA RJC Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case 180 60 C/W C/W Package Marking and Ordering Information Device Marking .901 Device FDC6901L Reel Size 7" Tape Width 8mm Quantity 3000 units 2002 Fairchild Semiconductor Corporation FDC6901L Rev C (W) Electrical Characteristics Symbol Parameter TA=25oC unless otherwise noted FDC6901L Test Conditions Min 75%* VDD Typ Max Units Logic Levels VIH VIL Logic HIGH Input Voltage Logic LOW Input Voltage VDD = 2.7 V to 6.0 V VDD = 2.7 V to 6.0 V V 25%* VDD V OFF Characteristics - Slew Rate Control Driver BVDG BVSLEW BVIN IRDG IRSLEW IRIN Supply Input Breakdown Voltage Slew Input Breakdown Voltage Logic Input Breakdown Voltage Supply Input Leakage Current Slew Input Leakage Current Logic Input Leakage Current IDG = 10 A, VIN = 0 V, VSLEW = 0 V ISLEW = 10 A, VIN = 0 V IIN = 10 A, VSLEW = 0 V VDG = 8 V, VIN = 0 V, VSLEW = 0 V VSLEW = 8 V, VIN = 0 V VIN = 8 V, VSLEW = 0 V 9 9 9 100 100 100 V V V nA nA nA OFF Characteristics - Slew Rate Control Driver + P-Channel MOSFET BVIO IRIO IO Breakdown Voltage IO Leakage Current ID = -250 A VR = 16 V 9 100 V nA ON Characteristics - Slew Rate Control Driver IG Output/Gate Current VIN = 6V VGATE = 2V Slew Pin = OPEN = GROUND = VDD -0.6 90 1 10 -1.0 120 170 160 130 105 110 3 -1.5 145 210 300 300 180 210 A A nA V m m mV mV m m A ON Characteristics - P-Channel MOSFET VGS(th) RDS(ON) Gate Threshold Voltage Static Drain-Source On Resistance Dropout Voltage Load switch On Resistance Load Current VDS = VGS , ID = -250 A VGS = -4.5 V, ID = -1.5 A VGS = -2.5 V, ID = -1.2 A VDD = 6V, VIN = 2.5V to 6V, IL = 1.5 A VDD = 6V, VIN = 2.5V to 6V, IL = 1.2 A VDD = 6V, VIN = 2.5V to 6V, IL = 1.5 A VDD = 6V, VIN = 2.5V to 6V, IL = 1.2 A VGS = 2.5 V, VDS = 6 V ON Characteristics - Slew Rate Control Driver + P-Channel MOSFET VDROP RON ILOAD P-Channel MOSFET Switching Times Vsupply = 5.5V, VDD = 5.5V, Logic IN = 5.5V, ILOAD = 1.5A Output Turn-On Delay Time Slew Pin = OPEN tdon = GROUND = VDD trise Output Rise Time Slew Pin = OPEN = GROUND = VDD dv/dt Output Slew Rate Slew Pin = OPEN = GROUND = VDD 6.20 42 115 6.75 124 162 600 41 24 s s s s s s V/ms V/ms V/ms FDC6901L Rev C (W) FDC6901L Typical Characteristics 220 VDD = 6V VIN = 2.55V to 6V 450 400 VDD = 6V VIN = 2.55V to 6V Dropout Voltage, VDrop (mV) Dropout Voltage, VDrop (mV) 200 IL = 1.5A 350 300 250 200 150 100 50 TJ = 25 C o 180 160 IL = 1.2A TJ = 125 C o 140 120 100 -50 -25 0 25 50 75 o 100 125 150 0 0 1 2 3 Junction Temperature, C Load Current, Amps (A) Figure 1. Dropout Voltage vs. Temperature. SLEW = OPEN 200 ILOAD = 1A Figure 2. Dropout Voltage vs. Load Current. SLEW = OPEN 140 VDD = 6V VIN = 2.55V to 6V IL = 1.2A IL = 1.5A Dropout Voltage, VDrop (mV) On-Resistance, RON (m) 180 130 120 160 TJ = 125oC 110 140 100 120 TJ = 25 C o 90 100 2.5 3 3.5 4 4.5 80 -50 -25 0 25 50 75 o 100 125 150 Input Voltage, VDD (V) Junction Temperature, C Figure 3. Dropout Voltage vs. Input Voltage. SLEW = OPEN 10 Figure 4. On-Resistance vs. Temperature. SLEW = OPEN 200 ILOAD = 1A VDD = 6V VIN = 2.55V to 6V 1 On-Resistance, RON (m) 180 On Resistance, RON () 160 TJ = 125 C o TJ = 125 C o 140 0.1 TJ = 25 C o 120 TJ = 25 C o 0.01 0.01 100 0.1 1 10 2.5 3 3.5 4 4.5 Load Current, Amps (A) Input Voltage, VDD (V) Figure 5. On-Resistance vs. Load Current. SLEW = OPEN Figure 6. . On-Resistance vs. Input Voltage. SLEW = OPEN FDC6901L Rev C (W) FDC6901L Typical Characteristics 7.5 Slew = Open Vdd=Vin=5.5V 160 140 120 trise Slew = Gnd Vdd=Vin=5.5V 7.0 time, microseconds (s) 6.5 time, secs 100 80 tdon 6.0 trise 60 40 20 tdon 5.5 5.0 0 10 20 30 40 50 0 0 10 20 30 40 50 Load Resistance, ohms () Load Resistance, ohms () Figure 7. Switching Time vs. Load Resistance. SLEW = OPEN 200 Slew = Vdd Vdd=Vin=5.5V Figure 8. Switching Time vs. Load Resistance. SLEW = GROUND 7.5 Slew = Open Vdd=Vin=5.5V 175 time, microseconds (s) 7.0 150 tris time, (sec) 6.5 trise tdon 125 tdon 6.0 100 5.5 75 0 10 20 30 40 50 5.0 0.0 0.5 1.0 1.5 2.0 2.5 Load Resistance, ohms () Load Current, Amps (A) Figure 9. Switching Time vs. Load Resistance. SLEW = VDD 160 Slew = Gnd Vdd=Vin=5.5V Figure 10. Switching time vs. Load Current. SLEW = OPEN 200 Slew = Vdd Vdd=Vin=5.5V 140 175 120 trise time, microseconds (s) time, sec 100 80 60 tdon 150 trise 125 tdon 100 40 20 0.0 0.5 1.0 1.5 2.0 2.5 75 0.0 0.5 1.0 1.5 2.0 2.5 Load Current, Amps (A) Load Current, Amps (A) Figure 11. Switching time vs. Load Current. SLEW = GROUND Figure 12. Switching time vs. Load Current. SLEW = VDD FDC6901L Rev C (W) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx Bottomless CoolFET CROSSVOLT DenseTrench DOME EcoSPARK E2CMOSTM EnSignaTM FACT FACT Quiet Series DISCLAIMER FAST a FASTr FRFET GlobalOptoisolator GTO HiSeC I2C ISOPLANAR LittleFET MicroFET MicroPak MICROWIRE OPTOLOGIC a OPTOPLANAR PACMAN POP Power247 PowerTrench a QFET QS QT Optoelectronics Quiet Series SILENT SWITCHER a UHC SMART START UltraFET a SPM VCX STAR*POWER Stealth SuperSOT-3 SuperSOT-6 SuperSOT-8 SyncFET TinyLogic TruTranslation STAR*POWER is used under license FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Preliminary No Identification Needed Full Production Obsolete Not In Production Rev. H5 |
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