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(R) BTA/BTB24, BTA25, BTA26 and T25 Series 25A TRIACS SNUBBERLESSTM & STANDARD MAIN FEATURES: Symbol IT(RMS) V DRM/VRRM IGT (Q1) Value 25 600 and 800 35 to 50 Unit A V mA A1 A2 G A2 G A2 A2 A1 A1 A2 G DESCRIPTION Available either in through-hole of surface and T25 mount packages, the BTA/BTB24-25-26 triac series is suitable for general purpose AC power switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, water heaters, induction motor starting circuits...or for phase control operation in high power motor speed controllers, soft start circuits...The snubberless versions (BTA/BTB...W and T25 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500V RMS) complying with UL standards (File ref.: E81734). ABSOLUTE MAXIMUM RATINGS Symbol IT(RMS) Parameter RMS on-state current (full sine wave) TO-220AB Insulated (BTA24) A1 A2 G A2 TO-220AB (BTB24) A1 G A2 D 2PAK (T25G) A1 A2 G RD91 (BTA25) TOP3 Insulated (BTA26) Value Tc = 100C Tc = 90C Tc = 75C t = 16.7 ms t = 20 ms 25 Unit A ITSM It dI/dt Non repetitive surge peak on-state current (full cycle, Tj initial = 25C) I t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns D PAK TO-220AB RD91 TOP3 Ins. TO-220AB Ins. F = 60 Hz F = 50 Hz 260 250 450 A As A/s V A W C 1/9 tp = 10 ms F = 120 Hz tp = 10 ms tp = 20 s Tj = 125C Tj = 25C Tj = 125C Tj = 125C 50 V DRM/VRRM + 100 VDSM/VRSM Non repetitive surge peak off-state voltage IGM PG(AV) Tstg Tj Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range 4 1 - 40 to + 150 - 40 to + 125 September 2000 - Ed: 3 BTA/BTB24, BTA25, BTA26 and T25 Series ELECTRICAL CHARACTERISTICS (Tj = 25C, unless otherwise specified) s SNUBBERLESSTM (3 Quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W Symbol Test Conditions Quadrant T25 T2535 IGT (1) V GT VGD IH (2) IL dV/dt (2) VD = 12 V VD = VDRM IT = 500 mA IG = 1.2 IGT VD = 67 % VDRM gate open Tj = 125C Tj = 125C I - III II MIN. MIN. (dI/dt)c (2) Without snubber R L = 33 RL = 3.3 k Tj = 125C I - II - III I - II - III I - II - III MAX. MAX. MIN. MAX. MAX. 50 70 80 500 13 35 BTA/BTB CW 35 1.3 0.2 50 70 80 500 13 75 80 100 1000 22 V/s A/ms BW 50 mA V V mA mA Unit s STANDARD (4 Quadrants): BTA25...B, BTA26...B Symbol IGT (1) VD = 12 V VGT VGD IH (2) IL dV/dt (2) VD = VDRM IT = 500 mA IG = 1.2 IGT VD = 67 % VDRM gate open Tj = 125C Tj = 125C I - III - IV II MIN. MIN. RL = 3.3 k Tj = 125C Test Condit ions RL = 33 Quadrant I - II - III IV ALL ALL MAX. MAX. MIN. MAX. MAX. Value 50 100 1.3 0.2 80 70 160 500 10 V/s V/s Unit mA V V mA mA (dV/dt)c (2) (dI/dt)c = 13.3 A/ms STATIC CHARACTERISTICS Symbol VTM (2) Vto (2) Rd (2) I DRM I RRM Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1 Test Conditions ITM = 35 A tp = 380 s Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C MAX. MAX. MAX. MAX. Value 1.55 0.85 16 5 3 Unit V V m A mA Threshold voltage Dynamic resistance VDRM = VRRM 2/9 BTA/BTB24, BTA25, BTA26 and T25 Series THERMAL RESISTANCES Symbol Rth(j-c) Junction to case (AC) Parameter D PAK TO-220AB RD91 (Insulated) TOP3 Insulated TO-220AB Insulated R th(j-a) Junction to ambient S = 1 cm D PAK TOP3 Insulated TO-220AB TO-220AB Insulated S: Copper surface under tab Value 0.8 1.1 1.7 45 50 60 Unit C/W C/W PRODUCT SELECTOR Voltage (xxx) Part Number 600 V BTB24-xxxB BTA/BTB24-xxxBW BTA/BTB24-xxxCW BTA25-xxxB BTA25-xxxBW BTA25-xxxCW BTA26-xxxB BTA26-xxxBW BTA26-xxxCW T2535-xxxG BTB: Non insulated TO-220AB package Sensitivity 800 V X X X X X X X X X X 50 mA 50 mA 35 mA 50 mA 50 mA 35 mA 50 mA 50 mA 35 mA 35 mA Type Package TO-220AB TO-220AB TO-220AB RD-91 RD-91 RD-91 TOP3 Ins. TOP3 Ins. TOP3 Ins. D PAK X X X X X X X X X X Standard Snubberless Snubberless Standard Snubberless Snubberless Standard Snubberless Snubberless Snubberless ORDERING INFORMATION BT A 24 TRIAC SERIES INSULATION: A: insulated B: non insulated CURRENT: 24: 25A in TO-220AB 25: 25A in Rd91 26: 25A in TOP3 600 BW SENSITIVITY & TYPE B: 50mA STANDARD BW: 50mA SNUBBERLESS CW: 35mA SNUBBERLESS VOLTAGE: 600: 600V 800: 800V 3/9 BTA/BTB24, BTA25, BTA26 and T25 Series T 25 35 TRIAC SERIES CURRENT: 25A - 600 G PACKAGE: G: D2PAK (-TR) VOLTAGE: 600: 600V 800: 800V SENSITIVITY: 35: 35mA PACKING MODE: Blank: Tube -TR: Tape & Reel OTHER INFORMATION Part Number BTA/BTB24-xxxyz BTA25-xxxyz BTA26-xxxyz T2535-xxxG T2535-xxxG-TR Marking BTA/BTB24xxxyz BTA25xxxyz BTA26xxxyz T2535xxxG T2535xxxG Weight 2.3 g 20 g 4.5 g 1.5 g 1.5 g Base quantity 250 25 120 50 1000 Packing mode Bulk Bulk Bulk Tube Tape & reel Note: xxx= voltage, y = sensitivity, z = type 4/9 BTA/BTB24, BTA25, BTA26 and T25 Series Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle). P (W) 30 25 20 15 10 5 0 0 5 IT(RMS) (A) 10 15 20 25 Fig. 2-1: RMS on-state current versus case temperature (full cycle). IT(RMS) (A) 30 BTB/T25 25 BTA24 20 15 10 5 Tc(C) 0 0 25 50 75 100 125 BTA25/26 Fig. 2-2: D PAK RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35 m), full cycle. IT(RMS) (A) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 Tamb(C) 50 75 100 125 D PAK (S=1cm2) 2 Fig. 3: Relative variation of thermal impedance versus pulse duration. 1E+0 K=[Zth/Rth] Zth(j-c) 1E-1 Zth(j-a) BTA/BTB24/T25 1E-2 Zth(j-a) BTA26 tp (s) 1E-3 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Fig. 4: values). ITM (A) 300 100 On-state characteristics (maximum Fig. 5: Surge peak on-state current versus number of cycles. ITSM (A) 300 250 t=20ms Tj max 200 150 Non repetitive Tj initial=25C One cycle 10 Tj=25C 100 Repetitive Tc=75C VTM (V) 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Tj max. Vto = 0.85 V Rd = 16 m 50 Number of cycles 4.0 4.5 0 1 10 100 1000 5/9 BTA/BTB24, BTA25, BTA26 and T25 Series Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10ms, and corresponding value of I t. ITSM (A), I t (A s) 3000 Tj initial=25C dI/dt limitation: 50A/s Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values). IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25C] 2.5 2.0 1000 ITSM IGT 1.5 It IH & IL 1.0 0.5 tp (ms) 100 0.01 0.10 1.00 10.00 Tj(C) 0.0 -40 -20 0 20 40 60 80 100 120 140 Fig. 8: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.4 2.2 2.0 1.8 1.6 BW/CW/T2535 1.4 B 1.2 1.0 0.8 0.6 (dV/dt)c (V/s) 0.4 0.1 1.0 10.0 Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature. (dI/dt)c [Tj] / (dI/dt)c [Tj specified] 6 5 4 3 2 1 Tj (C) 0 25 50 75 100 125 100.0 0 Fig. 10: D PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 m). Rth(j-a) (C/W) 80 70 60 50 40 30 20 10 0 0 4 8 12 16 S(cm ) 20 24 28 32 36 40 D PAK 6/9 BTA/BTB24, BTA25, BTA26 and T25 Series PACKAGE MECHANICAL DATA D PAK (Plastic) DIMENSIONS A E L2 C2 REF. Millimeters Min. Typ. Max. 4.60 2.69 0.23 0.93 Min. Inches Typ. Max. 0.181 0.106 0.009 0.037 0.055 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 8 0 8 D L L3 A1 B2 B G A2 2.0 MIN. FLAT ZONE V2 C R A A1 A2 B B2 C C2 D E G L L2 L3 R V2 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0 1.40 0.169 0.098 0.001 0.027 0.048 0.60 0.017 1.36 0.047 9.35 0.352 10.28 0.393 5.28 0.192 15.85 0.590 1.40 0.050 1.75 0.055 0.40 FOOTPRINT DIMENSIONS (in millimeters) D PAK (Plastic) 16.90 10.30 1.30 5.08 3.70 8.90 7/9 BTA/BTB24, BTA25, BTA26 and T25 Series PACKAGE MECHANICAL DATA RD91 (Plastic) DIMENSIONS L2 A2 L1 REF. Millimeters Min. Max. 40.00 30.30 22.00 27.00 16.50 24.00 14.00 3.50 3.00 0.90 4.50 13.60 3.50 1.90 43 38 Min. Inches Max. 1.575 1.193 0.867 1.063 0.650 0.945 0.551 0.138 0.118 0.035 0.177 0.535 0.138 0.075 43 38 B2 C B1 C2 A1 C1 N2 N1 B F E3 I A A A1 A2 B B1 B2 C C1 C2 E3 F I L1 L2 N1 N2 29.90 1.177 13.50 0.531 1.95 0.70 4.00 11.20 3.10 1.70 33 28 0.077 0.027 0.157 0.441 0.122 0.067 33 28 PACKAGE MECHANICAL DATA TOP3 (Plastic) DIMENSIONS REF. Millimeters Min. A B C D E F G H J K L P R 4.4 1.45 14.35 0.5 2.7 15.8 20.4 15.1 5.4 3.4 4.08 1.20 4.60 Typ. Max. 4.6 1.55 15.60 0.7 2.9 16.5 21.1 15.5 5.65 3.65 4.17 1.40 Min. 0.173 0.057 0.565 0.020 0.106 0.622 0.815 0.594 0.213 0.134 0.161 0.047 0.181 Inches Typ. Max. 0.181 0.061 0.614 0.028 0.114 0.650 0.831 0.610 0.222 0.144 0.164 0.055 8/9 BTA/BTB24, BTA25, BTA26 and T25 Series PACKAGE MECHANICAL DATA TO-220AB (Plastic) DIMENSIONS B b2 C REF. Millimeters Min. Typ. 3.75 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 Max. Min. Inches Typ. 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.646 0.661 0.116 0.066 0.066 0.102 Max. 0.625 L F I A l4 a1 c2 l3 l2 a2 b1 e M c1 A a1 a2 B b1 b2 C c1 c2 e F I I4 L l2 l3 M 15.20 15.90 0.598 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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