View MSM6422_235017.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

E2E0016-38-93 Semiconductor
Semiconductor MSM6422
High speed and Simple 4-Bit Microcontroller
This version: Sep. 1998 MSM6422 Previous version: Mar. 1996
GENERAL DESCRIPTION
The MSM6422 is a low-power, single-chip device implemented in complementary metal-oxide semiconductor technology. The MSM6422 can be used in place of logic ICs configured around a main CPU, or for small-scale systems such as home electronic equipment.
FEATURES
* ROM * RAM * I/O port Input-output port : 2048 words 8 bits : 64 words 4 bits
: 4 ports 4 bits (pseudo bidirectional configuration) 1 port 2 bits (pseudo bidirectional configuration) Input port : 1 port 1 bit (combined use with an interrupt input) * Instructions : 63 * Two interrupt sources (1 internal, 1 external) * Power down features * Minimum instruction execution time : 952 ns @ 4.2 MHz clock * Crystal and ceramic oscillation * Single 5 V power supply * Package options: 24-pin plastic DIP (DIP24-P-600-2.54) : (Product name : MSM6422-RS) 24-pin plastic SOP (SOP24-P-430-1.27-K) : (Product name : MSM6422-GS-K) indicates a code number.
1/10
Semiconductor
MSM6422
BLOCK DIAGRAM
RAM 64 4 bits ACC DEC C SP LR HR ALU PC
INST DEC
ROM 2048 8 bits
DEC
INT.C P5 P4 P3 P1 P0 P2 12-bitTBC Timing & Control
10
3 21 0
3 21 0
3 21 0
3 21 0
0/INT
GND VDD OSC1 OSC0 RESET
2/10
Semiconductor
MSM6422
PIN CONFIGURATION (TOP VIEW)
P2.0/INT P0.0 P0.1 P0.2 P0.3 P1.0 P1.1 P1.2 P1.3
1 2 3 4 5 6 7 8 9
24 23 22 21 20 19 18 17 16 15 14 13
VDD P5.1 P5.0 P4.3 P4.2 P4.1 P4.0 P3.3 P3.2 P3.1 P3.0 RESET
P2.0/INT P0.0 P0.1 P0.2 P0.3 P1.0 P1.1 P1.2 P1.3
1 2 3 4 5 6 7 8 9
24 23 22 21 20 19 18 17 16 15 14 13
VDD P5.1 P5.0 P4.3 P4.2 P4.1 P4.0 P3.3 P3.2 P3.1 P3.0 RESET
OSC1 10 OSC0 11 GND 12
OSC1 10 OSC0 11 GND 12
24-Pin Plastic DIP
24-Pin Plastic SOP
3/10
Semiconductor
MSM6422
PIN DESCRIPTIONS
Pin 2 3 4 5 6 7 8 9 14 15 16 17 18 19 20 21 22 23 1 Symbol P0.0 P0.1 P0.2 P0.3 P1.0 P1.1 P1.2 P1.3 P3.0 P3.1 P3.2 P3.3 P4.0 P4.1 P4.2 P4.3 P5.0 P5.1 P2.0/INT I/O 2-bit input-output port (pseudo bidirectional configuration) 1-bit input port with a latch I Combined use with an interrupt input (falling edge trigger input) 11 10 13 24 12 OSC0 OSC1 RESET VDD GND I O I I I System clock (SYSCLK) input pin This provides an oscillation circuit with OSC1 pin. System clock output pin This provides an oscillation circuit with OSC0 pin. RESET input pin Power supply voltage pins Ground pin "0" The latch is reset to "0". -- -- -- -- -- I/O 4-bit input-output port (pseudo bidirectional configuration) "0" I/O 4-bit input-output port (pseudo bidirectional configuration) "1" I/O 4-bit input-output port (pseudo bidirectional configuration) "1" I/O 4-bit input-output port (pseudo bidirectional configuration) "1" Type Description During reset
4/10
Semiconductor
MSM6422
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Output Voltage Power Dissipation Storage Temperature Symbol VDD VI VO PD TSTG Ta = 25C per package Ta = 25C per output -- Ta = 25C Condition Rating -0.3 to +7 -0.3 to VDD -0.3 to VDD 200 max. 50 max. -55 to +150 Unit V V V mW mW C
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Data-Hold Voltage Operating Temperature Fan Out Symbol VDD VDDH Top N Condition fOSC 1 MHz fOSC 4.2 MHz fOSC = 0 Hz -- MOS load TTL load Range 3 to 6 4.5 to 5.5 2 to 6 -40 to +85 15 1 Unit V V V C -- --
5/10
Semiconductor
MSM6422
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD = 5 V 10%, Ta = -40 to +85C) Parameter "H" Input Voltage*1,*2 "H" Input Voltage*3,*4 "L" Input Voltage "H" Output Voltage*1,*5 "L" Output Voltage*1 "L" Output Voltage*5 Input Current*3 Input Current*2,*4 "H" Output Current*1 "H" Output Current*1 Input Capacitance Output Capacitance Power Supply Current (In Stop Mode) Power Supply Current Symbol VIH VIH VIL VOH VOL VOL IIH/IIL IIH/IIL IOH IOH CI CO IDDS IDD Condition -- -- -- IO = -15 mA IO = 1.6 mA IO = 15 mA VI = VDD/0 V VI = VDD/0 V VO = 2.4 V VO = 0.4 V f = 1 MHz, Ta = 25C VDD = 2 V, no load, Ta = 25C No load Crystal oscillation, no load, 4.2 MHz Min. 2.4 4.2 -0.3 4.2 -- -- -- -- -0.1 -- -- -- -- -- -- Typ. -- -- -- -- -- -- -- -- -- -- 5 7 0.2 1 6 Max. VDD VDD +0.8 -- 0.4 0.4 15/-15 1/-30 -- -1.2 -- -- 5 100 12 Unit V V V V V V mA mA mA mA pF mA mA mA
*1 *2 *3 *4 *5
Applied to P0, P1, P3, P4, and P5 Applied to P2 Applied to OSC0 Applied to RESET Applied to OSC1
6/10
Semiconductor AC Characteristics
MSM6422
(VDD = 5 V 10%, Ta = -40 to +85C) Parameter Clock (OSC0) Pulse Width Cycle Time Input Data Setup Time Input Data Hold Time Input Data/Input Clock Pulse Width Data Delay Time Symbol tfW tCY tDS tDH tDW tDR Condition -- -- -- -- -- CL = 15 pF 1MC tCY OSC0 tfW P0, P1, P3, P4, P5 tfW INPUT DATA tDS tDH Min. 119 952 120 120 120 -- Typ. -- -- -- -- -- -- Max. -- -- -- -- -- tCY + 300 Unit ns ns ns ns ns ns
P0, P1, P3, P4, P5 tDR
P2.0/INT tDW
7/10
Semiconductor Operating Characteristics Current (IOH) vs Voltage (VOH) for High Level Output
(Ta = 25C) -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0
MSM6422
Current (IOL) vs Voltage (VOL) for Low Level Output
20 6V 18 16 14 12 10 8 6 4 2 0 VDD = 5 V 4V
(Ta = 25C)
IOH (mA)
5V 4V 3V
IOL (mA)
VDD = 6 V
3V
0 1 2 3 4 5 6 7 8 9 10 VOH (V)
1 2 3 4 5 6 7 8 9 10 VOL (V)
Maximum Clock Frequency (fOSC) vs Supply Voltage (VDD)
(Ta = 25C, CL = 15 pF) 10 9 8 7 6 5 4 3 2 1 0
Supply Current (IDD) vs Supply Voltage (VDD)
(Ta = 25C, no Load) 10 m 5m 1m 500 m 100 m 50 m
IDD (A)
fOSC = 4 MHz 2 MHz 1 MHz 500 kHz 100 kHz
fOSC (MHz)
0 1 2 3 4 5 6 7 8 9 10 VDD (V)
10 m 5m 0 Hz 1m 500 n 100 n 0 1 2 3 4 5 6 7 8 9 10 VDD (V)
Maximum Clock Frequency (fOSC) vs Ambient Temperature (Ta)
(VDD = 5 V, CL = 15 pF) 10 9 8 7 6 5 4 3 2 1 0
fOSC (MHz)
-40-20 0 20 40 60 80 100120 Ta (C)
8/10
Semiconductor
MSM6422
PACKAGE DIMENSIONS
(Unit : mm)
DIP24-P-600-2.54
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 3.55 TYP.
9/10
Semiconductor
MSM6422
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
10/10

▲Up To Search▲

Price & Availability of MSM6422

	To Download MSM6422 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .