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AM79514
Subscriber Line Interface Circuit
DISTINCTIVE CHARACTERISTICS
s Programmable constant-current feed s Programmable loop-detect threshold s On-chip switching regulator for low-power dissipation s Polarity reversal feature s Optimized for -60 V battery s Line feed characteristics independent of battery variations s Two-wire impedance set by single external impedance s Tip Open state for ground-start lines s Ring and test relay drivers s On-hook transmission
BLOCK DIAGRAM
Test Relay Driver Ring Relay Driver A(TIP) C1 C2 HPA Ground-Key Detector Input Decoder and Control C3 C4 E1 Two-Wire Interface HPB Signal Transmission Off-Hook Detector B(RING) RD Power-Feed Controller DA DB VREG L VBAT BGND CHS QBAT CHCLK VCC VEE AGND/DGND Ring-Trip Detector DET VTX RSN TESTOUT RINGOUT
RDC
Switching Regulator
Publication# 18411 Rev: D Amendment: /0 Issue Date: October 1999
ORDERING INFORMATION Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below. AM79514 -1 J C TEMPERATURE RANGE C = Commercial (0C to 70C)*
PACKAGE TYPE J = 32-pin Plastic Leaded Chip Carrier (PL 032)
PERFORMANCE GRADE -1 = Performance Grading -2 = Performance Grading
DEVICE NUMBER/DESCRIPTION AM79514 Subscriber Line Interface Circuit
Valid Combinations Valid Combinations -1 Am7951X -2 JC Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations, to check on newly released combinations, and to obtain additional data on AMD's standard military grade products.
Note: * Functionality of the device from 0C to +70C is guaranteed by production testing. Performance from -40C to +85C is guaranteed by characterization and periodic sampling of production units.
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AM79514 Data Sheet
CONNECTION DIAGRAMS Top View
AM79514 RINGOUT B(RING) VREG BGND A(TIP) 31
VCC
4 TP TESTOUT L VBAT QBAT CHS CHCLK C4 E1 5 6 7 8 9 10 11 12 13 14 E0
3
2
1
32
30 29 28 27 26 25 24 23 22 21 TP DA RD HPB HPA VTX VEE RSN AGND
15 DET
16 C2
17 18 C1 C3
19 RDC
20 DGND
Notes: 1. Pin 1 is marked for orientation. 2. TP is a thermal conduction pin tied to substrate.
SLIC Products
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PIN DESCRIPTIONS
Pin Names AGND A(TIP) BGND B(RING) C3-C1 C4 DGND CHCLK CHS DA DB DET Type Gnd Output Gnd Output Inputs Input Gnd Input Input Input Input Output Analog ground. Output of A(TIP) power amplifier. Battery (power) ground. Output of B(RING) power amplifier. Decoder. TTL compatible. C3 is MSB and C1 is LSB. Test relay driver command. TTL compatible. A logic High enables the driver. Digital ground. Chopper clock. Input to switching regulator (TTL compatible) Frequency = 256 kHz (nominal). Chopper stabilization. Connection for external stabilization components. Ring-Trip negative. Negative input to ring-trip comparator. Ring-Trip positive. Positive input to ring-trip comparator. Detector. When enabled, a logic Low indicates that the selected detector is tripped. The detector is selected by the logic inputs (C3-C1 and E1). The output is open-collector with a built-in 15 k pull-up resistor. Read enable. A logic High enables DET. A logic Low disables DET. Ground key enable. E1 = High connects the ground-key detector to DET, and E1 = Low connects the off-hook or ring-trip detector to DET. High-pass filter capacitor. A(TIP) side of high-pass filter capacitor. High-pass filter capacitor. B(RING) side of high-pass filter capacitor. Switching regulator power transistor. Connection point for filter inductor and anode of catch diode. This pin will have up to 60 V of pulse waveform on it and must be isolated from sensitive circuits. Extreme care must be taken to keep the diode connections short because of the high currents and high di/dt. Quiet battery. Filtered battery supply for the signal processing circuits. An external 100 , 1/8 resistor must be connected between QBAT and VBAT pins. Detect resistor. Threshold modification and filter point for the off-hook detector. DC feed resistor. Connection point for the DC feed current programming network. The other end of the network connects to the receiver summing node (RSN). The sign of VRDC is negative for normal polarity and positive for reverse polarity. Ring relay driver. Sourcing from BGND with internal diode to QBAT. Receive summing node. The metallic current (both AC and DC) between A(TIP) and B(RING) is equal to 1000 times the current into this pin. The networks that program receive gain, two-wire impedance, and feed current all connect to this node. This node is extremely sensitive. Care should be taken to route the 256-kHz chopper clock and switch lines away from the RSN node. Test relay driver. Sourcing from BGND with internal diode to QBAT. Description
E0 E1 HPA HPB L
Input Input Capacitor Capacitor Output
QBAT RD RDC
Battery Resistor Resistor
RINGOUT RSN
Output Input
TESTOUT TP
Output Thermal
Thermal pin. Connection for heat dissipation. Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the TP pins can connect to an area of copper on the board to enhance heat dissipation.
Battery Supply. +5 V power supply. -5 V power supply. Regulated voltage. Provides negative power supply for power amplifiers, connection point for inductor, filter capacitor, and chopper stabilization. Transmit audio. This output is a unity gain version of the A(TIP) and B(RING) metallic voltage. The other end of the two-wire input impedance programming network connects here.
VBAT VCC VEE VREG VTX
Battery Power Power Input Output
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AM79514 Data Sheet
ABSOLUTE MAXIMUM RATINGS
Storage temperature ......................... -55C to +150C VCC with respect to AGND/DGND ..... -0.4 V to +7.0 V VEE with respect to AGND/DGND...... +0.4 V to -7.0 V VBAT with respect to AGND/DGND ..... +0.4 V to -70 V
Note: Rise time of VBAT (dv/dt) must be limited to 27 V/s or less when QBAT bypass = 0.33 F.
OPERATING RANGES
Commercial (C) Devices Ambient temperature .............................0C to +70C* VCC .....................................................4.75 V to 5.25 V VEE .................................................-4.75 V to -5.25 V VBAT ......................................................-40 V to -63 V AGND/DGND .......................................................... 0 V BGND with respect to AGND/DGND........................ -100 mV to +100 mV Load resistance on VTX to ground .............. 10 k min
Operating Ranges define those limits between which the functionality of the device is guaranteed. * Functionality of the device from 0C to +70C is guaranteed by production testing. Performance from -40C to +85C is guaranteed by characterization and periodic sampling of production units.
BGND with respect to AGND/DGND.. +1.0 V to -3.0 V A(TIP) or B(RING) to BGND: Continuous .................................... -70 V to +1.0 V 10 ms (f = 0.1 Hz) .......................... -70 V to +5.0 V 1 s (f = 0.1 Hz) .............................. -90 V to +10 V 250 ns (f = 0.1 Hz) ........................ -120 V to +15 V Current from A(TIP) or B(RING)....................... 150 mA Voltage on RINGOUT ....... BGND to 70 V above QBAT Voltage on TESTOUT ....... BGND to 70 V above QBAT Current through relay drivers .............................60 mA Voltage on ring-trip inputs DA and DB .......VBAT to 0 V Current into ring-trip inputs.................................. 10 mA Peak current into regulator switch (L pin) ........150 mA Switcher transient peak off voltage on L pin ......+1.0 V C4-C1, E1, CHCLK, to AGND/DGND ....................-0.4 V to VCC + 0.4 V Maximum power dissipation, (see note) ...... TA = 70C In 32-pin PLCC package..............................1.74 W
Note: Thermal limiting circuitry on chip will shut down the circuit at a junction temperature of about 165C. The device should never be exposed to this temperature. Operation above 145C junction temperature may degrade device reliability. See the SLIC Packaging Considerations for more information. Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability.
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ELECTRICAL CHARACTERISTICS
Description Analog (VTX) output impedance Analog (VTX) output offset Analog (RSN) input impedance Longitudinal impedance at A or B Overload level Z2WIN = 600 to 900 2-wire return loss (See Test Circuit D) 4-wire 2-wire 300 Hz to 500 Hz 500 Hz to 2500 Hz 2500 Hz to 3400 Hz 200 Hz to 1 kHz: normal polarity 0C to +70C normal polarity -40C to+85C reverse polarity 1 kHz to 3.4 kHz: normal polarity 0C to +70C normal polarity -40C to +85C reverse polarity Longitudinal sum (L-T) + (T-L) Longitudinal signal generation 4-L or T-L Longitudinal current capability per wire Gain accuracy 300 to 3400 Hz 300 to 800 Hz 800 to 3400 Hz Active state OHT state 0 dBm, 1 kHz, 0C to +70C 0 dBm, 1 kHz, -40C to +85C 0 dBm, 1 kHz, 0C to +70C 0 dBm, 1 kHz, -40C to +85C 300 Hz to 3400 Hz Relative to 1 kHz 0C to +70C -40C to +85C +7 dBm to -55 dBm 0C to +70C -40C to +85C -1* -2 -2 -2 -1* -2 -2 -2 -3.1 -3.1 26 26 20 50 63 58 58 52 dB 58 54 54 95 40 35 17 8 mArms 0C to +70C -40C to +85C 300 Hz to 3.4 kHz -35 -40 1 Test Conditions (See Note 1) Min Typ 3 Max 20 +35 +40 20 35 +3.1 +3.1 W 2 -- 4 -- -- Unit W mV -- 4 Note
Vpk
Transmission Performance, 2-Wire Impedance dB
Longitudinal Balance (2-Wire and 4-Wire, See Test Circuit C) Longitudinal to metallic L-T, L-4
5
Insertion Loss (2- to 4-Wire and 4- to 2-Wire, See Test Circuits A and B) -0.15 -0.20 -1* -1 -0.1 -0.15 +0.15 +0.20 +0.1 +0.15 dB 4 4
Variation with frequency
-0.1 -0.15 -0.1 -0.15
+0.1 +0.15 +0.1 +0.15
4
Gain tracking
Note: * P.G. = Performance Grade
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AM79514 Data Sheet
ELECTRICAL CHARACTERISTICS (CONTINUED)
Description Gain accuracy Test Conditions (See Note 1) 0 dBm, 1 kHz, 0C to +70C 0 dBm, 1 kHz, -40C to +85C 0 dBm, 1 kHz, 0C to +70C 0 dBm, 1 kHz, -40C to +85C 300 Hz to 3400 Hz Relative to 1 kHz 0C to +70C -40C to +85C +7 dBm to -55 dBm 0C to +70C -40C to +85C f = 1 kHz 0 dBm, 300 Hz to 3400 Hz +9 dBm 2-wire 2-wire 4-wire 4-wire Metallic 0C to +70C -40C to +85C 0C to +70C -40C to +85C Min Typ Max Unit Note Balance Return Signal (4-Wire to 4-Wire, See Test Circuit B) -0.15 -0.20 -1* -1 -0.1 -0.15 +0.15 +0.20 +0.1 +0.15 dB 4 4
Variation with frequency
-0.1 -0.15 -0.1 -0.15 5.3 -64 -55 -83 -83 -83 -83 -76 -76 -57 -70 -85 -57
+0.1 +0.15 +0.1 +0.15 s -50 -40 -78 -75 -78 -75
4
Gain tracking
Group delay Distortion level Distortion level Idle Channel Noise Psophometric weighted noise
Total Harmonic Distortion (2- to 4-Wire or 4- to 2-Wire, See Test Circuits A and B) dB
dBmp
7 4, 7 7 4, 7
Single Frequency Out-of-Band Noise (See Test Circuit E) 4 kHz to 9 kHz 9 kHz to 1 MHz 256 kHz and harmonics 1 kHz to 15 kHz Above 15 kHz 256 kHz and harmonics 4, 5, 9 4, 5 4, 5, 9 4, 5
Longitudinal
dBm
DC Feed Current and Voltage (See Figure 1) Unless otherwise noted, Battery = 60 V (VBAT = -59.3 V) Active state loop-current accuracy On-hook loop voltage OHT state Tip Open state Disconnect state On-hook Open Circuit state On-hook OHT state On-hook Active state Off-hook OHT state Off-hook Active state ILOOP (nominal) = 40 mA RL = 2000 , Battery = 62 V RL = 2080 RL = RL = 600 RL = 600 RL = 0 -1* -2 -7.5 23 22.7 47.5 18 49 20 22 1.0 1.0 120 250 400 750 1000 +7.5 % mA mA V mA
4
Power Dissipation, Battery = -60 V 50 175 260 500 650
mW
RL = 600 RL = 600
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ELECTRICAL CHARACTERISTICS (CONTINUED)
Description Supply Currents VCC On-hook supply current Open Circuit state OHT state Active state Open Circuit state OHT state Active state Open Circuit state OHT state Active state 40 Hz to 3400 Hz 3.4 kHz to 50 kHz 40 Hz to 3400 Hz 3.4 kHz to 50 kHz 40 Hz to 3400 Hz 3.4 kHz to 50 kHz IDET = 365/RD 20 20 20 15 27 20 -20 2.0 4.2 9 -5 Source resistance = 0 to 200 k -50 2.0 0.8 All inputs except E1 Input E1 -75 -75 -0.4 IOUT = 0.8 mA IOUT = -0.1 mA 50 mA source 2.4 BGND -2 0.5 50 mA sink QBAT -2 100 0.4 40 45 A mA -0.05 0 +50 3 6 7.5 1.0 2.2 2.7 0.4 3.0 4.0 35 30 30 25 30 30 +20 10.0 % k mA A mV V 8 dB 4.5 10 12 2.3 3.5 6.0 1.0 5.0 6.0 6, 7 -- 6, 7 -- 6, 7 -- mA Test Conditions (See Note 1) Min Typ Max Unit Note
VEE On-hook supply current
VBAT On-hook supply current
Power Supply Rejection Ratio (VRIPPLE = 50 mVrms) VCC VEE VBAT Off-Hook Detector Current threshold Ground-Key Detector Thresholds Active State, Battery = -60 V Ground-key resistance threshold B(RING) to GND Ground-key current threshold Ring-Trip Detector Input Bias current Offset voltage Input High voltage Input Low voltage Input High current Input Low current Logic Output (DET) Output Low voltage Output High voltage On voltage Off leakage Clamp voltage V Logic Inputs (C4-C1, E1, and CHCLK) B(RING) or midpoint to GND
Relay Driver Outputs (RINGOUT, TESTOUT) V A V
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AM79514 Data Sheet
RELAY DRIVER SCHEMATICS
BGND BGND
RINGOUT
TESTOUT
QBAT
QBAT
SWITCHING CHARACTERISTICS
Symbol tgkde Parameter E1 Low to DET High (E0 = 1) Test Conditions Temperature Ranges 0C to +70C -40C to +85C Ground-key Detect state RL open, RG connected (See Figure H) 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C Min Typ Max 3.8 4.0 1.1 1.6 1.1 1.6 3.8 4.0 1.2 1.7 3.8 4.0 1.1 1.6 3.8 4.0 Unit Note
E1 Low to DET Low (E0 = 1) tgkdd tgkd0 tshde E0 High to DET Low (E1 = 0) E0 Low to DET High (E1 = 0) E1 High to DET Low (E0 = 1)
s
4
tshdd tshd0
E1 High to DET High (E0 = 1) Switchhook Detect state RL = 600 , RG open E0 High to DET Low (E1 = 1) (See Figure G) E0 Low to DET High (E1 = 1)
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SWITCHING WAVEFORMS
E1 to DET E1
DET
tgkde
tshde
tgkde
tshde
E0 to DET E1
E0
DET
tshdd
tshd0
tgkdd
tgkd0
Note: All delays measured at 1.4 V level.
Notes: 1. Unless otherwise noted, test conditions are BAT = -60 V, VCC = +5 V, VEE = -5 V, RL = 600 , CHP = 0.33 F, RDC1 = RDC2 = 31.25 k, CDC = 0.1 F, Rd = 51.1 k, no fuse resistors, two-wire AC output impedance programming impedance (ZT) = 600 k resistive, receive input summing impedance (ZRX) = 300 k resistive. (See Table 2 for component formulas.) 2. Overload level is defined when THD = 1%. 3. Balance return signal is the signal generated at VTX by VRX. This specification assumes that the two-wire AC load impedance matches the impedance programmed by ZT. 4. Not tested in production. This parameter is guaranteed by characterization or correlation to other tests. 5. These tests are performed with a longitudinal impedance of 90 and metallic impedance of 300 for frequencies below 12 kHz and 135 for frequencies greater than 12 kHz. These tests are extremely sensitive to circuit board layout. Please refer to application notes for details. 6. This parameter is tested at 1 kHz in production. Performance at other frequencies is guaranteed by characterization. 7. When the SLIC is in the Anti-Sat 2 operating region, this parameter is degraded. The exact degradation depends on system design. The Anti-Sat 2 region occurs at high loop resistances when |VBAT| - |VAX -VBX| is less than approximately 15 V. 8. "Midpoint" is defined as the connection point between two 300 series resistors connected between A(TIP) and B(RING). 9. Fundamental and harmonics from 256 kHz switch regulator chopper are not included.
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AM79514 Data Sheet
Table 1. SLIC Decoding
DET Output State 0 1 2 3 4 5 6 7 C3 C2 C1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Two-Wire Status Open Circuit Ringing Active On-hook TX (OHT) Tip Open Reserved OHT Polarity Reversal E1 = 0 Ring trip Ring trip Loop detector Loop detector Loop detector Loop detector Loop detector E1 = 1 Ring trip Ring trip Ground key Ground key -- -- Ground key Ground key
Active Polarity Reversal Loop detector
Table 2. Z T = 1000 ( Z 2WIN - 2R F )
User-Programmable Components
Where ZT is connected between the VTX and RSN pins. The fuse resistors are RF, and Z2WIN is the desired 2-wire AC input impedance. When computing ZT, the internal current amplifier pole and any external stray capacitance between VTX and RSN must be taken into account. Where ZRX is connected from VRX to the RSN pin, ZT is defined above, G42L is the desired receive gain, and ZL is the 2-wire load impedance. Where RDC1, RDC2, and CDC form the network CDC = (1.5 ms)(RDC1 + RDC2)/(RDC1 * RDC2) connected to the RDC pin. RDC1 and RDC2 are approximately equal. Where RD and CD form the network connected from RD to -5 V and IT is the threshold current between on hook and off hook.
ZL 1000 * Z T Z RX = ---------- * ---------------------------------------------------G 42L Z T + 1000 ( Z L + 2R F ) 2500 R DC1 + R DC2 = -----------I FEED 365 R D = -------- , IT 0.5 ms C D = ---------------RD
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DC FEED CHARACTERISTICS
3 4 2
1
1
VBAT = 62.3 V RDC = 62.5 k Notes: 1. Constant-current region: Active state,
Active state OHT state
2500 I L = ----------R DC 1 2500 IL = -- * ----------2 R DC V AB = 46 V, V AB = 1.087 V BAT - 18.017, V BAT 58.9 V V BAT < 58.9 V V BAT 61.5 V V BAT < 61.5 V
OHT state,
2. Anti-sat cut-in:
3. Open Circuit voltage:
V AB = 51.23 V, V AB = 1.073 V BAT - 14.72,
4. Anti-sat 1 region:
R DC V AB = 51.23 - I L -----------488.3 R DC V AB = 1.073 V BAT - 14.72 - I L ----------1071
5. Anti-sat 2 region:
a. VA-VB (VAB) Voltage vs. Loop Current (Typical)
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AM79514 Data Sheet
DC FEED CHARACTERISTICS (continued)
VBAT = 62.3 V RDC = 62.5 k b. Loop Current vs. Load Resistance (Typical)
A
a RL SLIC RSN RDC1 b RDC2 B RDC CDC
IL
Feed current programmed by RDC1 and RDC2 c. Feed Programming
Figure 1. DC Feed Characteristics
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TEST CIRCUITS
A(TIP) RL 2 VL RL 2 VAB SLIC
VTX
A(TIP)
VTX
AGND
RT VAB RRX RL
SLIC AGND RT
RSN B(RING) IL2-4 = 20 log (VTX / VAB) B(RING) RSN
RRX
VRX IL4-2 = 20 log (VAB / VTX) BRS = 20 log (VTX / VAB)
A. Two- to Four-Wire Insertion Loss
B. Four- to Two-Wire Insertion Loss and Balance Return Signal
ZD 1 C << RL S1 C RL 2 VL VL RL 2 VTX A(TIP) SLIC RT VS S2 RSN B(RING) VRX S2 Open, S1 Closed L-T Long. Bal. = 20 log (VAB / VL) L-4 Long. Bal. = 20 log (VTX / VL) S2 Closed, S1 Open 4-L Long. Sig. Gen. = 20 log (VL / VRX) Note: ZD is the desired impedance (e.g., the characteristic impedance of the line). RL = -20 log (2 VM / VS) C. Longitudinal Balance D. Two-Wire Return Loss Test Circuit RRX RRX R ZIN RSN B(RING) R AGND VM SLIC A(TIP) VTX RT
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AM79514 Data Sheet
TEST CIRCUITS (continued)
68 C A(TIP) SLIC SM RL B(RING) 68 1 C C B(RING) << 90 SE Current Feed or Ground Key F. Ground-Key Detection RE RL A(TIP)
56
IDC
E. Single-Frequency Noise
VCC 6.2 k A(TIP)
A(TIP) DET RL = 600 15 pF B(RING) E1 B(RING) RG = 3.9 k
G. Loop-Detector Switching
H. Ground-Key Switching
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PHYSICAL DIMENSION
PL032
.447 .453 .485 .495 .009 .015 .125 .140 .080 .095 SEATING PLANE .400 REF. .013 .021 .026 .032 TOP VIEW .050 REF. .490 .530 .042 .056
.585 .595 .547 .553
Pin 1 I.D.
SIDE VIEW
16-038FPO-5 PL 032 DA79 6-28-94 ae
REVISION SUMMARY Revision A to Revision B
* Minor changes were made to the data sheet style and format to conform to AMD standards.
Revision B to Revision C
* In Pin Description table, inserted/changed TP pin description to: "Thermal pin. Connection for heat dissipation. Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the TP pins can connect to an area of copper on the board to enhance heat dissipation." Minor changes were made to the data sheet style and format to conform to AMD standards.
*
Revision C to Revision D
* * * The physical dimension (PL032) was added to the Physical Dimension section. Deleted the Ceramic DIP and Plastic DIP part (Am79512) and references to them. Updated Pin Description table to correct inconsistencies.
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AM79514 Data Sheet
The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD's Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD's product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice.
(c) 1999 Advanced Micro Devices, Inc. All rights reserved.
Trademarks AMD, the AMD logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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