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HIGH VOLTAGE PHOTODARLINGTON OPTOCOUPLERS DESCRIPTION The H11GX series are photodarlington-type optically coupled optocouplers. These devices have a gallium arsenide infrared emitting diode coupled with a silicon darlington connected phototransistor which has an integral base-emitter resistor to optimize elevated temperature characteristics. H11G1 H11G2 H11G3 FEATURES * High BVCEO - Minimum 100 V for H11G1 - Minimum 80 V for H11G2 - Minimum 55 V for H11G3 * High sensitivity to low input current Minimum 500 percent CTR at IF = 1 mA * Low leakage current at elevated temperature (maximum 100 A at 80C) * Underwriters Laboratory (UL) recognized File# E90700 APPLICATIONS * * * * * CMOS logic interface Telephone ring detector Low input TTL interface Power supply isolation Replace pulse transformer ANODE 1 6 BASE CATHODE 2 5 COLLECTOR N/C 3 4 EMITTER NOTE All dimensions are in inches (millimeters) ABSOLUTE MAXIMUM RATINGS Parameter TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation @ TA = 25C Derate above 25C Input-Output Isolation Voltage EMITTER Forward Input Current Reverse Input Voltage Forward Current - Peak (1s pulse, 300pps) LED Power Dissipation @ TA = 25C Derate above 25C DETECTOR Collector-Emitter Voltage H11G1 H11G2 H11G3 Detector Power Dissipation @ TA = 25C Derate above 25C Symbol TSTG TOPR TSOL PD VISO IF VR IF(pk) PD Value -55 to +150 -55 to +100 260 for 10 sec 260 3.5 5300 60 6.0 3.0 100 1.8 Units C C C mW mW/C Vac(rms) mA V A mW mW/C VCEO PD 100 80 55 200 2.67 V mW mW/C 7/21/00 200045A HIGH VOLTAGE PHOTODARLINGTON OPTOCOUPLERS H11G1, H11G2, H11G3 ELECTRICAL CHARACTERISTICS (TA = 25C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Characteristic EMITTER Forward Voltage Forward Voltage Temp. Coefficient Reverse Breakdown Voltage Junction Capacitance Reverse Leakage Current DETECTOR Breakdown Voltage Collector to Emitter Collector to Base Emitter to Base (VCE = 80 V, IF = 0) Leakage Current Collector to Emitter (VCE = 60 V, IF = 0) (VCE = 30 V, IF = 0) (VCE = 80 V, IF = 0, TA = 80C) (VCE = 60 V, IF = 0, TA = 80C) ICEO (IC = 100 A) (IC = 1.0 mA, IF = 0) BVCEO (IR = 10 A) (VF = 0 V, f = 1 MHz) (VF = 1 V, f = 1 MHz) (VR = 3.0 V) Test Conditions (IF = 10 mA) Symbol VF VF TA BVR CJ IR Device ALL ALL ALL ALL ALL ALL H11G1 H11G2 H11G3 H11G1 BVCBO BVEBO H11G2 H11G3 ALL H11G1 H11G2 H11G3 H11G1 H11G2 100 A 100 nA 100 80 55 100 80 55 7 10 V 3.0 Min Typ** 1.3 -1.8 25 50 65 0.001 10 Max 1.50 Unit V mV/C V pF pF A TRANSFER CHARACTERISTICS DC Characteristic EMITTER Current Transfer Ratio Collector to Emitter (IF = 1 mA, VCE = 5 V) (IF = 16 mA, IC = 50 mA) Saturation Voltage (IF = 1 mA, IC = 1 mA) (IF = 20 mA, IC = 50 mA) (IF = 10 mA, VCE = 1 V) CTR H11G1/2 H11G3 H11G1/2 VCE (SAT) H11G1/2 H11G3 5 (500) 2 (200) 0.85 0.75 0.85 1.0 1.0 1.2 V H11G1/2 100 (1000) mA (%) Test Conditions Symbol Device Min Typ** Max Unit TRANSFER CHARACTERISTICS Characteristic SWITCHING TIMES Turn-on Time Turn-off Time Test Conditions (RL = 100 , IF = 10 mA) 30 Hz) Symbol ton toff Device ALL ALL Min Typ** 5 100 Max Unit s (VCE = 5 V) Pulse Width 300 s, f ** All typical values at TA = 25C 7/21/00 200045A HIGH VOLTAGE PHOTODARLINGTON OPTOCOUPLERS H11G1, H11G2, H11G3 Fig. 1 Output Current vs. Input Current 10 100 Fig. 2 Normalized Output Current vs. Temperature IC - NORMALIZED OUTPUT CURRENT IC - NORMALIZED OUTPUT CURRENT 1 Normalized to: VCE = 5 V IF = 1 mA 10 IF = 50 mA IF = 5 mA IF = 1 mA IF = 0.5 mA Normalized to: VCE = 5 V IF = 1 mA TA = 25C 0.1 1 0.01 0.1 0.001 0.1 1 10 0.01 -60 -40 -20 0 20 40 60 80 100 120 IF - LED INPUT CURRENT(mA) TA - AMBIENT TEMPERATURE (C) Fig. 3 Output Current vs. Collector - Emitter Voltage 100 1000 Normalized to: VCE = 5 V IF = 1 mA TA = 25C Fig. 4 Collector-Emitter Dark Current vs. Ambient Temperature IC - NORMALIZED OUTPUT CURRENT ICEO - DARK CURRENT (nA) IF = 50 mA IF = 10 mA IF = 2 mA 100 VCE = 80V 10 10 VCE = 30V 1 IF = 1 mA IF = 0.5 mA VCE = 10V 1 0.1 0.1 0.01 1 10 0.01 0 10 20 30 40 50 60 70 80 90 100 VCE - COLLECTOR - EMITTER VOLTAGE (V) TA - AMBIENT TEMPERATURE (C) Fig. 5 Input Current vs. Total Switching Speed (Typical Values) 10 IF - FORWARD CURRENT (mA) RL = 10 RL = 100 RL = 1k 1 Normalized to: VCC = 5 V IF = 10 mA RL = 100 0.1 0.1 1 10 ton + toff - TOTAL SWITCHING SPEED (NORMALIZED) 7/21/00 200045A HIGH VOLTAGE PHOTODARLINGTON OPTOCOUPLERS H11G1, H11G2, H11G3 Package Dimensions (Through Hole) 3 2 1 PIN 1 ID. Package Dimensions (Surface Mount) 0.350 (8.89) 0.330 (8.38) 3 0.270 (6.86) 0.240 (6.10) 2 1 PIN 1 ID. 0.270 (6.86) 0.240 (6.10) 4 SEATING PLANE 5 0.350 (8.89) 0.330 (8.38) 6 4 5 6 0.070 (1.78) 0.045 (1.14) 0.070 (1.78) 0.045 (1.14) 0.300 (7.62) TYP 0.200 (5.08) 0.135 (3.43) 0.200 (5.08) 0.165 (4.18) 0.020 (0.51) MIN 0.016 (0.40) 0.008 (0.20) 0.016 (0.41) 0.008 (0.20) 0.020 (0.51) MIN 0.100 (2.54) TYP 0.154 (3.90) 0.100 (2.54) 0.022 (0.56) 0.016 (0.41) 0.300 (7.62) TYP 0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0 to 15 Lead Coplanarity : 0.004 (0.10) MAX Package Dimensions (0.4"Lead Spacing) 3 2 1 PIN 1 ID. Recommended Pad Layout for Surface Mount Leadform 0.270 (6.86) 0.240 (6.10) 0.070 (1.78) 4 5 6 0.060 (1.52) 0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14) 0.415 (10.54) 0.100 (2.54) 0.030 (0.76) SEATING PLANE 0.295 (7.49) 0.004 (0.10) MIN 0.200 (5.08) 0.135 (3.43) 0.154 (3.90) 0.100 (2.54) 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0 to 15 0.400 (10.16) TYP NOTE All dimensions are in inches (millimeters) 7/21/00 200045A HIGH VOLTAGE PHOTODARLINGTON OPTOCOUPLERS H11G1, H11G2, H11G3 ORDERING INFORMATION Option S SD W 300 300W 3S 3SD Order Entry Identifier .S .SD .W .300 .300W .3S .3SD Description Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape & Reel QT Carrier Tape Specifications ("D" Taping Orientation) 12.0 0.1 4.85 0.20 4.0 0.1 0.30 0.05 4.0 0.1 O1.55 0.05 1.75 0.10 7.5 0.1 13.2 0.2 16.0 0.3 9.55 0.20 0.1 MAX 10.30 0.20 O1.6 0.1 User Direction of Feed NOTE All dimensions are in millimeters 7/21/00 200045A MARKING INFORMATION 1 H11G1 V XX YY K 3 4 5 2 6 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) Two digit year code, e.g., `03' Two digit work week ranging from `01' to `53' Assembly package code Reflow Profile (Black Package, No Suffix) 300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 225 C peak 215C, 10-30 s Time above 183C, 60-150 sec Ramp up = 3C/sec 3.5 4 4.5 * Peak reflow temperature: 225C (package surface temperature) * Time of temperature higher than 183C for 60-150 seconds * One time soldering reflow is recommended Time (Minute) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST ActiveArrayTM FASTrTM BottomlessTM FPSTM CoolFETTM FRFETTM CROSSVOLTTM GlobalOptoisolatorTM DOMETM GTOTM EcoSPARKTM HiSeCTM E2CMOSTM I2CTM EnSignaTM i-LoTM FACTTM ImpliedDisconnectTM FACT Quiet SeriesTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC Across the board. Around the world.TM OPTOPLANARTM PACMANTM The Power Franchise POPTM Programmable Active DroopTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench QFET QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic TINYOPTOTM TruTranslationTM UHCTM UltraFET VCXTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I13 |
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