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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6129 Issued Date : 1993.01.15 Revised Date : 2002.03.05 Page No. : 1/4 HE8550S PNP EPITAXIAL PLANAR TRANSISTOR Description The HE8550S is designed for general purpose amplifier applications. Features * High DC Current gain: 100-500 at IC=150mA * Complementary to HE8050S TO-92 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ........................................................................................ -25 V VCEO Collector to Emitter Voltage ..................................................................................... -20 V VEBO Emitter to Base Voltage ............................................................................................. -5 V IC Collector Current ...................................................................................................... -700 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE1 *hFE2 fT Cob Min. -25 -20 -5 100 150 Typ. 100 Max. -1 -0.5 -1 500 10 Unit V V V uA V V Test Conditions IC=-10uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-20V, IE=0 IC=-0.5A, IB=-50mA VCE=-1V, IC=-150mA VCE=-1V, IC=-150mA VCE=-1V, IC=-500mA VCE=-10V, IC=-20mA, f=100MHz VCB=-10V, f=1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF Classification Of hEF Rank hFE1 hFE2 C 100-180 C1 100-180 >100 D 160-300 D1 160-300 >100 E 250-500 - HE8550S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 125 C o Spec. No. : HE6129 Issued Date : 1993.01.15 Revised Date : 2002.03.05 Page No. : 2/4 Saturation Voltage & Collector Current 1000 VCE(sat) @ IC=10IB 25 C o Saturation Voltage (mV) 100 hFE 100 75 C o 125 C 10 25 C o o 75 C o hFE @ VCE=1V 10 1 10 100 1000 1 0.1 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) ON Voltage & Collector Current 10000 VBE(ON) @ VCE=1V 1000 Cutoff Frequency & Collector Current VCE=10V Cutoff Frequency (MHz).. . 100 1000 ON Voltage (mV) 100 75 C 1000 25 C o o 10 125 C o 100 1 10 1 1 10 100 1000 Collector Current-IC (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 100 10000 PT=1ms Safe Operating Area Collector Current-IC (mA) 1000 PT=100ms Capacitance (pF) PT=1s 100 Cob 10 10 1 0.1 1 10 100 1 1 10 100 Reverse-Biased Voltage (V) Forward Voltage (V) HE8550S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6129 Issued Date : 1993.01.15 Revised Date : 2002.03.05 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD (mW) 500 400 300 200 100 0 0 50 100 o 150 200 Ambient Temperature-Ta ( C) HE8550S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6129 Issued Date : 1993.01.15 Revised Date : 2002.03.05 Page No. : 4/4 2 Marking: H SA 1538S Rank Control Code 3 C Style: Pin 1.Emitter 2.Collector 3.Base D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HE8550S HSMC Product Specification |
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