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| INTEGRATED CIRCUITS DATA SHEET PCB8517 Stand-alone OSD for monitor applications Objective specification File under Integrated Circuits, IC02 1997 Mar 03 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications FEATURES Interface with microcontroller * 3-wire high speed (maximum 2.5 Mbits/s) serial interface with three types of transmission sequence. On-Screen Display (OSD) * On-chip PLL oscillator to generate the OSD dot clock frequency which is 384 x horizontal sync frequency * Horizontal sync frequency range of 10 to 100 kHz * 10 rows of 24 characters display buffer * 128 character fonts * 12 x 16 character matrix * Programmable height of displayed character (from 16 to 63 scan-lines); frame basis * 4 types of character size; single/double character height/width; row basis * Horizontal starting position: 32 different positions (6 dots for each step) * Vertical starting position: 64 different positions (4 scan-lines for each step) * 8 foreground character colours: selection of only 2 out of the 8 (outside the window) and 4 out of the of 8 (in the window) in the same row * 3 character shadowing modes: - No shadow - Shadowing - Bordering shadow * 3 fully programmable background windows with overlapping capability and presetting priorities (for multi-level application). The window colour can be selected from 1 out of 8 * Half tone in background window supported * Single 5 V power supply * Available in DIP16 package. ORDERING INFORMATION TYPE NUMBER PCB8517P PACKAGE NAME DIP16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil) GENERAL DESCRIPTION PCB8517 The PCB8517 is a stand-alone OSD which is used to display the adjustment/status information on the screen of an auto-sync monitor for menu driving application. The display operation of the device is controlled by a microcontroller which programs the internal 273 bytes of RAM via a 3-wire high-speed serial interface. The on-chip PLL oscillator and programmable character height are used to keep the same character size displayed on the screen in different display modes, VGA, SVGA and XGA for example. The OSD of the PCB8517 provides display buffers of 10 rows with 24 characters each. These display buffers can select from 128 customized character fonts (with 12 x 16 bit resolution) to be displayed. The characters displayed on the screen can be specified double height, double width, different colour and with/without shadowing. Three positional background windows are provided for multi-level application. VERSION SOT38-4 1997 Mar 03 2 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications BLOCK DIAGRAM PCB8517 handbook, full pagewidth VDDA 4 VSSA 1 VCLK VDDD 9 VSSD 16 VCO BIAS HFLB 2 3 5 + - PLL OSCILLATOR 15 14 COLOUR ENCODER 4 13 12 RED GREEN BLUE FB VFLB 10 DISPLAY CONTROL 12-STAGE SHIFT REGISTER OSDEN DISPLAY BUFFER 24 x 10 RAM 6 7 8 HIGH SPEED SERIAL I/O INTERFACE 3 CHARACTER FONTS 128 FONT ROM WINDOW AND FRAME CONTROL 11 HTONE EN SDI SCK CONTROL REGISTERS MGD762 Fig.1 Block diagram. 1997 Mar 03 3 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications PINNING SYMBOL VSSA VCO BIAS VDDA HFLB EN SDI SCK VDDD VFLB HTONE PIN 1 2 3 4 5 6 7 8 9 10 11 analog ground DESCRIPTION PCB8517 DC control voltage input/output to regulate the internal PLL oscillator frequency; a low-pass filter circuit is connected to this pin bias input/output to regulate the bias current of internal current control oscillator to resonate at a specific dot frequency analog power supply horizontal sync input signal from flyback circuit with negative polarity active LOW input to enable serial interface data input of serial interface clock input of serial interface digital power supply vertical sync input signal from flyback circuit with negative polarity half tone control which outputs a logic 1 during windowing except characters are displayed; it is used to lower the external RED, GREEN and BLUE amplifier gain to achieve a transparent windowing effect fast blanking output of OSD; active HIGH and high impedance when OSD is disabled blue colour output of OSD; active HIGH and high impedance when OSD is disabled green colour output of OSD; active HIGH and high impedance when OSD is disabled red colour output of OSD; active HIGH and high impedance when OSD is disabled digital ground FB BLUE GREEN RED VSSD 12 13 14 15 16 handbook, halfpage VSSA 1 VCO 2 BIAS 3 VDDA 4 HFLB 5 EN 6 SDI 7 SCK 8 MGD760 16 VSSD 15 RED 14 GREEN 13 BLUE PCB8517 12 FB 11 HTONE 10 VFLB 9 VDDD Fig.2 Pin configuration. 1997 Mar 03 4 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications FUNCTIONAL DESCRIPTION 3-wire high speed serial interface (HSSI) The 3-wire (EN, SDI and SCK) high speed serial interface of the PCB8517 is write only and is used to write data from the microcontroller to the internal 273 bytes of RAM (see Section "Internal RAM organization (see Fig.4)") to control the OSD. The RAM is organized into 11 rows of 32 columns (see Fig.4) and can be programmed by three types of sequence (see Section "Data sequence and format"). DATA PROTOCOL Figure 3 shows the protocol of HSSI. To initiate HSSI transmission, pin EN must be LOW to enable the PCB8517 to accept data. The EN input must be pulled LOW prior to the occurrence of SCK and remain LOW until after the last SCK clock pulse. The rising edge of SCK facilitates the input data of SDI being shifted into an 8-bit shift register. When the shift register is full this data will be loaded into a row address register, column address register or into one of the internal RAM bytes. PCB8517 Table 1 shows the switching characteristics when the HFLB pin has a pulse presented, but when there is no horizontal sync pulse present on the HFLB pin, the transmission bit rate will be slowed down to 500 kbit/s. Table 1 Switching characteristics (under operating conditions) PARAMETER EN to SCK hold time SCK LOW time SCK HIGH time SDI data set-up time SDI data hold time MIN. MAX. UNIT - - - - - - ns ns ns ns ns ns 100 200 200 200 100 SYMBOL tsu(EN) th(EN) tSCKL tSCKH tsu(SDI) th(SDI) EN to SCK set-up time 200 handbook, full pagewidth EN tSCKL tSCKH tsu(EN) th(EN) SCK tsu(SDI) th(SDI) SDI B7 MSB first byte B0 LSB last byte MGD764 B7 B7 B0 B7 B0 Fig.3 3-wire serial interface protocol. 1997 Mar 03 5 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications DATA SEQUENCE AND FORMAT The PCB8517 provides the following 3 types of transmission sequence: * Sequence A: R CA D R CA D etc. * Sequence B: R CA D CA D CA D etc. * Sequence C: R CB D D D D etc. Where: R = row address, CA = column address A, CB = column address B, D = data of RAM. The column address will be increased by 1 automatically after each bit of data has been stored into the RAM. In sequence C, if the column address of the last data is 1FH, the row address will also be increased by 1. The sequence A is particularly suitable for updating small amounts of data between different rows. However, if the current information byte has the same row address as the previous one, sequence B is recommended. For a greater information update, such as a power-up situation, sequence C should be used. Table 2 Data format DATA BYTE(1) ADDRESS B7 Row address Column address A Column address B Note 1. X = don't care. Internal RAM organization (see Fig.4) 1 0 0 B6 X 0 1 B5 X X X B4 X C4 C4 B3 R3 C3 C3 B2 R2 C2 C2 PCB8517 Bit B7 in Table 2 is used to distinguish between row or column address and bit B6 is used to distinguish between column address A or B. When A or B sequence is transmitted, the column address should be formatted as column address A, and the data format of column address B is used for sequence C. There are some limitations on using mixed formats during a single transmission, for example when pin EN has been pulled to LOW once. Allowed: * From A to B or C * From B to A. Not allowed: * From C to A or B. B1 R1 C1 C1 B0 R0 C0 C0 The internal RAM is addressed with rows 0 to 10 and columns 0 to 31. The OSD character display buffers are located in columns 0 to 23 of rows 0 to 9. Each display buffer contains a character ROM address and the colour control bit corresponding to a display location on the monitor screen. Each row data is associated with two control registers which are located at columns 30 and 31 of their respective row. Also three window control registers for three windows together with three frame control register occupy the first 13 columns of row 10. 1997 Mar 03 6 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications PCB8517 handbook, full pagewidth COLUMN 23 24 29 30 31 0 0 ROW CHARACTER DISPLAY BUFFERS RESERVED ROW CONTROL 9 10 WINDOW 1 CONTROL 0 2 WINDOW 2 CONTROL 3 5 WINDOW 3 CONTROL 6 8 FRAME CONTROL 9 12 13 RESERVED 31 MGD763 Fig.4 Internal RAM map. DISPLAY BUFFERS Table 3 Display buffers; see Table 4 DATA BYTE BIT 7 CCS0 Table 4 BIT 7 BIT 6 CA6 BIT 5 CA5 BIT 4 CA4 BIT 3 CA3 BIT 2 CA2 BIT 1 CA1 BIT 0 CA0 Explanation of Table 3 NAME CCS0 DESCRIPTION This bit defines the characters colour. When the character has no window background with it, colour 0 is selected if CCS0 = 0, otherwise colour 1 is selected. When the character is inside a window and the CCS1 bit of the corresponding windows control register is 0, the colour selection is the same as no window background, and if CCS1 = 1, colour 2 is selected when CCS0 = 0, otherwise colour 3 is selected. These 7 bits define 1 of 128 character symbols to be displayed in this position. 6 to 0 CA6 to CA0 1997 Mar 03 7 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications ROW CONTROL REGISTERS Table 5 Column 30 DATA BYTE BIT 7 R0 Table 6 BIT 7 to 5 4 to 2 1 0 Note BIT 6 G0 Explanation of Table 5 NAME R0, G0, B0 R1, G1, B1 CHS CWS colour definition of colour 0 colour definition of colour 1 DESCRIPTION BIT 5 B0 BIT 4 R1 BIT 3 G1 BIT 2 B1 BIT 1 CHS PCB8517 BIT 0 CWS This bit defines the height of the display character; when CHS = 1 double height is selected. This bit defines the width of the display character; when CWS = 1 double width(1) is selected. 1. When the display row is selected to be double width, only even column characters will be displayed on the screen and the odd column characters will not appear. Table 7 Column 31 DATA BYTE BIT 7 R2 Table 8 BIT 7 to 5 4 to 2 BIT 6 G2 Explanation of Table 7 NAME R2, G2, B2 R3, G3, B3 colour definition of colour 2 colour definition of colour 3 DESCRIPTION BIT 5 B2 BIT 4 R3 BIT 3 G3 BIT 2 B3 BIT 1 reserved BIT 0 WINDOW CONTROL REGISTERS There are three control registers for each window. Window 1 occupies columns 0 to 2 of row 10, columns 3 to 5 of row 10 are occupied by window 2 and columns 6 to 8 of row 10 are occupied by window 3. If window overlapping occurs, the highest priority window will cover the lowest. Window 1 has the highest priority and window 3 the lowest. Table 9 Columns 0, 3 and 6 of row 10 DATA BYTE BIT 7 MSB BIT 6 BIT 5 BIT 4 LSB BIT 3 MSB BIT 2 BIT 1 BIT 0 LSB row start address row end address 1997 Mar 03 8 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications Table 10 Explanation of Table 9 BIT 7 to 4 3 to 0 NAME - - DESCRIPTION These bits specify which row is the start of window. These bits specify which row is the end of window. PCB8517 Table 11 Columns 1, 4 and 7 of row 10 DATA BYTE BIT 7 MSB BIT 6 BIT 5 column start address BIT 4 BIT 3 LSB BIT 2 WEN BIT 1 CCS1 BIT 0 reserved Table 12 Explanation of Table 11 BIT 7 to 3 2 1 NAME - WEN CCS1 DESCRIPTION These bits specify which column is the start of the window. When this bit is set to logic 1 the corresponding window background is enabled. When this bit is set to logic 1, the characters resided within this particular window can have two extra colour selections (i.e. colour 2 and colour 3); see Section "Display buffers". Table 13 Columns 2, 5 and 8 of row 10 DATA BYTE BIT 7 MSB BIT 6 BIT 5 column end address BIT 4 BIT 3 LSB BIT 2 WR BIT 1 WG BIT 0 WB Table 14 Explanation of Table 13 BIT 7 to 3 2 to 0 NAME - DESCRIPTION These bits specify which column is the end of the window. WR, WG, WB These bits define the colour of the window. FRAME CONTROL REGISTERS Table 15 Column 9 of row 10 DATA BYTE BIT 7 reserved BIT 6 BIT 5 MSB BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 LSB vertical start position 1997 Mar 03 9 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications Table 16 Explanation of Table 15 BIT 5 to 0 NAME - DESCRIPTION PCB8517 These bits specify the vertical starting position of OSD. The counting starts from the falling edge of the VFLB signal (e.g. enter vertical flyback period) and each increment represents four scan line movement to the bottom. 64 positions are provided. The default value is 4 after power-up. The time from the falling edge of the VFLB signal to starting display is: tv = (vertical start position) x 4 x th-sync + th-sync. Where th-sync = one horizontal line display time. Table 17 Column 10 of row 10 DATA BYTE BIT 7 BIT 6 reserved Table 18 Explanation of Table 17 BIT 4 to 0 NAME - DESCRIPTION These bits specify the horizontal starting position of OSD. The counting starts from the falling edge of the HFLB signal (e.g. enter horizontal flyback period) and each increment represents six dots movement to the right. 32 positions are provided. The default value is 15 after power-up. The time from the falling edge of the HFLB signal to starting display is: th = (horizontal start position) x 6 x tdot + 61 x tdot. Where tdot = one pixel display time (e.g. one horizontal line display time/384). A horizontal display line consists of 384 dots, which include 288 dots (e.g. 12 dots x 24 characters) for display character, and 96 dots for the blank region. Table 19 Column 11 of row 10 DATA BYTE BIT 7 reserved Table 20 Explanation of Table 19 BIT 5 to 0 NAME CH5 to CH0 DESCRIPTION These bits specify the height of displayed characters. Table 21 shows the lines to be repeated. The height of character can be specified from 16 to 63 scan lines. For example, when CH5 to CH0 = 00 0010, the height of character will be 18 scan lines, the 4th and 12th line will be double scanned but others will be scanned once. BIT 6 BIT 5 CH5 BIT 4 CH4 BIT 3 CH3 BIT 2 CH2 BIT 1 CH1 BIT 0 CH0 BIT 5 BIT 4 MSB BIT 3 BIT 2 horizontal start position BIT 1 BIT 0 LSB 1997 Mar 03 10 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications Table 21 The repeat line of character LINE NUMBER(1) CH5 to CH0 0 CH0 = 1 CH1 = 1 CH2 = 1 CH4 = 1 CH5 and CH4 = 0X CH5 and CH4 = 10 CH5 and CH4 = 11 Note 1. V indicates which line of the character will be repeated one more time. Table 22 Column 12 of row 10 DATA BYTE BIT 7 OSDEN BIT 6 BSEN BIT 5 SHSE BIT 4 BIT 3 reserved BIT 2 BIT 1 - - - - 1 - - - V 2 - - V - 3 - - - V 4 - V - - 5 - - - V 6 - - V - 7 - - - V 8 V - - - 9 - - - V 10 - - V - 11 - - - V 12 - V - - PCB8517 13 - - - V 14 - - V - 15 - - - V all sixteen lines scanned once all sixteen lines scanned twice all sixteen lines scanned three times BIT 0 FBC Table 23 Explanation of Table 22 BIT 7 6 5 0 NAME OSDEN BSEN SHSE FBC DESCRIPTION The OSD circuit is active when this bit is set to logic 1. The outputs of R, G, B and FB will be high impedance when OSD is disabled. The bordering or shadowing effect is enabled when this bit is set to logic 1. The shadowing of characters is selected if this bit is set to logic 1, otherwise bordering of characters is chosen. This bit defines the output configuration of the FB pin. If this bit is set to logic 0, then the output of FB will be logic HIGH when displaying character or window, otherwise the output of FB is logic HIGH only when displaying characters. 1997 Mar 03 11 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications Character ROM The character ROM contains 128 character fonts. Each font consists of a 12 x 16 dot matrix. Bordering and shadowing of characters The characters displayed on the screen can be specified with or without shadowing or with border shadowing by setting the BSEN and SHSE bits of frame control register "Column 11 of row 10". If shadowing is specified, there is black shadow on the right and bottom sides of character, and if border shadowing is specified, the black shadowing will surround both internal and external sides of characters (see Fig.5). The characters shadow will not appear if it is outside the display area of character (i.e. 12 x 16 dots). Combination of two or more character fonts to formulate a new symbol User can combine two (or more) character fonts to formulate a new higher resolution symbol in a horizontal direction, but the combination of two fonts in a vertical direction could cause the shadowing or bordering shadow of upper font to be missed if shadowing or bordering is applied. PLL clock generator PCB8517 By tracing the signal on the HFLB pin, the on-chip PLL circuit generates the clock (VCLK) which is used for both system clock and dot clock of the OSD. The frequency of VCLK signal is determined by following equation: fVCLK = fHFLB x 384 (i.e. the frequency range of VCLK signal is from 3.84 to 38.4 MHz). When there is no horizontal sync pulse present on the HFLB pin, the PLL circuit will generate a 2.5 MHz (approximate) clock for the system clock, and the RED, GREEN, BLUE and FB pins will be high impedance. handbook, full pagewidth 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 no shadow 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 shadowing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 bordering shadow MGD759 Fig.5 Character shadowing and bordering. 1997 Mar 03 12 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications PCB8517P/001 character fonts PCB8517 ndbook, full pagewidth MGD755 Fig.6 Character fonts 00H to 1FH. 1997 Mar 03 13 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications PCB8517 ndbook, full pagewidth MGD756 Fig.7 Character fonts 20H to 3FH. 1997 Mar 03 14 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications PCB8517 ndbook, full pagewidth MGD757 Fig.8 Character fonts 40H to 5FH. 1997 Mar 03 15 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications PCB8517 ndbook, full pagewidth MGD758 Fig.9 Character fonts 60H to 7FH. 1997 Mar 03 16 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications LIMITING VALUES In accordance with the absolute Maximum Rating System (IEC 134). SYMBOL VDDX Vi Tstg Tamb digital supply voltage input voltage (all inputs) storage temperature operating ambient temperature PARAMETER MIN. -0.3 -0.3 -55 0 PCB8517 MAX. +7.0 +125 70 UNIT V C C VDDX + 0.3 V DC CHARACTERISTICS SYMBOL Supply VDDX IDDX Inputs VIH VIL Outputs IOH(source) IOL(sink) HIGH level output current (source) LOW level output current (sink) VO VDDX - 0.8 VO 0.5 5.0 5.0 - - - - mA mA HIGH level input voltage LOW level input voltage 2.0 - VDDX + 0.3 V 0.8 V VSSX - 0.3 - digital supply voltage digital supply current VI = VDDX; no load on outputs 4.75 - 5.0 - 5.25 25 V mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 1997 Mar 03 17 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications APPLICATION INFORMATION PCB8517 handbook, full pagewidth R, G and B video signals from PC or work station horizontal sync from deflection circuit vertical sync from deflection circuit HFLB RED 5 15 VFLB 10 14 GREEN 13 BLUE MIXER R, G and B outputs to video circuit 12 FB 11 HTONE (1) MGD761 PCF8517 1 M EN VCO(2) 6 2 5.6 k BIAS(2) 10 k 5.6 k 0.01 F 0.01 F MICROCONTROLLER SDI 7 3 SCK 8 The analog power and ground pins should be separated from other circuits. (1) Only connected when half tone is applied. (2) The recommended circuit or value of components connected to VCO and BIAS could be changed in a different printed-circuit board layout. Fig.10 Application circuit. 1997 Mar 03 18 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil) PCB8517 SOT38-4 D seating plane ME A2 A L A1 c Z e b1 b 16 9 b2 MH wM (e 1) pin 1 index E 1 8 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.030 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 1997 Mar 03 19 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values PCB8517 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Mar 03 20 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications NOTES PCB8517 1997 Mar 03 21 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications NOTES PCB8517 1997 Mar 03 22 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications NOTES PCB8517 1997 Mar 03 23 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997 Internet: http://www.semiconductors.philips.com SCA53 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547047/1200/01/pp24 Date of release: 1997 Mar 03 Document order number: 9397 750 01017 |
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