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| STM1645-30 RF POWER MODULE SATELLITE COMMUNICATIONS APPLICATIONS .CLASSCSATELLI .1625.28 .I .P .GAI PRELIMINARY DAT A TE COMMUNICATIONS AMPLIFIER 1665 MHz VOLTS NPUT/OUTPUT 50 OHMS OUT = 30 W MIN. N = 35 dB MIN. ORDER CODE STM1645-30 BRANDING STM1645-30 PIN CONNECTION DESCRIPTION The STM1645-30 hybrid RF power module is designed for high power satellite communications application in t he 1.6 GHz frequency range. High f T , gold metallized silicon microwave power devices, optimized for use in STM164530, are employed to provide high gain and efficiency while ensuring excellent reliability. 1. RF Input 5. VC3 28V 2. Ground 6. Ground 3. VC1 12V 4. VC2 28V 7. RF Output ABSOLUTE MAXIMUM RATINGS (T case = 25 C) Symbol V P IN T S TG TC Parameter DC Supply Voltage RF Input Power (P OUT 30 W) Storage Temperature Operating Case Temperature Value 30 20 - 40 to +100 - 35 to +70 Unit Vdc mW C C February 13, 1995 1/5 STM1645-30 ELECTRICAL SPECIFICATIONS (T case = 25 C, VC1 = 12 V, VC2 , VC3 = 28 V) Symb ol Parameter Test Con dition s Value Min. Typ. Max. Unit BW P OUT GP Z IN H -- -- -- -- -- *Note: Frequency Range Power Output Power Gain Efficiency Input Impedance Harmonics POUT vs T CASE Load Mismatch POUT Control Range Stability P OUT adj usted by varyi ng V C3 1625 PIN = 10 mW POUT = 30 W POUT = 30 W POUT = 30 W ZG, ZL = 50 POUT = 30 W reference TC = - 35C to +70C VSWR = 10:1 POUT = 30 W POUT = 30 W POUT = 5 to 30 W* TC = -35C to +70C Load VSWR = 3:1, any phase V = 28Vdc 30 35 40 -- -- -- -- -- 35 35.5 -- 1.5:1 -45 -- -- 1665 40 -- -- 2:1 -40 2 1 MHz W dB % VSWR dB dB dB POUT vs Frequency f = 1625 - 1665 MHz No Degradation in Output Power 8 10 -- dB All Spurious outputs more than 60dB below carrier February 13, 1995 2/5 STM1645-30 TYPICAL PERFORMANCE POWER OUTPUT vs FREQUENCY & POWER INPUT POWER GAIN vs FREQUENCY & POWER INPUT VCO NTROL vs COLLECTOR EFFICIENCY VCONTROL vs POWER OUTPUT & IC3 (TYPICAL) February 13, 1995 3/5 STM1645-30 APPLICATIONS RECOMMENDATIONS OPERATION LIMITS The STM1645-30 power module should never be operated under any condition which exceeds the Absolute Maximum Ratings presented on this data sheet. Nor should the module be operated continuously at any of the specified maximum ratings. If the module is to be subjected to one or more of the maximum rating conditions, care must be taken to monitor other parameters which may be affected. DECOUPLING Failure to properly decouple any of the voltage supply pins will result in oscillations at certain operating frequencies. Therefore, it is recommended that these pins be bypassed as indicated in the Module DC and Test Fixture Configuration drawing of this data sheet. MODULE MOUNTING To insure adequate thermal transfer from the module to the heatsink, it is recommended that a satisfactory thermal compound such as Dow Corning 340, Wakefield 120-2 or equivalent be applied between the module flange and the heatsink. The heatsink mounting surface under the module should be flat to within 0.05mm ( 0.002 inch). The module should be mounted to the heatsink using 3.5 mm (or 6-32) or equivalent screws torqued to 5-6 kg-cm (4-6 in-lb). The module leads should be attached to equipment PC board using 180C solder applied to the leads with a properly grounded soldering iron tip, not to exceed 195C, applied a minimum of 2 mm (0.080 inch) from the body of the module for a duration not to exceed 15 seconds per lead. It is imperative that no other portion of the module, other than the leads, be subjected to temperatures in excess of 100C (maximum storage temperature), for any period of time, as the plastic moulded cover, internal components and sealing adhesives may be adversely affected by such conditions. Due to the construction techniques and materials used within the module, reflow soldering of the flange heatsink or leads, is not recommended. February 13, 1995 4/5 STM1645-30 PACKAGE MECHANICAL DATA Ref.: UDCS No. 1016819 rev. A Information furnished is believed to be accurate and reli able. However, SGS-THOMSON Microelectr onics assumes no responsibili ty for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result fr om its use. No license is granted by implication or otherwise under any patent or patent rights of S GS-T HOMSON Microelectronics. Specifications mentioned in this publication are subject to change wi thout notice. This publi cati on super sedes and replaces all information previously supplied. SGS-T HOMSON Microelectronics products are not authorized for use as criti cal components in life support devices or systems without express written approval of SGS-THOMSON Mi croelectr onics. (c)1995 SGS-TH OMSON Mi croelectronics - A ll Ri ghts Reserved SGS -T HOMSON Microelectronics GROUP OF COMPANIES Australia - Br azil - Fr ance - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Tai wan - Thailand - United Kingdom - U.S .A. RF Products Group 141 Commerce D riv e Montogomeryvil le, PA 18936 tel 215-361-6400 fax 215-362-1293 February 13, 1995 5/5 |
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