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E2E0034-38-95
Semiconductor MSM64162D
Semiconductor
This version: Sep. 1998 MSM64162D Previous version: Mar. 1996
4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver
GENERAL DESCRIPTION
The MSM64162D is a low power 4-bit microcontroller that employs Oki's original CPU core nX4/20. The MSM64162D has 1-channel RC oscillation type A/D converter, LCD driver for up to 80 segments, and buzzer output port. It is best suited for applications such as low power thermometers and clinical thermometers.
FEATURES
* Operating range Operating frequencies Operating voltage : : 32.768 kHz 1.25 to 1.7 V (1.5 V spec.) 2.0 to 3.5 V (3 V spec.) 2.2 to 3.5 V (3 V spec., 1/2 duty) -40 to +85C 2016 bytes 128 nibbles 91.6 ms @ 32.768 kHz 1 channel (2 sensors can be connected) 24 outputs; duty ratio switchable by software 80 segments (max) 63 segments (max) 44 segments (max) 1 output (4 output modes selectable) 2 channels 32.768 kHz crystal oscillator 32.768 kHz 32.768 kHz 1.5 V/3 V (selectable by mask option) 2 ports 4 bits 1 port 4 bits 1 port 4 bits (8 out of the 24 LCD driver outputs can be used as output-only ports by mask option.) 2 sources 7 sources 1 (incorporated into the input-only port)
Operating temperature * Memory space Internal program memory Internal data memory * Minimum instruction execution time * RC oscillation type A/D converter * LCD driver (1) At 1/4 duty and 1/3 bias (2) At 1/3 duty and 1/3 bias (3) At 1/2 duty and 1/2 bias * Buzzer driver * Capture circuit * Watchdog timer * Clock CPU clock Time base clock * Power supply voltage * I/O port Input-output port Input port Output port
: : : : : : : : : : : : : : : : : :
* Interrupt sources External interrupt Internal interrupt * Battery check circuit
: : :
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Semiconductor
MSM64162D
* Package options: 64-pin plastic QFP (QFP64-P-1420-1.00-BK) : (Product name : MSM64162D-GS-BK) 80-pin plastic QFP (QFP80-P-1420-0.80-BK) : (Product name : MSM64162D-GS-BK-F) Chip : (Product name : MSM64162D-) indicates a code number.
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Semiconductor
MSM64162D
BLOCK DIAGRAM
CPU CORE: nX-4/20
BSR TR2 TR0 (4) HALT C ALU PCM PCL
TR1 PCH A11 to A8 A7 to A0 ROM 2016B
MIEF
B
A
(4)
(4)
H
L
X DB7 to DB0
Y (8) RAM 128N
IR DECODER
XT XT
CLKG
TBC
IR
TIMING CONTROLLER
SP
ROMR (8)
INTC INT P3.3 P3.2 P3.1 P3.0 P2.3 P2.2 P2.1 P2.0
RESET
RSTG WDT
PORT3
TST1 TST2 VSSL L0 L1
INT TST 5 INT BC VR INT PORT2
LCD CAPR L23 VSS1 VSS2 VSS3 C1 C2 VDD BD ADC INT BIAS PORT0 PORT1
P1.3 P1.2 P1.1 P1.0 P0.3 P0.2 P0.1 P0.0
PORT ADDRESS DB7 to DB0 INT
BD
CRT0
RS0
RT0
CS0
IN0
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Semiconductor
MSM64162D
PIN CONFIGURATION (TOP VIEW)
62 VSS3 61 VSSL
60 VSS2 59 VSS1 58 P1.3
57 P1.2
56 P1.1
55 P1.0
53 P3.3
52 P3.2
54 BD
64 C2
63 C1
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16/P5.0 L17/P5.1 L18/P5.2
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P3.1 P3.0 P2.3 P2.2 P2.1 P2.0 (NC) (NC) (NC) (NC) IN0 CS0 RS0 CRT0 RT0 P0.3 P0.2 P0.1 P0.0
20
21
22
23
24
25
26
27
28
29
30
31
Note: Pins marked as (NC) are no-connection pins which are left open.
L19/P5.3 L20/P6.0 L21/P6.1 L22/P6.2 L23/P6.3 (NC) (NC) VDD XT XT RESET TST1 TST2
64-Pin Plastic QFP
32
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Semiconductor
MSM64162D
PIN CONFIGURATION (TOP VIEW) (continued)
69 L23/P6.3 68 L22/P6.2 66 L21/P6.1 65 L20/P6.0
80 TST1
79 RESET
78 (NC)
75 (NC)
73 (NC)
72 (NC)
71 (NC)
70 (NC)
TST2 P0.0 P0.1 P0.2 P0.3 RT0 (NC) CRT0 RS0 CS0 IN0 (NC) (NC) (NC) (NC) (NC) P2.0 P2.1 P2.2 P2.3 P3.0 (NC) P3.1 (NC)
67 (NC)
74 VDD
77 XT
76 XT
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
64 L19/P5.3 63 L18/P5.2 62 L17/P5.1 61 L16/P5.0 60 L15 59 (NC) 58 L14 57 L13 56 L12 55 L11 54 L10 53 (NC) 52 L9 51 L8 50 L7 49 L6 48 L5 47 L4 46 L3 45 L2 44 L1 43 L0 42 C2 41 C1
P3.2 25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
Notes: 1. Pins marked as (NC) are no-connection pins which are left open. 2. VDD should be supplied from pin 74. Pin 32 is internally connected to VDD.
P3.3 BD (NC) P1.0 (NC) P1.1 (VDD) (NC) P1.2 P1.3 VSS1 VSS2 (NC) VSSL VSS3
80-Pin Plastic QFP
40
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Semiconductor
MSM64162D
PAD CONFIGURATION
Pad Layout
44 43 42 41 40 45 46 47 48 49 50 51 52 53 54 55 56 57 58
(NC) (NC) (NC) (NC)
39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 (NC) (NC) 24 23 22 21 20 19 y x
1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 17 18
Chip Size Chip Thickness Coordinate Origin Pad Hole Size Pad Size Minimum Pad Pitch
: : : : : :
4.69 mm 4.41 mm 350 mm (typ.) Chip center 110 mm 110 mm 130 mm 130 mm 180 mm
Note: The chip substrate voltage is VDD.
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Semiconductor Pad Coordinates
Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 Pad Name L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16/P5.0 L17/P5.1 L18/P5.2 L19/P5.3 L20/P6.0 L21/P6.1 L22/P6.2 L23/P6.3 VDD XT XT RESET TST1 X (m) -2168 -1918 -1669 -1426 -1170 -934 -727 -519 -312 -104 104 311 527 791 1062 1340 1618 1897 2168 2168 2168 2168 2168 2168 2168 2168 2168 2168 2168 Y (m) -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -2042 -1714 -1424 -1134 -844 -554 316 606 896 1186 1476 Pad No. 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 Pad Name TST2 P0.0 P0.1 P0.2 P0.3 RT0 CRT0 RS0 CS0 IN0 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 BD P1.0 P1.1 P1.2 P1.3 VSS1 VSS2 VSSL VSS3 C1 C2
MSM64162D
X (m) 2168 2168 1899 1628 1364 1100 829 565 349 141 -911 -1160 -1416 -1666 -1916 -2168 -2168 -2168 -2168 -2168 -2168 -2168 -2168 -2168 -2168 -2168 -2168 -2168 -2168
Y (m) 1766 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 1829 1563 1382 1017 688 328 6 -353 -645 -826 -1254 -1435 -1616 -1796
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Semiconductor
MSM64162D
PIN DESCRIPTIONS
Basic Functions
Function Symbol VDD VSS1 Power Supply VSS2 VSS3 VSSL C1, C2 Oscillation XT XT P1.0 to P1.3 P0.0 to P0.3 P2.0 to P3.3 Ports BD L0 to L15 L16/P5.0 to L23/P6.3 RT0 A/D Converter CRT0 RS0 CS0 IN0 Reset Test RESET TST1 TST2 Type -- -- -- -- -- -- I O O I I/O O O O O O O O I I I I 0 V power supply Bias output for driving LCD (-1.5 V), or negative power supply at 1.5 V spec. Bias output for driving LCD (-3.0 V), or negative power supply at 3.0 V spec. Bias output for driving LCD (-4.5 V). Negative power supply pin for internal logic (internally generated constant voltage) Pins for connecting a capacitor for generating VSS1, VSS2, and VSS3. 32.768 kHz crystal connection pins Output port (P1.0 : high current output) Input port Input-output ports Output pin for the buzzer driver LCD driver pins LCD driver pins, or output ports by mask option Resistance temperature sensor connection pin Resistance/capacitance temperature sensor connection pin Reference resistor connection pin Reference capacitor connection pin Input pin for RC oscillator circuit Reset pin Input pins for testing Description
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Semiconductor Secondary Functions
Function RC Oscillation Monitor Battery Check Symbol P3.3 P0.3 P3.0 P3.1 P3.2 P3.3 P2.0 External Interrupt P2.1 P2.2 P2.3 P0.0 P0.1 P0.2 P0.3 Capture P0.0 P0.1 Type O I I I I I I I I I I I I I I I Capture circuit trigger input pins. Description
MSM64162D
Monitor output pin (MON) for an RC oscillation clock. Analog comparator input pin for battery check. Level-triggered external 0 interrupt input pins. The change of input signal level causes an interrupt to occur.
Level-triggered external 1 interrupt input pins. The change of input signal level causes an interrupt to occur.
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Semiconductor
MSM64162D
MEMORY MAPS
Program Memory
Test program area
,,,,,,,,,,,,, ,,,,,,,,,,,,, ,,,,,,,,,,,,, 07E0H,,,,,,,,,,,,, ,,,,,,,,,,,,,
07FFH
32 bytes
Contents of interrupt area 03BH 2016 bytes 038H 032H 02FH 02CH 029H 03EH Interrupt area 020H CZP area 010H 30 bytes 026H 023H 020H Watchdog interrupt External interrupt (0) External interrupt (1) ADC interrupt 256 Hz interrupt 32 Hz interrupt 16 Hz interrupt 1 Hz interrupt 4 Hz interrupt
Start address 000H 8 bits
Program Memory Map Address 000H is the instruction execution start address by the system reset. The CZP area from address 010H to address 01FH is the start address for the CZP subroutine of 1-byte call instruction. The start address of interrupt subroutine is assigned to the interrupt address from address 020H to 03DH. The user area has 2016 bytes of address 000H to address 07DFH. No program can be stored in the test program area.
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Semiconductor
MSM64162D
Data Memory The data memory area consists of 8 banks and each bank has 256 nibbles (256 4 bits). The data RAM is assigned to BANK 7 and peripheral ports are assigned to BANK 0.
7FFH 780H 77FH 700H
BANK 7 Data RAM area Unused area
Data/Stack area (128 nibbles)
Contents of 000H to 07FH Inaccessible area 07FH
SFR area
100H 0FFH 080H 07FH 000H 4 bits Unused area BANK 0 000H
Data Memory Map The data RAM area (128 nibbles) is shared by the stack area. The stack is a memory starting from address 7FFH toward the low-order addresses where 4 nibbles are used by Subroutine Call Instruction and 8 nibbles are used by an interrupt. The addresses 080H to 0FFH of BANK 0 and the addresses 700H to 77FH of BANK 7 are not assigned as the data memory, so access to these addresses has no effect. Moreover, it is impossible to access BANK 1 to BANK 6.
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Semiconductor
MSM64162D
ABSOLUTE MAXIMUM RATINGS (1.5 V Spec.)
(VDD = 0 V) Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Input Voltage 1 Input Voltage 2 Output Voltage 1 Output Voltage 2 Output Voltage 3 Output Voltage 4 Storage Temperature Symbol VSS1 VSS2 VSS3 VSSL VIN1 VIN2 VOUT1 VOUT2 VOUT3 VOUT4 TSTG Condition Ta = 25C Ta = 25C Ta = 25C Ta = 25C VSS1 Input, Ta = 25C VSSL Input, Ta = 25C VSS1 Output, Ta = 25C VSS2 Output, Ta = 25C VSS3 Output, Ta = 25C VSSL Output, Ta = 25C -- Rating -2.0 to +0.3 -4.0 to +0.3 -5.5 to +0.3 -2.0 to +0.3 VSS1 - 0.3 to +0.3 VSSL - 0.3 to +0.3 VSS1 - 0.3 to +0.3 VSS2 - 0.3 to +0.3 VSS3 - 0.3 to +0.3 VSSL - 0.3 to +0.3 -55 to +150 Unit V V V V V V V V V V C
RECOMMENDED OPERATING CONDITIONS (1.5 V Spec.)
(VDD = 0 V) Parameter Operating Temperature Operating Voltage Crystal Oscillation Frequency Symbol Top VSS1 fXT Condition -- -- -- Range -40 to +85 -1.7 to -1.25 30 to 35 Unit C V kHz
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Semiconductor
MSM64162D
ELECTRICAL CHARACTERISTICS (1.5 V Spec.)
DC Characteristics
(VDD = 0 V, VSS1 = -1.5 V, Ta = -40 to +85C unless otherwise specified) Parameter
Symbol Measuring Circuit
Condition +100% -50% +100% -50%
Min.
Typ.
Max.
Unit
VSS2 Voltage VSS3 Voltage VSSL Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance POR Generation Voltage POR Non-generation Voltage Battery Check Reference Voltage VRB Temperature Variation
VSS2 VSS3 VSSL VSTA VHOLD TSTOP CG CGEX CD VPOR1 VPOR2 VRB DVRB
Ca, Cb, C12 = 0.1 mF Ca, Cb, C12 = 0.1 mF -- Oscillation start time: within 5 seconds -- -- -- When external CG used --
-3.2 -4.7 -1.5 -- -- 0.1 10 10 10 -0.4 -1.5 -0.73
-3.0 -4.5 -1.3 -- -- -- 15 -- 15 -- -- -0.63 -2.0
-2.8 -4.3 -0.6 -1.45 -1.25 1000 20 30 20 0 -1.2 -0.53 --
V V V V V ms pF pF pF V V V
2
1
When VSS1 is between VPOR1 and -1.5 V No POR when VSS1 is between VPOR2 and -1.5 V Ta = 25C --
--
mV/C
Notes: 1. "POR" denotes Power On Reset. 2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs.
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Semiconductor DC Characteristics (continued)
MSM64162D
(VDD = 0 V, VSS1 = -1.5 V, Ta = -40 to +85C unless otherwise specified) Parameter
Symbol
Condition
Ta = -40 to +40C Ta = +40 to +85C
Min. -- -- -- -- -- -- --
Typ. 2.0 2.0 5.0 5.0 150 600 25
Max. 5.0 30 15 40 230 900 125
Unit mA mA mA mA mA mA mA
Measuring Circuit
Supply Current 1 Supply Current 2
IDD1 IDD2
CPU in halt state
CPU in operating Ta = -40 to +40C state CPU in halt state, RC oscillator for A/D converter is in operating state RT0 = 2 kW Battery check circuit in operating state, CPU in operating state
Ta = +40 to +85C
RT0 = 10 kW
1
Supply Current 3
IDD3
Supply Current 4
IDD4
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Semiconductor DC Characteristics (continued)
MSM64162D
(VDD = 0 V, VSS1 = VSSL = -1.5 V, VSS2 = -3.0 V, VSS3 = -4.5 V, Ta = -40 to +85C unless otherwise specified) Parameter (Pin Name) Output Current 1 (P1.0) Output Current 2 (P1.1 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) Output Current 3 (BD) Output Current 4 (RT0, RS0, CRT0, CS0) Output Current 5 (When L16 to L23 are configured as output ports)
Symbol
Condition VOH1 = -0.5 V VOL1 = VSS1 + 0.5 V VOH2 = -0.5 V VOL2 = VSS1 + 0.5 V VOH3 = -0.7 V VOL3 = VSS1 + 0.7 V VOH4 = -0.1 V VOL4 = VSS1 + 0.1 V VOH5 = -0.5 V VOL5 = VSS1 + 0.5 V VOH6 = -0.2 V (VDD level)
Min. -2.1 1.0 -2.1 0.2 -1.8 0.2 -1.1 0.3 -1.5 0.1 -- 4.0 -- 4.0 -- 4.0 --
Typ. -0.7 3.0 -0.7 0.7 -0.6 0.6 -0.6 0.6 -0.5 0.5 -- -- -- -- -- -- --
Max. -0.2 9.0 -0.2 2.1 -0.2 1.8 -0.3 1.1 -0.1 1.5 -4.0 -- -4.0 -- -4.0 -- 0.3
Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
Measuring Circuit
IOH1 IOL1 IOH2 IOL2 IOH3 IOL3 IOH4 IOL4 IOH5 IOL5 IOH6 IOMH6
2
VOMH6 = VSS1 + 0.2 V (VSS1 level) VOMH6S = VSS1 - 0.2 V (VSS1 level) VOML6 = VSS2 + 0.2 V (VSS2 level) VOML6S = VSS2 - 0.2 V (VSS2 level) VOL6 = VSS3 + 0.2 V VOH = VDD (VSS3 level)
Output Current 6 (L0 to L23)
IOMH6S IOML6 IOML6S IOL6
Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (RT0, RS0, CRT0, CS0)
IOOH
IOOL
VOL = VSS1
-0.3
--
--
mA
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Semiconductor DC Characteristics (continued)
MSM64162D
(VDD = 0 V, VSS1 = VSSL = -1.5 V, VSS2 = -3.0 V, VSS3 = -4.5 V, Ta = -40 to +85C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VIH1 = VDD (when pulled down) VIL1 = VSS1 (when pulled up) VIH1 = VDD (in a high impedance state)
Min.
Typ.
Max.
Unit mA mA mA mA mA mA mA mA mA V V V V V V
Measuring Circuit
Input Current 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3)
IIH1 IIL1 IIH1Z IIL1Z IIH2
5 -60 0
18 -18 -- -- 18 -- -- -- -0.75 -- -- -- -- -- --
60 -5.0 1.0 0 60 1.0 0 1.0 -0.3 0 -1.2 0 -1.2 0 -1.2
VIL1 = VSS1 (in a high impedance state) -1.0 VIH2 = VDD (when pulled down) VIH2 = VDD (in a high impedance state) VIL2 = VSS1 (in a high impedance state) VIH3 = VDD VIL3 = VSS1 -- -- -- -- -- -- 5 0 -1.0 0 -1.5 -0.3 -1.5 -0.3 -1.5 -0.3 -1.5
3
Input Current 2 (IN0)
IIH2Z IIL2Z
Input Current 3 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Input Voltage 2 (IN0) Input Voltage 3 (RESET, TST1, TST2)
IIH3 IIL3 VIH1 VIL1 VIH2 VIL2 VIH3 VIL3
4
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Semiconductor DC Characteristics (continued)
MSM64162D
(VDD = 0 V, VSS1 = VSSL = -1.5 V, VSS2 = -3.0 V, VSS3 = -4.5 V, Ta = -40 to +85C unless otherwise specified) Parameter (Pin Name) Hysteresis Width (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3)
Symbol
Condition
Min.
Typ.
Max.
Unit
Measuring Circuit
DVT1
--
0.05
0.1
0.3
V 4
DVT2
--
0.05
0.1
0.3
V
CIN
--
--
--
5.0
pF
1
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Semiconductor Measuring circuit 1
CS0 RT0 RI0
MSM64162D
RT0
CS0
IN0
XT Crystal 32.768 kHz XT C1 C12
VSSL VDD VSS1 A Cl V VSS2 VSS3
C2
Ca V
Cb V
Ca, Cb, C12, Cl RT0 CS0 RI0
: 0.1 mF : 10 kW/2 kW : 820 pF : 10 kW
Measuring circuit 2
(*2)
(*1) VIL
INPUT
VIH
OUTPUT
A
VDD
VSS1
VSS2
VSS3
VSSL
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Semiconductor Measuring circuit 3
(*3) OUTPUT VDD VSS1 VSS2 VSS3 VSSL
MSM64162D
Measuring circuit 4
INPUT
A
(*3) VIL
INPUT
VIH
OUTPUT
VDD VSS1 VSS2 VSS3 VSSL
Waveform Monitoring
*1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins.
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Semiconductor A/D Converter Characteristics
MSM64162D
(VDD = 0 V, VSS1 = -1.5 V, Ta = -40 to +85C unless otherwise specified) Parameter Resistor for Oscillation Input Current Limiting Resistor Symbol RS0, RT0, RT0-1 Condition Min. Typ. Max. Unit
Measuring Circuit
CS0, CT0 740 pF
2.0
--
--
kW
RI0 fOSC1
-- Resistor for oscillation = 2 kW Resistor for oscillation = 10 kW Resistor for oscillation = 200 kW RT0, RT0-1 = 2 kW RT0, RT0-1 = 10 kW RT0, RT0-1 = 200 kW
1.0 165 41.8 2.55 3.89 0.990
10 221 52.2 3.04 4.18 1.0
-- 256 60.6 3.53 4.35 1.010
kW 5 kHz kHz kHz -- -- --
Oscillation Frequency
fOSC2 fOSC3 Kf1
RS*RT Oscillation Frequency Ratio (*)
Kf2 Kf3
0.0561 0.0584 0.0637
*
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition.
Kfx = fOSCX (RT0-CS0 Oscillation) fOSCX (RS0-CS0 Oscillation) , (x = 1, 2, 3) fOSCX (RT0-1-CS0 Oscillation) fOSCX (RS0-CS0 Oscillation)
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Semiconductor Measuring circuit 5
MSM64162D
RT0-1 RT0
RS0
IN0 CS0 RS0 CRT0 RT0
Oscillation Mode Designation
RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3 VDD VSSL VSS2 D. U. T. P3.3 Frequency Measurement (fOSCX)
CS0
RI0
CT0
Cl RT0, RT0-1 = 2 kW/10 kW/200 kW RS0 = 10 kW RI0 = 10 kW CS0, CT0 = 820 pF Cl = 0.1 mF
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Semiconductor
MSM64162D
ABSOLUTE MAXIMUM RATINGS (3.0 V Spec.)
(VDD = 0 V) Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Input Voltage 1 Input Voltage 2 Output Voltage 1 Output Voltage 2 Output Voltage 3 Storage Temperature Symbol VSS1 VSS2 VSS3 VSSL VIN1 VIN2 VOUT1 VOUT2 VOUT3 TSTG Condition Ta = 25C Ta = 25C Ta = 25C Ta = 25C VSS2 Input, Ta = 25C VSSL Input, Ta = 25C VSS2 Output, Ta = 25C VSS3 Output, Ta = 25C VSSL Output, Ta = 25C -- Rating -2.0 to +0.3 -4.0 to +0.3 -5.5 to +0.3 -4.0 to +0.3 VSS2 - 0.3 to +0.3 VSSL - 0.3 to +0.3 VSS2 - 0.3 to +0.3 VSS3 - 0.3 to +0.3 VSSL - 0.3 to +0.3 -55 to +150 Unit V V V V V V V V V C
RECOMMENDED OPERATING CONDITIONS (3.0 V Spec.)
(VDD = 0 V) Parameter Operating Temperature Symbol Top
"duty 1/2" Except using LCD driver with "duty 1/2"
Condition --
Using LCD driver with
Range -40 to +85 -3.5 to -2.2
Unit C
Operating Voltage
VSS2
V -3.5 to -2.0 30 to 66 kHz
Crystal Oscillation Frequency
fXT
--
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Semiconductor
MSM64162D
ELECTRICAL CHARACTERISTICS (3.0 V Spec.)
DC Characteristics
(VDD = 0 V, VSS2 = -3.0 V, Ta = -40 to +85C unless otherwise specified) Condition +100% -50% +100% -50% Min. Typ. Max. Unit
Measuring Circuit
Parameter
Symbol
VSS1 Voltage VSS3 Voltage VSSL Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance POR Generation Voltage POR Non-generation Voltage Battery Check Reference Voltage VRB Temperature Variation
VSS1 VSS3 VSSL VSTA VHOLD TSTOP CG CGEX CD VPOR1 VPOR2 VRB DVRB
Ca, Cb, C12 = 0.1 mF Ca, Cb, C12 = 0.1 mF -- Oscillation start time: within 5 seconds -- -- -- When external CG used --
-1.7 -4.7 -1.9 -- -- 0.1 10 10 10 -0.7 -3.0 -0.73
-1.5 -4.5 -1.3 -- -- -- 15 -- 15 -- -- -0.63 -2.0
-1.3 -4.3 -0.6 -2.0 -2.0 1000 20 30 20 0 -2.0 -0.53 --
V V V V V ms pF pF pF V V V
2
1
When VSS2 is between VPOR1 and -3.0 V No POR when VSS2 is between VPOR2 and -3.0 V Ta = 25C --
--
mV/C
Notes: 1. "POR" denotes Power On Reset. 2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs.
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Semiconductor DC Characteristics (continued)
MSM64162D
(VDD = 0 V, VSS2 = -3.0 V, Ta = -40 to +85C unless otherwise specified) Parameter
Symbol
Condition
Ta = -40 to +40C Ta = +40 to +85C
Min. -- -- -- -- -- -- --
Typ. 1.5 1.5 5.0 5.0 300 1300 55
Max. 4.5 30 15 40 450 2000 150
Unit mA mA mA mA mA mA mA
Measuring Circuit
Supply Current 1 Supply Current 2
IDD1 IDD2
CPU in halt state
CPU in operating Ta = -40 to +40C state CPU in halt state, RC oscillator for A/D converter is in operating state
Ta = +40 to +85C
RT0 = 10 kW RT0 = 2 kW
1
Supply Current 3
IDD3
Supply Current 4
IDD4
Battery check circuit in operating state, CPU in operating state
24/37
Semiconductor DC Characteristics (continued)
MSM64162D
(VDD = 0 V, VSS1 = VSSL = -1.5 V, VSS2 = -3.0 V, VSS3 = -4.5 V, Ta = -40 to +85C unless otherwise specified) Parameter (Pin Name) Output Current 1 (P1.0) Output Current 2 (P1.1 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) Output Current 3 (BD) Output Current 4 (RT0, RS0, CRT0, CS0) Output Current 5 (When L16 to L23 are configured as output ports)
Symbol
Condition VOH1 = -0.5 V VOL1 = VSS2 + 0.5 V VOH2 = -0.5 V VOL2 = VSS2 + 0.5 V VOH3 = -0.7 V VOL3 = VSS2 + 0.7 V VOH4 = -0.1 V VOL4 = VSS2 + 0.1 V VOH5 = -0.5 V VOL5 = VSS2 + 0.5 V VOH6 = -0.2 V (VDD level)
Min.
Typ.
Max.
Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
Measuring Circuit
IOH1 IOL1 IOH2 IOL2 IOH3 IOL3 IOH4 IOL4 IOH5 IOL5 IOH6 IOMH6
-6.0 3.0 -6.0 0.7 -6.0 0.7 -2.5 0.7 -1.5 0.15 -- 4.0 -- 4.0 -- 4.0 --
-2.0 8.0 -2.0 2.0 -2.0 2.0 -1.3 1.3 -0.6 0.6 -- -- -- -- -- -- --
-0.7 25 -0.7 6.0 -0.7 6.0 -0.7 2.5 -0.15 1.5 -4.0 -- -4.0 -- -4.0 -- 0.3
2
VOMH6 = VSS1 + 0.2 V (VSS1 level) VOMH6S = VSS1 - 0.2 V (VSS1 level) VOML6 = VSS2 + 0.2 V (VSS2 level) VOML6S = VSS2 - 0.2 V (VSS2 level) VOL6 = VSS3 + 0.2 V VOH = VDD (VSS3 level)
Output Current 6 (L0 to L23)
IOMH6S IOML6 IOML6S IOL6
Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (RT0, RS0, CRT0, CS0)
IOOH
IOOL
VOL = VSS2
-0.3
--
--
mA
25/37
Semiconductor DC Characteristics (continued)
MSM64162D
(VDD = 0 V, VSS1 = VSSL = -1.5 V, VSS2 = -3.0 V, VSS3 = -4.5 V, Ta = -40 to +85C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VIH1 = VDD (when pulled down) VIL1 = VSS2 (when pulled up) VIH1 = VDD (in a high impedance state)
Min.
Typ.
Max.
Unit mA mA mA mA mA mA mA mA mA V V V V V V
Measuring Circuit
IIH1 Input Current 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) IIL1 IIH1Z IIL1Z IIH2 Input Current 2 (IN0) IIH2Z IIL2Z Input Current 3 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Input Voltage 2 (IN0) Input Voltage 3 (RESET, TST1, TST2) IIH3 IIL3 VIH1 VIL1 VIH2 VIL2 VIH3 VIL3
30 -300 0
90 -90 -- -- 90 -- -- -- -1.5 -- -- -- -- -- --
300 -30 1.0 0 300 1.0 0 1.0 -0.75 0 -2.4 0 -2.4 0 -2.4
VIL1 = VSS2 (in a high impedance state) -1.0 VIH2 = VDD (when pulled down) VIH2 = VDD (in a high impedance state) VIL2 = VSS2 (in a high impedance state) VIH3 = VDD VIL3 = VSS2 -- -- -- -- -- -- 30 0 -1.0 0 -3.0 -0.6 -3.0 -0.6 -3.0 -0.6 -3.0
3
4
26/37
Semiconductor DC Characteristics (continued)
MSM64162D
(VDD = 0 V, VSS1 = VSSL = -1.5 V, VSS2 = -3.0 V, VSS3 = -4.5 V, Ta = -40 to +85C unless otherwise specified) Parameter (Pin Name) Hysteresis Width (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3)
Symbol
Condition
Min.
Typ.
Max.
Unit
Measuring Circuit
DVT1
--
0.2
0.5
1.0
V 4
DVT2
--
0.2
0.5
1.0
V
CIN
--
--
--
5.0
pF
1
27/37
Semiconductor Measuring circuit 1
MSM64162D
CS0 RT0 RI0
RT0
CS0
IN0
XT Crystal 32.768 kHz XT C1 C12
VSSL VDD VSS1 A Cl V VSS2 VSS3
C2
Ca V
Cb V
Cl Ca, Cb, C12 RT0 CS0 RI0
: 0.47 mF : 0.1 mF : 10 kW/2 kW : 820 pF : 10 kW
Measuring circuit 2
(*2)
OUTPUT
(*1) VIL
INPUT
VIH
A
VDD
VSS1
VSS2
VSS3
VSSL
28/37
Semiconductor Measuring circuit 3
(*3)
MSM64162D
INPUT
A
VDD
VSS1
VSS2
VSS3
VSSL
Measuring circuit 4
(*3) VIL
INPUT
VIH
OUTPUT
OUTPUT
Waveform Monitoring
VDD
VSS1
VSS2
VSS3
VSSL
*1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins.
29/37
Semiconductor A/D Converter Characteristics
MSM64162D
(VDD = 0 V, VSS2 = -3.0 V, Ta = -40 to +85C unless otherwise specified) Parameter Symbol Condition Min. Typ. Max. Unit
Measuring Circuit
Resistor for Oscillation Input Current Limiting Resistor
RS0, RT0, RT0-1
CS0, CT0 740 pF
1.0
--
--
kW
RI0 fOSC1
-- Resistor for oscillation = 2 kW Resistor for oscillation = 10 kW Resistor for oscillation = 200 kW RT0, RT0-1 = 2 kW RT0, RT0-1 = 10 kW RT0, RT0-1 = 200 kW
1.0 200 46.5 2.79 4.115 0.990
10 239 55.4 3.32 4.22 1.0
-- 277 64.3 3.85 4.326 1.010
kW 5 kHz kHz kHz -- -- --
Oscillation Frequency
fOSC2 fOSC3 Kf1
RS*RT Oscillation Frequency Ratio(*)
Kf2 Kf3
0.0573 0.0616 0.0659
*
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition.
fOSCX (RT0-CS0 Oscillation) fOSCX (RS0-CS0 Oscillation) , (x = 1, 2, 3) fOSCX (RT0-1-CS0 Oscillation) fOSCX (RS0-CS0 Oscillation)
Kfx =
30/37
Semiconductor Measuring circuit 5
MSM64162D
RT0-1 RT0
RS0
IN0 CS0 RS0 CRT0 RT0
Oscillation Mode Designation
RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3 VDD VSSL VSS2 D. U. T. P3.3 Frequency Measurement (fOSCX)
CS0
RI0
CT0
Cl RT0, RT0-1 = 2 kW/10 kW/200 kW RS0 = 10 kW RI0 = 10 kW CS0, CT0 = 820 pF Cl = 0.47 mF
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Semiconductor
MSM64162D
FUNCTIONAL DESCRIPTION
* A/D converter (ADC) The MSM64162D has a built-in 1-channel RC oscillation type A/D converter. The A/D converter is composed of a 1-channel oscillation circuit, Counter A (CNTA0-4, a 4.8-digit decade counter), Counter B (CNTB0-3, a 14-bit binary counter), and A/D Converter Control Registers 0 and 1 (ADCON0, ADCON1). By counting oscillation frequencies that vary depending on a resistor or capacitor connected to the RC oscillation circuit, the A/D converter converts resistance values or capacitance values to corresponding digital values. By using a thermistor or humidity sensor as a resistance, a thermometer or a hygrometer can be constructed. * LCD driver (LCD) The MSM64162D has a built-in LCD driver for 24 outputs. The LCD driver consists of 21 4-bit display registers (DSPR0-20), the Display Control Register (DSPCON), a 24-output LCD driver circuit, and a bias generation circuit (BIAS). There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. Software selects the duty mode. A mask option can select either a common driver or a segment driver for each LCD driver pin. A mask option can also specify assignment of each bit of the display register to each segment. All the display registers must be selected by a mask option. L16 to L23 of the LCD driver can be configured to be output ports by a mask option. The relationship between the duty, the bias method, and the maximum segment number follows: 1/4 duty 1/3 bias method ------- 80 segments 1/3 duty 1/3 bias method ------- 63 segments 1/2 duty 1/2 bias method ------- 44 segments * Buzzer driver (BD) The MSM64162D has a built-in buzzer driver with 2 buzzer output frequencies and 4 buzzer output modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the Buzzer Frequency Control Register (BFCON). * Capture circuit (CAPR) The MSM64162D captures 32 Hz to 256 Hz output of the time base counter at the falling of Port 0.0 or 0.1 (P0.0 or P0.1) to "L" level when the pull-up resistor input is chosen, or at the rising to "H" level when the pull-down resistor input is chosen. The capture circuit is composed of the Capture Control Register (CAPCON) and the Capture Registers (CAPR0, CAPR1) that fetch output from the time base counter. * Watchdog timer (WDT) The MSM64162D has a built-in watchdog timer to detect CPU malfunction. The watchdog timer is composed of a 6-bit watchdog timer counter (WDTC) to count a 16 Hz output and a watchdog timer control register (WDTCON) to reset WDTC.
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Semiconductor
MSM64162D
* Clock generation circuit (CLKG) The clock generation circuit (CLKG) in the MSM64162D contains a 32.768 kHz crystal oscillation circuit. This circuit generates the system clock (CLK) and the time base clock (32.768 kHz). The system clock drives the CPU while the time base clock drives the time base counter and the buzzer driver. The system clock frequency is 32.768 kHz, which is the output of the crystal oscillation circuit. * Time base counter (TBC) The MSM64162D has a built-in time base counter (TBC) that generates clocks to be supplied to internal peripheral circuits. The time base counter is composed of 15 binary counters. The count clock of the time base is driven by the oscillation clock (32.768 kHz) of the crystal oscillation circuit. The output of the time base counter is used for the buzzer driver, the system reset circuit, the watchdog timer, the time base interrupt, the sampling clocks of each port, and the capture circuit. * I/O port Input-output ports (P2, P3) (8 bits)
Input port (P0) (4 bits) Output port (P1) (4 bits)
: Pull-up (pull-down) resistor input or highimpedance input, CMOS output or NMOS open drain output: these can be specified for each bit; external 0 interrupt : Pull-up (pull-down) resistor input or highimpedance input; external 1 interrupt : CMOS output or NMOS open drain output
* Interrupt (INTC) The MSM64162D has 9 interrupt sources (9 vector addresses), of which two are external interrupts from ports and seven are internal interrupts. Of the nine interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable interrupt). The other eight interrupts are controlled by the master interrupt enable flag (MI) and the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the CPU branches to a vector address corresponding to the interrupt source. * Battery check circuit (BC) The battery check circuit (BC) detects the level of the supply voltage by comparing the voltage generated by an external supply-voltage dividing resistor (RBLD) with the internal reference voltage (Vrb).
33/37
Semiconductor
APPLICATION CIRCUITS
LCD
L23 Crystal 32.768 kHz XT XT RESET P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3 Switch matrix (4 4)
L0 VDD C2 C1 VSS3 VSS2 VSS1 VSSL TST2 TST1
1.5 V Spec. Application Circuit
C1 C12 Cb Ca 1.5 V
MSM64162D-xxx (1.5 V spec.)
Cl
CRT0
P3.3
RS0
CS0
RT0
IN0
BD
RT0 RS0
CS0 RI0
Buzzer
MSM64162D
34/37
OSC monitor
Semiconductor
APPLICATION CIRCUITS (continued)
LCD
L23 Crystal 32.768 kHz XT XT RESET P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3
L0 VDD C2 C1 C12 VSS3 Cb VSS2 VSS1 VSSL TST2 TST1 CRT0 Ca Cl * Battery check circuit is used * CGEX of crystal oscillator: External
3.0 V Spec. Application Circuit
C2 3V
CGEX
MSM64162D-xxx (3.0 V spec.)
P3.1
P3.3
RS0
CS0
RT0
IN0
BD
Switch matrix (4 4) RBLD Buzzer
RT0 RS0 CS0 RI0
MSM64162D
OSC monitor
35/37
Semiconductor
MSM64162D
PACKAGE DIMENSIONS
(Unit : mm)
QFP64-P-1420-1.00-BK
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.25 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
36/37
Semiconductor
MSM64162D
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.27 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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