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| Surface Mount Varistors Multilayer High Speed Transient Voltage Surge Suppressor MHS Varistor Series The Multilayer High-Speed MHS Series is a very-low capacitance extension to the Littelfuse ML family of Transient Voltage Surge Suppression devices available in an 0402 and 0603-size surface mount chip. The MHS series provides protection from ESD and EFT in high-speed data-line and other high frequency applications. The low capacitance of the MHS Series permits usage in analog or digital circuits where it will not attenuate or distort the desired signal or data. Their small size is ideal for high-density printed circuit boards, being typically applied to protect intergrated circuits and other sensitive components. They are particularly well suited to suppress ESD events including those specified in IEC 61000-4-2 or other standards used for ElectroMagnetic Compliance (EMC) testing. The MHS series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount package. The MHS Series is also compatible with modern reflow and wave soldering processes. Littelfuse Inc. manufactures other Multilayer Varistor Series products, see the ML, MLE, MLN and AUML series data sheets. Features * 3pF & 12pF Capacitance Versions Suitable for High Speed Data-Rate Lines * ESD Rated to IEC 61000-4-2 (Level 4) * EFT/B Rated to IEC 61000-4-4 (Level 4) * Low Leakage Currents * -55oC to +125oC Operating Temperature Range * Inherently Bi-directional Applications * Data, Diagnostic I/O Ports * Universal Serial Bus (USB) * Video & Audio Ports * Portable/Hand-Held Products * Mobile Communications * Computer/DSP Products * Industrial Instruments Including Medical Absolute Maximum Ratings Continuous: For ratings of individual members of a series, see device ratings and specifications table. MHS SERIES UNITS V V O C O C Steady State Applied Voltage: DC Voltage Range (VM(DC)):V0402/0603MHS03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 V0402/0603MHS12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125 Storage Temperature Range (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150 1 Surface Mount Varistors Multilayer High Speed Transient Voltage Surge Suppressor MHS Varistor Series Device Ratings and Specifications MAX RATINGS (125C) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000S) MAXIMUM CLAMPING VOLTAGE AT 1A (8X20s) PERFORMANCE SPECIFICATIONS (25C) MAXIMUM ESD CLAMP VOLTAGE (NOTE 1) (Note 2) 8kV CONTACT (Note 3) 15kV AIR MAXIMUM LEAKAGE CURRENT AT SPECIFIED DC VOLTAGE TYPICAL CAPACITANCE AT 1MHz (1V p-p) (NOTE 4) C (pF) 3 3 12 12 TYPICAL INDUCTANCE (from Impedance Analysis) PART NUMBER 3.5V P (A) 0.1 0.1 0.1 0.1 5.5V IL (A) 0.15 0.15 0.15 0.15 9V IL (A) 0.25 0.25 1.00 1.00 15V IL (A) 0.50 0.50 5.00 5.00 WTM (J) (Vc) 110 110 55 55 Clamp (V) 300 300 125 125 Clamp (V) 400 400 160 160 L (nH) <1.0 <1.0 <1.0 <1.0 V0402MHS03 V0603MHS03 V0402MHS12 V0603MHS12 0.010 0.010 0.025 0.025 NOTES: 1. Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit. 2. Direct discharge to device terminals (IEC preferred test method). 3. Corona discharge through air (represents actual ESD event). 4. Capacitance may be customized, contact your Littelfuse Sales Representative. Temperature De-rating For applications exceeding 125oC ambient temperature, the peak surge current and energy ratings must be reduced as shown in Figure 1. NOMINAL VOLTAGE AT 1mADC 100 PERCENT OF RATED VALUE 60 V0402MHS03 V0603MHS03 50 80 40 60 30 V0402MHS12 V0603MHS12 20 40 20 10 0 -55 1 50 60 70 80 90 100 110 120 130 140 150 10 100 CURRENT (A) 1000 10000 AMBIENT TEMPERATURE ( oC) FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE 30 25 20 VARISTOR VOLTAGE (V) INSERTION LOSS (dB) 0 FIGURE 3. NOMINAL VOLTAGE STABILITY TO MULTIPLE ESD IMPULSES (8KV CONTACT DISCHARGES PER IEC 61000-4-2) -10 V0402MHS12 V0603MHS12 V0402MHS03 V0603MHS03 15 25o 10 85o 125o 5 0 0.0001 -20 0.001 0.01 CURRENT (mA) 0.1 1 -30 10 100 1000 FREQUENCY (MHz) 10000 FIGURE 2: STANDBY CURRENT AT NORMALIZED VARISTOR VOLTAGE AND TEMPERATURE FIGURE 4. INSERTION LOSS (S21) CHARACTERISTICS 2 Surface Mount Varistors Multilayer High Speed Transient Voltage Surge Suppressor MHS Varistor Series Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are infared (IR) re-flow, vapour phase re-flow and wave soldering. Typical profiles are shown in Figures 5, 6 and 7. When wave soldering, the MHS suppressor is attached to the circuit board by means of an adhesive. The assembly is then placed on a conveyor and run through the soldering process to contact the wave. With IR and vapour phase re-flow, the device is placed in a solder paste on a substrate. As the solder paste is heated, it re-flows and solders the unit to the board. The recommended solder for the MHS suppressor is a 63/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. For 0402-size devices, IR reflow is recommended. When using a re-flow process, care should be taken to ensure that the MHS chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating within 100 degrees of the solder's peak temperature is essentail to minimize thermal shock. Examples of the soldering conditions for the MHS suppressor are given in the tables below. Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50oC before cleaning. 6. 7. Recommended Pad Outline 5. TABLE 1: PAD LAYOUT DIMENSIONS DIMENSION mm 0402 0603 1.70 2.54 A in 0.067 0.100 mm 0.510 0.760 B in 0.020 0.030 mm 0.610 0.890 C in 0.024 0.035 3 Surface Mount Varistors Multilayer High Speed Transient Voltage Surge Suppressor MHS Varistor Series Ordering Information Multilayer High Speed - MHS Series V 0402 MHS 03 W H E Mechanical Dimensions DEVICE FAMILY Littelfuse TVSS Device DEVICE SIZE i.e. 40Mil x 20Mil (1.0mm x 0.5mm) PACKING OPTIONS H: 7in (178mm) Diameter Reel (Note) END TERMINATION OPTION No Letter: Ag/Pt (Standard) W: Ag/Pd N: Nickel Barrier termination subject to availibility. Please contact a Littelfuse sales representative CAPACITANCE DESIGNATION 03 = 3PF 12 = 12PF DEVICE DIMENSIONS 0402 SIZE 0603 SIZE INCH 0.035 0.0150.008 0.0630.006 0.0320.006 MM 0.9 0.40.2 1.61.5 0.81.5 D L W SERIES DESIGNATOR Multilayer Hi-Speed Standard Shipping Quantities SIZE 0402 0603 7 INCH REEL ("H" OPTION) 10,000 2,500 13 IN REEL "T" OPTION -- 10,000 DIMENSION D Max. E L W INCH 0.024 0.100.006 0.0390.004 0.0200.004 MM 0.60 0.250.15 1.000.10 0.500.10 Tape and Reel Specifications * Conforms to EIA-481-1, Revision A * Can be supplied to IEC publication 286-3 SYMBOL A0 B0 K0 W F E1 P1 P2 P0 D0 D1 T1 Width of Cavity Length of Cavity Depth of Cavity Width of Tape Distance Between Drive Hole Centers and Cavity Centers Distance Between Drive Hole Centers and Tape Edge Distance Between Cavity Center Axial Drive Distance Between Drive Hole Centers & Cavity Hole Centers Axial Drive Distance Between Drive Hole Centers Drive Hole Diameter Nominal Paper Thickness Top & Bottom Tape Thickness DESCRIPTION DIMENSIONS IN MILLIMETERS Dependant on chip size to minimize rotation Dependant on chip size to minimize rotation Dependant on chip size to minimize rotation 8 0.2 3.5 0.05 1.750.1 20.05 2 0.1 4 0.1 1.55 0.05 0.61 0.10 Max PRODUCT IDENTIFYING LABEL EMBOSSED PAPER CARRIER E D0 P0 P2 T F B0 W t1 P1 A0 TOP TAPE 8mm NOMINAL 178mm DIA. REEL 4 |
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