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INTEGRATED CIRCUITS DATA SHEET 74HC1G14; 74HCT1G14 Inverting Schmitt-trigger Product specification File under Integrated Circuits, IC06 1998 Aug 05 Philips Semiconductors Product specification Inverting Schmitt-trigger FEATURES * Wide operating voltage range: 2.0 to 6.0 V * Symmetrical output impedance * High noise immunity * Low power dissipation * Balanced propagation delays * Very small 5 pins package * Applications - Wave and pulse shapers - Astable multivibrators - Monostable multivibrators * Output capability: standard. DESCRIPTION The 74HC1G/HCT1G14 is a high-speed Si-gate CMOS device. The 74HC1G/HCT1G14 provides the inverting buffer function with Schmitt-trigger action. These devices are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The standard output currents are 12 compared to the 74HC/HCT14. FUNCTION TABLE See note 1. INPUT inA L H Note 1. H = HIGH voltage level; L = LOW voltage level. OUTPUT outY H L Notes CPD 74HC1G14; 74HCT1G14 QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf = 6.0 ns. TYP. SYMBOL tPHL/tPLH CI PARAMETER CONDITIONS HC1G propagation CL = 15 pF delay inA to outY VCC = 5 V input capacitance power dissipation capacitance notes 1 and 2 10 1.5 20 HCT1G 15 1.5 22 ns pF pF UNIT 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; (CL x VCC2 x fo) = sum of outputs. 2. For HC1G the condition is VI = GND to VCC. For HCT1G the condition is VI = GND to VCC - 1.5 V. PINNING PIN 1 2 3 4 5 SYMBOL n.c. inA GND outY VCC DESCRIPTION not connected data input ground (0 V) data output DC supply voltage 1998 Aug 05 2 Philips Semiconductors Product specification Inverting Schmitt-trigger ORDERING AND PACKAGE INFORMATION PACKAGES OUTSIDE NORTH AMERICA 74HC1G14GW 74HCT1G14GW TEMPERATURE RANGE -40 to +125 C PINS 5 5 PACKAGE SC-88A SC-88A 74HC1G14; 74HCT1G14 MATERIAL plastic plastic CODE SOT353 SOT353 MARKING HF TF handbook, halfpage n.c 1 inA 2 GND 3 MNA022 5 VCC handbook, halfpage 14 4 outY 2 inA outY 4 MNA023 Fig.1 Pin configuration. Fig.2 Logic symbol. handbook, halfpage 2 MNA024 4 handbook, halfpage inA outY MNA025 Fig.3 IEC logic symbol. Fig.4 Logic diagram. 1998 Aug 05 3 Philips Semiconductors Product specification Inverting Schmitt-trigger RECOMMENDED OPERATING CONDITIONS 74HC1G SYMBOL VCC VI VO Tamb PARAMETER MIN. DC supply voltage input voltage output voltage operating ambient temperature range 2.0 0 0 -40 TYP. 5.0 - - +25 MAX. 6.0 VCC VCC +125 MIN. 4.5 0 0 -40 TYP. 5.0 - - +25 74HCT1G 74HC1G14; 74HCT1G14 UNIT MAX. 5.5 VCC VCC +125 V V V C CONDITIONS see DC and AC characteristics per device LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK IOK IO ICC Tstg PD PARAMETER DC supply voltage DC input diode current DC output diode current DC output source or sink current standard outputs DC VCC or GND current for types with standard outputs storage temperature range power dissipation per package 5 pins plastic SC-88A Note 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. for temperature range: -40 to +125 C above +55 C derate linearly with 2.5 mW/K - 200 mW VI < -0.5 or VI > VCC + 0.5 V; note 1 VO < -0.5 or VO > VCC + 0.5 V; note 1 -0.5 V < VO < VCC + 0.5 V; note 1 note 1 CONDITIONS - - - - -65 MIN. -0.5 MAX. +7.0 20 20 12.5 25 +150 UNIT V mA mA mA mA C 1998 Aug 05 4 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 DC CHARACTERISTICS FOR THE 74HC1G Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb (C) SYMBOL PARAMETER MIN. VOH HIGH-level output voltage; all outputs 1.9 4.4 5.9 VOH HIGH-level output voltage; standard outputs LOW-level output voltage; all outputs 4.13 5.63 - - - VOL LOW-level output voltage; standard outputs input leakage current quiescent supply current - - - - -40 to +85 TYP.(1) 2.0 4.5 6.0 4.32 5.81 0 0 0 0.15 0.16 - - MAX. - - - - - 0.1 0.1 0.1 0.33 0.33 1.0 10 -40 to +125 MIN. 1.9 4.4 5.9 3.7 5.2 - - - - - - - MAX. - - - - - 0.1 0.1 0.1 0.4 0.4 1.0 20 V V V V V V V V V V A A UNIT VCC (V) 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 VI = VIH or VIL; IO = 2.0 mA VI = VIH or VIL; IO = 2.6 mA VI = VCC or GND VI = VCC or GND; IO = 0 VI = VIH or VIL; -IO = 2.0 mA VI = VIH or VIL; -IO = 2.6 mA VI = VIH or VIL; IO = 20 A OTHER VI = VIH or VIL; -IO = 20 A TEST CONDITIONS VOL II ICC Note 1. All typical values are measured at Tamb = 25 C. DC CHARACTERISTICS FOR THE 74HC1G14 Voltages are referenced to GND (ground = 0 V). Tamb (C) SYMBOL PARAMETER MIN. VT+ positive-going threshold 0.7 1.7 2.1 VT- negative-going threshold 0.3 0.9 1.2 VH hysteresis (VT+ - VT-) 0.2 0.4 0.6 Note 1. All typical values are measured at Tamb = 25 C. 1998 Aug 05 5 -40 to +85 TYP.(1) 1.09 2.36 3.12 0.60 1.53 2.08 0.48 0.83 1.04 MAX. 1.5 3.15 4.2 0.9 2.0 2.6 1.0 1.4 1.6 -40 to +125 MIN. 0.7 1.7 2.1 0.3 0.9 1.2 0.2 0.4 0.6 MAX. 1.5 3.15 4.2 0.9 2.0 2.6 1.0 1.4 1.6 V V V V V V V V V UNIT VCC (V) 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 see Figs 5 and 6 see Figs 5 and 6 WAVEFORMS see Figs 5 and 6 TEST CONDITIONS Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 DC CHARACTERISTICS FOR THE 74HCT1G Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb (C) SYMBOL PARAMETER MIN. VOH VOH HIGH-level output voltage; all outputs HIGH-level output voltage; standard outputs LOW-level output voltage; all outputs LOW-level output voltage; standard outputs quiescent supply current additional supply current per input 4.4 4.13 -40 to +85 TYP.(1) 4.5 4.32 MAX. - - -40 to +125 MIN. 4.4 3.7 MAX. - - V V UNIT VCC (V) 4.5 4.5 OTHER VI = VIH or VIL; -IO = 20 A VI = VIH or VIL; -IO = 2.0 mA VI = VIH or VIL; IO = 20 A VI = VIH or VIL; IO = 2.0 mA VI = VCC or GND VI = VCC or GND; IO = 0 VI = VCC - 2.1 V; IO = 0 TEST CONDITIONS VOL VOL - - 0 0.15 0.1 0.33 - - 0.1 0.4 V V 4.5 4.5 II ICC ICC Note input leakage current - - - - - - 1.0 10.0 500 - - - 1.0 20.0 850 A A A 5.5 5.5 4.5 to 5.5 1. All typical values are measured at Tamb = 25 C. DC CHARACTERISTICS FOR THE 74HCT1G14 Voltages are referenced to GND (ground = 0 V). Tamb (C) SYMBOL PARAMETER MIN. VT+ VT- VH positive-going threshold negative-going threshold hysteresis (VT+ - VT-) 1.2 1.4 0.5 0.6 0.4 0.4 Note 1. All typical values are measured at Tamb = 25 C. -40 to +85 TYP.(1) 1.55 1.80 0.76 0.90 0.80 0.90 MAX. 1.9 2.1 1.2 1.4 - - -40 to +125 MIN. 1.2 1.4 0.5 0.6 0.4 0.4 MAX. 1.9 2.1 1.2 1.4 - - V V V V V V UNIT VCC (V) 4.5 5.5 4.5 5.5 4.5 5.5 see Figs 5 and 6 see Figs 5 and 6 WAVEFORMS see Figs 5 and 6 TEST CONDITIONS 1998 Aug 05 6 Philips Semiconductors Product specification Inverting Schmitt-trigger AC CHARACTERISTICS FOR 74HC1G14 GND = 0 V; tr = tf = 6.0 ns; CL = 50 pF. Tamb (C) SYMBOL PARAMETER - - - Note 1. All typical values are measured at Tamb = 25 C. AC CHARACTERISTICS FOR 74HCT1G14 GND = 0 V; tr = tf = 6.0 ns; CL = 50 pF. Tamb (C) SYMBOL PARAMETER MIN. tPHL/tPLH Note 1. All typical values are measured at Tamb = 25 C. propagation delay inA to outY - -40 to +85 TYP.(1) 17 MAX. 43 -40 to +125 MIN. - MAX. 51 -40 to +85 MIN. TYP.(1) tPHL/tPLH propagation delay inA to outY 25 12 11 MAX. 155 31 26 - - - -40 to +125 MIN. MAX. 190 38 32 74HC1G14; 74HCT1G14 TEST CONDITIONS UNIT VCC (V) ns ns ns 2.0 4.5 6.0 WAVEFORMS see Figs 12 and 13 TEST CONDITIONS UNIT VCC(V) ns 4.5 WAFEFORMS see Figs 12 and 13 1998 Aug 05 7 Philips Semiconductors Product specification Inverting Schmitt-trigger TRANSFER CHARACTERISTIC WAVEFORMS 74HC1G14; 74HCT1G14 handbook, halfpage VO handbook, halfpage VI VT+ VT- VH VO MNA027 VH VT+ VT- MNA026 Fig.6 Fig.5 Transfer characteristic. The definitions of VT+, VT- and VH; where VT+ and VT- are between limits of 20% and 70%. handbook, halfpage 100 MNA028 handbook, halfpage 1.0 MNA029 ICC (A) ICC (mA) 0.8 0.6 50 0.4 0.2 0 0 1.0 VI (V) 2.0 0 0 2.5 VI (V) 5.0 Fig.7 Typical HC1G14 transfer characteristics; VCC = 2.0 V. Fig.8 Typical HC1G14 transfer characteristics; VCC = 4.5 V. 1998 Aug 05 8 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 handbook, halfpage 1.6 MNA030 handbook, halfpage 2.0 MNA031 ICC (mA) ICC (mA) 0.8 1.0 0 0 3.0 VI (V) 6.0 0 0 2.5 VI (V) 5.0 Fig.9 Typical HC1G14 transfer characteristics; VCC = 6.0 V. Fig.10 Typical HCT1G14 transfer characteristics; VCC = 4.5 V. handbook, halfpage 3.0 MNA032 ICC (mA) handbook, halfpage inA INPUT 2.0 VM(1) tPHL tPLH outY OUTPUT 1.0 VM(1) MNA033 0 0 3.0 VI (V) 6.0 (1) HC1G: VM = 50%; VI = GND to VCC. HCT1G: VM = 1.3 V; VI = GND to 3.0 V. Fig.11 Typical HCT1G14 transfer characteristics; VCC = 5.5 V. Fig.12 The input (inA) to output (outY) propagation delays. 1998 Aug 05 9 Philips Semiconductors Product specification Inverting Schmitt-trigger 74HC1G14; 74HCT1G14 handbook, halfpage VCC VI D.U.T. RT CL 50 pF MNA034 PULSE GENERATOR VO Definitions for test circuit: CL = load capacitance including jig and probe capacitance (See "AC characteristics for 74HC1G14" and "AC characteristics for 74HCT1G14" for values). RT = termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.13 Load circuitry for switching times. 1998 Aug 05 10 Philips Semiconductors Product specification Inverting Schmitt-trigger APPLICATION INFORMATION The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula: Pad = fi x (tr x ICCa + tf x ICCa) x VCC Where: Pad = additional power dissipation (W) fi = input frequency (MHz) tr = input rise time (ns); 10% to 90% tf = input fall time (ns); 90% to 10% ICCa = average additional supply current (A). Average ICCa differs with positive or negative input transitions, as shown in Fig.14 and Fig.15. HC1G/HCT1G14 used in relaxation oscillator circuit, see Fig.14 and Fig.16. Note to the application information: 1. All values given are typical unless otherwise specified. 0 0 50 100 74HC1G14; 74HCT1G14 handbook, halfpage 200 MNA036 average ICC (A) 150 positive-going edge negative-going edge 2.0 4.0 VCC (V) 6.0 Fig.14 Average ICC for HC1G Schmitt-trigger devices; linear change of VI between 0.1VCC to 0.9VCC. handbook, halfpage 200 average ICC (A) 150 MNA058 handbook, halfpage R positive-going edge 100 C MNA035 50 negative-going edge 0 0 2 4 VCC (V) 6 1 1 For HC1G: f = -- ---------------------T 0.8 x RC 1 1 For HCT1G: f = -- -------------------------T 0.67 x RC Fig.15 Average ICC for HCT1G Schmitt-trigger devices; linear change of VI between 0.1VCC to 0.9VCC. Fig.16 Relaxation oscillator using the HC1G/HCT1G14. 1998 Aug 05 11 Philips Semiconductors Product specification Inverting Schmitt-trigger PACKAGE OUTLINE Plastic surface mounted package; 5 leads 74HC1G14; 74HCT1G14 SOT353 D B E A X y HE vMA 5 4 Q A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E (2) 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT353 REFERENCES IEC JEDEC EIAJ SC-88A EUROPEAN PROJECTION ISSUE DATE 97-02-28 1998 Aug 05 12 Philips Semiconductors Product specification Inverting Schmitt-trigger SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering 74HC1G14; 74HCT1G14 Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 1998 Aug 05 13 Philips Semiconductors Product specification Inverting Schmitt-trigger DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values 74HC1G14; 74HCT1G14 This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Aug 05 14 Philips Semiconductors Product specification Inverting Schmitt-trigger NOTES 74HC1G14; 74HCT1G14 1998 Aug 05 15 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. 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No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Internet: http://www.semiconductors.philips.com For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998 SCA60 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 245106/00/01/pp16 Date of release: 1998 Aug 05 Document order number: 9397 750 03652 |
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