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| HT23C040H CMOS 512K8-Bit High Speed Mask ROM Features * Operating voltage: 2.7V~5.5V * Low power consumption - Operation: 25mA max. (VCC=5V) * 512K8-bit of mask ROM * Mask option: chip enable CE/CE, and output enable OE/OE/NC * TTL compatible inputs and outputs * Tristate outputs * Fully static operation * 32-pin DIP/SOP package 10mA max. (VCC=3V) - Standby: 60mA max. (VCC=5V) 20mA max. (VCC=3V) * Access time: 90ns max. (VCC=5V) 250ns max. (VCC=3V) General Description The HT23C040H is a read-only memory with high performance CMOS storage device whose 4096K of memory is arranged into 512K word by 8 bits. For application flexibility, the chip enable and output enable control pins can be selected as active high or active low. This flexibility not only allows easy interface with most microprocessors, but also eliminates bus contention in multiple bus microprocessor systems. An additional feature of the HT23C040H is its ability to enter the standby mode whenever the chip enable (CE/CE) is inactive, thus reducing current consumption to below 60mA. The combination of these functions makes the chip suitable for high density low power memory applications. Block Diagram P re -c h a rg e C K T A0 XY P re -d e c o d e r A d d re s s B u ffe rs A18 ATD X -D e c Y -D e c P u ll- h ig h N M O S R O M C e ll A rra y ( 5 1 2 K 8 - B its ) Z -D e c Z - s e le c to r S e n s e A m p lifie r s C E /C E O E /O E /N C M ux CTRL L a tc h M ux O u tp u t B u ffe rs VSS VCC D0 D7 Rev. 1.00 1 August 15, 2002 HT23C040H Pin Assignment NC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 D0 D1 D2 VSS 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC A18 A17 A14 A13 A8 A9 A11 O E /O E /N C A10 C E /C E D7 D6 D5 D4 D3 H T23C 040H 3 2 D IP -A /S O P -A Pin Description Pin Name NC A0~A18 D0~D7 VSS CE/CE OE/OE/NC VCC I/O 3/4 I O 3/4 I I 3/4 No connection Address inputs Data outputs Negative power supply, ground Chip enable/Output enable input Output enable input Positive power supply Description Absolute Maximum Ratings Supply Voltage ............................................-0.3V to 6V Input Voltage....................................-0.3V to VCC+0.3V Storage Temperature ............................-50C to 125C Operating Temperature...........................-40C to 85C Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Rev. 1.00 2 August 15, 2002 HT23C040H D.C. Characteristics Symbol Parameter Test Conditions VCC 3/4 5V 5V 5V 5V 5V 5V 5V 5V 5V 3/4 3/4 3/4 3V 3V 3V 3V 3V 3V 3V 3/4 3/4 Conditions Min. Typ. Ta=-40C to 85C Max. Unit Supply voltage: 4.5V~5.5V VCC ICC1 VIL1 VIH1 VOL1 VOH1 ILI ILO ISTB1 ISTB2 CIN COUT Operating Voltage Operating Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Input Leakage Current Output Leakage Current Standby Current Standby Current Input Capacitance (See note) Output Capacitance (See note) 3/4 O/P No load, f=5MHz 3/4 3/4 IOL=3.2mA IOH=-1mA VIN=0 to VCC VOUT=0 to VCC CE=VIL, CE=VIH CE0.2V CEVCC-0.2V f=1MHz f=1MHz 4.5 3/4 VSS 2.2 3/4 2.4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 O/P No load, f=5MHz 3/4 3/4 IOL=2mA IOH=-0.6mA VIN=0 to VCC VOUT=0 to VCC f=1MHz f=1MHz 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 5.5 25 0.8 VCC 0.4 VCC 10 10 1.5 60 10 10 V mA V V V V mA mA mA mA pF pF Supply voltage: 2.7V~3.3V VCC ICC2 VIL2 VIH2 VOL2 VOH2 ILI ILO CIN COUT Operating Voltage Operating Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Input Leakage Current Output Leakage Current Input Capacitance (See Note) Output Capacitance (See Note) 2.7 3/4 VSS 1.5 3/4 1.5 3/4 3/4 3/4 3/4 3.3 10 0.4 VCC 0.4 VCC 10 10 10 10 V mA V V V V mA mA pF pF Note: These parameters are periodically sampled but not 100% tested. A.C. Characteristics Symbol tCYC tAA tACE tAOE tOH tOD tOE Cycle Time Address Access Time Chip Enable Access Time Output Enable Access Time Output Hold Time Output Disable Time (See Note) Output Enable Time (See Note) Parameter 3V10% Min. 200 3/4 3/4 3/4 3/4 3/4 3/4 Max. 3/4 250 250 150 3/4 3/4 3/4 Min. 90 3/4 3/4 3/4 7.5 3/4 7.5 Ta=-40C to 85C 5V10% Max. 3/4 90 90 60 3/4 60 3/4 Unit ns ns ns ns ns ns ns Note: These parameters are periodically sampled but not 100% tested. Rev. 1.00 3 August 15, 2002 HT23C040H A.C. test condition V CC Output load: see figure right Input rise and fall time: 10ns Input pulse levels: 0.4V to 2.4V Input and output timing reference levels: 0.8V and 2.0V (VCC=5V) 1.5V (VCC=3V) O u tp u t 775W 100p.* 1250W * In c lu d in g s c o p e a n d jig Output load circuit Functional Description The HT23C040H has two modes, namely data read mode and standby mode, controlled by CE/CE and OE/OE/NC inputs. * Standby mode * Data read mode The HT23C040H offers lower current consumption, controlled by the chip enable input (CE/CE). When a low/high level is applied to the CE/CE input regardless of the output enable (OE/OE/NC) states the chip will enter the standby mode. When both the chip enable (CE/CE) and the output enable (OE/OE/NC) are active, the chip is in data read mode. Otherwise, active CE/CE and inactive OE/OE/NC result in deselect mode. The output will remain in Hi-Z state. Operation truth table Mode Read Deselect Standby Note: H=VIH, L=VIL, X=VIH or VIL CE/CE H/L H/L L/H OE/OE H/L L/H X A0~A18 Valid X X D0~D7 Data Out High Z High Z Timing Diagrams * Propagation delay due to address (CE/CE and OE/OE are active) tC A d d re s s tA A YC V a lid tO H D out V a lid * Propagation delay due to chip and output enable (address valid) tA CE CE tA OE OE tO E OE CE tO D D out V a lid Rev. 1.00 4 August 15, 2002 HT23C040H Package Information 32-pin DIP (600mil) outline dimensions A 32 B 1 16 17 H C D E . G = I Symbol A B C D E F G H I a Dimensions in mil Min. 1635 535 145 125 16 50 3/4 595 635 0 Nom. 3/4 3/4 3/4 3/4 3/4 3/4 100 3/4 3/4 3/4 Max. 1665 555 155 145 20 70 3/4 615 670 15 Rev. 1.00 5 August 15, 2002 HT23C040H 32-pin SOP (450mil) outline dimensions 32 A 17 B 1 16 C C' G H D E . = Symbol A B C C D E F G H a Dimensions in mil Min. 543 440 14 3/4 100 3/4 4 32 4 0 Nom. 3/4 3/4 3/4 3/4 3/4 50 3/4 3/4 3/4 3/4 Max. 557 450 20 817 112 3/4 3/4 38 12 10 Rev. 1.00 6 August 15, 2002 HT23C040H Product Tape and Reel Specifications Reel dimensions T2 D A B C T1 SOP 32W Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 3301.0 1000.1 13.0+0.5 -0.2 2.00.5 32.8+0.3 -0.2 38.2+0.2 Rev. 1.00 7 August 15, 2002 HT23C040H Carrier tape dimensions D E . P0 P1 t W C B0 D1 P K2 A0 K1 SOP 32W Symbol W P E F D D1 P0 P1 A0 B0 K1 K2 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 32.0+0.3 -0.1 16.00.1 1.750.1 14.20.1 1.55+0.1 2.0+0.25 4.00.1 2.00.1 14.70.1 20.90.1 3.00.1 3.40.1 0.350.05 25.5 Rev. 1.00 8 August 15, 2002 HT23C040H Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science-based Industrial Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Sales Office) 11F, No.576, Sec.7 Chung Hsiao E. Rd., Taipei, Taiwan Tel: 886-2-2782-9635 Fax: 886-2-2782-9636 Fax: 886-2-2782-7128 (International sales hotline) Holtek Semiconductor (Shanghai) Inc. 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor (Hong Kong) Ltd. Block A, 3/F, Tin On Industrial Building, 777-779 Cheung Sha Wan Rd., Kowloon, Hong Kong Tel: 852-2-745-8288 Fax: 852-2-742-8657 Holmate Semiconductor, Inc. 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright O 2002 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 9 August 15, 2002 |
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