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| MBR0540T1, MBR0540T3 Surface Mount Schottky Power Rectifier SOD-123 Power Surface Mount Package The Schottky Power Rectifier employs the Schottky Barrier principle with a barrier metal that produces optimal forward voltage drop-reverse current tradeoff. Ideally suited for low voltage, high frequency rectification, or as a free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. This package provides an alternative to the leadless 34 MELF style package. Features http://onsemi.com SCHOTTKY BARRIER RECTIFIER 0.5 AMPERES, 40 VOLTS * * * * * * * * * * * * * Guardring for Stress Protection Very Low Forward Voltage Epoxy Meets UL 94 V-0 @ 0.125 in Package Designed for Optimal Automated Board Assembly Pb-Free Packages are Available Mechanical Characteristics SOD-123 CASE 425 STYLE 1 Reel Options: 3,000 per 7 inch reel/8 mm tape Reel Options: 10,000 per 13 inch reel/8 mm tape Device Marking: B4 Polarity Designator: Cathode Band Weight: 11.7 mg (approximately) Case: Epoxy Molded Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C max. for 10 Seconds MARKING DIAGRAM B4 M B4 M = Device Code = Date Code ORDERING INFORMATION Device MBR0540T1 MBR0540T1G MBR0540T3 MBR0540T3G Package SOD-123 SOD-123 (Pb-Free) SOD-123 SOD-123 (Pb-Free) Shipping 3000/Tape & Reel 3000/Tape & Reel 10,000/Tape & Reel 10,000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2005 1 March, 2005 - Rev. 5 Publication Order Number: MBR0540T1/D MBR0540T1, MBR0540T3 MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 115C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 115C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Range Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25C) Symbol VRRM VRWM VR IO IFRM IFSM Value 40 Unit V 0.5 1.0 5.5 A A A Tstg, TC TJ dv/dt -55 to +150 -55 to +150 1000 C C V/ms Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Rating Thermal Resistance - Junction-to-Lead (Note 1) Thermal Resistance - Junction-to-Ambient (Note 2) Symbol Rtjl Rtja Value 118 206 Unit C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3) (iF = 0.5 A) (iF = 1 A) Maximum Instantaneous Reverse Current (Note 3) (VR = 40 V) (VR = 20 V) 1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 X 0.5 inch for each lead) on FR4 board. 3. Pulse Test: Pulse Width 250 ms, Duty Cycle 2.0%. IR vF TJ = 25C 0.51 0.62 TJ = 25C 20 10 TJ = 100C 0.46 0.61 TJ = 100C 13,000 5,000 mA V http://onsemi.com 2 MBR0540T1, MBR0540T3 i F, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 100 10 25C 1.0 TJ = 125C TJ = -40C TJ = 25C TJ = 100C 0.1 0.2 0.4 0.6 0.8 1.0 1.2 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 1.0 TJ = 125C TJ = 100C TJ = 25C 0.2 0.4 0.6 0.8 1.0 1.2 0.1 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage I R, MAXIMUM REVERSE CURRENT (AMPS) 100E-3 I R, REVERSE CURRENT (AMPS) 10E-3 TJ = 125C 100E-3 10E-3 1.0E-3 TJ = 125C 1.0E-3 TJ = 100C 100E-6 TJ = 100C 10E-6 TJ = 25C 0 10 20 30 40 100E-6 10E-6 1.0E-6 TJ = 25C 1.0E-6 100E-9 100E-9 0 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 3 MBR0540T1, MBR0540T3 dc 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 100 120 140 SQUARE WAVE Ipk/Io = p Ipk/Io = 5 Ipk/Io = 10 Ipk/Io = 20 FREQ = 20 kHz PFO , AVERAGE POWER DISSIPATION (WATTS) I O , AVERAGE FORWARD CURRENT (AMPS) 0.8 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 IO, AVERAGE FORWARD CURRENT (AMPS) Ipk/Io = 10 Ipk/Io = 20 Ipk/Io = 5 SQUARE WAVE Ipk/Io = p dc TL, LEAD TEMPERATURE (C) Figure 5. Current Derating Figure 6. Forward Power Dissipation TJ , DERATED OPERATING TEMPERATURE ( C) 100 TJ = 25C C, CAPACITANCE (pF) 126 124 122 120 118 116 114 112 110 0 5.0 10 15 20 25 30 149C/W 180C/W 206C/W 228C/W 35 40 Rtja = 118C/W 10 0 5.0 10 15 20 25 30 35 40 VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS) Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating* * Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ = TJmax - r(t)(Pf + Pr) where TJ may be calculated from the equation: r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax - r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. http://onsemi.com 4 MBR0540T1, MBR0540T3 R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1E+00 50% 20% 1E-01 10% 5.0% 2.0% 1.0% 1E-02 Rtjl(t) = Rtjl*r(t) 1E-03 0.00001 0.0001 0.001 0.01 0.1 T, TIME (s) 1.0 10 100 1,000 Figure 9. Thermal Response Junction to Lead R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1E+00 50% 1E-01 20% 10% 5.0% 2.0% 1E-02 1.0% Rtjl(t) = Rtjl*r(t) 1E-03 0.00001 0.0001 0.001 0.01 0.1 T, TIME (s) 1.0 10 100 1,000 Figure 10. Thermal Response Junction to Ambient http://onsemi.com 5 MBR0540T1, MBR0540T3 PACKAGE DIMENSIONS SOD-123 PLASTIC CASE 425-04 ISSUE C A C H K 2.36 0.093 4.19 0.165 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 6 EEE EEE EEE EEE EEE EEE AAA AAA AAA 2 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E H J K INCHES MIN MAX 0.055 0.071 0.100 0.112 0.037 0.053 0.020 0.028 0.004 --- 0.000 0.004 --- 0.006 0.140 0.152 MILLIMETERS MIN MAX 1.40 1.80 2.55 2.85 0.95 1.35 0.50 0.70 0.25 --- 0.00 0.10 --- 0.15 3.55 3.85 B E J STYLE 1: PIN 1. CATHODE 2. ANODE D SOLDERING FOOTPRINT* 0.91 0.036 1.22 0.048 SCALE 10:1 mm inches MBR0540T1/D |
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