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FMM5007VF
Ku Band Power Amplifier MMIC
FEATURES High Output Power: 31.0dBm(typ.) High Linear Gain: 20.0dB(typ.) Low Input VSWR Impedance Matched Zin/Zout = 50 Small Hermetic Metal-Ceramic SMT Package(VF-pkg) DESCRIPTION The FMM5007VF is a MMIC amplifier that contains a three-stage amplifier, internally matched, for standard communications in the 14.0 to 14.5GHz frequency range. This product is well suited for VSAT applications as a driver or output stage. Eudyna's stringent Quality Assurance Program assures the highest reliability and consistent performance.
ABSOLUTE MAXIMUM RATING Item Symbol
DC Input Voltage DC Input Voltage Input Power Storage Temperature VDD VGG Pin Tstg
Rating
12 -7 20 -55 to +125
Unit
V V dBm o C
RECOMMENDED OPERATING CONDITION Item Symbol
DC Input Voltage DC Input Voltage Operating Case Temperature VDD VGG Tc
Condition
10 -5 -40 to +85
o
Unit
V V o C
ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25 C) Item
Frequency Output Power at 1dB G.C.P. Linear Gain Gain Flatness Input VSWR Output VSWR Power Monitor ( Rmon=10Kohm ) DC Input Current DC Input Current
G.C.P.:Gain Compresstion Point
Symbol
f P1dB G G VSWRi VSWRo Vmon IDD IGG
Condition
Limit Min. Typ. Max.
14.0 30.0 18.0 31.0 20.0 1.0 2:1 2.3:1 3.5 1000 15 15 1.5 2.3:1 3:1 1200 20
Unit
GHz dBm dB dB V mA mA
VDD=10V VGG=-5V f =14.0-14.5GHz
Pout=30dBm VDD=10V VGG=-5V
ESD
Class 0
~ 199V
Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5k )
CASE STYLE
VF
Edition 2.0 September 2004
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FMM5007VF
Ku band Power Amplifier MMIC
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FMM5007VF
Ku Band Power Amplifier MMIC
S-PARAMETER
INPUT/OUTPUT RETURN LOSS vs. FREQUENCY Vdd=10V, Vgg=-5V
0 Input/Output Return Loss [dB] -5 30
SMALL SIGNAL GAIN vs. FREQUENCY Vdd=10V, Vgg=-5V
-
Input Return Loss Output Return Loss
Small Signal Gain [dB] 25
-10 -15 -20
20 15 10
-25 -30 13.6
5 0 13.6
13.8
14.0
14.2
14.4
14.6
14.8
13.8
14.0
14.2
14.4
14.6
14.8
Frequency [GHz]
Frequency [GHz]
VDD=10V, VGG=-5V Frequency [ MHz ] 13800 13900 14000 14100 14200 14300 14400 14500 14600 14700 S11 MAG 0.081 0.066 0.053 0.052 0.052 0.069 0.090 0.119 0.161 0.201 ANG 150.5 144.4 141.5 152.1 163.7 177.3 178.7 -178.1 178.0 173.7 MAG 10.412 10.869 10.443 10.511 10.387 10.078 9.953 9.496 9.486 8.887 S21 ANG 78.2 55.9 46.5 26.7 14.9 -2.6 -15.6 -30.3 -45.6 -59.6 MAG 0.004 0.004 0.009 0.008 0.005 0.005 0.004 0.006 0.001 0.001 S12 ANG -109.4 -165.3 -163.0 -128.8 171.8 -123.7 -90.4 -160.1 -164.1 -104.3 MAG 0.400 0.377 0.359 0.328 0.316 0.299 0.281 0.259 0.232 0.213 S22 ANG -45.0 -44.4 -44.8 -43.6 -45.2 -43.5 -43.6 -42.8 -42.5 -37.6
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FMM5007VF
Ku band Power Amplifier MMIC
Package Outline
PIN ASSIGMENT 1 : VDD 2 : RF in 3 : VGG 4 : Pmon 5 : RF out 6 : VDD
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FMM5007VF
Ku Band Power Amplifier MMIC
Mounting Instructions for VF Package
1. Screw Mounting (1) The flange of package may be attached using screws. Torque conditions are shown in table 1. Table 1. Recommended and Maximum Torque for Screw Mounting Package VF Recommended screw M2.0 Recommended Torque 10 N-cm (0.9 lb-in) Maximum Torque 15 N-cm (1.3 lb-in)
(2) First, tighten the screws with a torque driver set to 5 N-cm. (3) The surface finish of the heat sink should be better than 0.8 m, and the surface flatness must be better than 10 m. (4) Silicon based heat sink compounds should not be used for the thermal conductive grease. They cause poor grounding of the source flange, contamination and long term degradation of thermal resistance between the FET package and heat sink. 2. Solder Mounting (1) Recommended solder are Tin-Lead solder (63Sn/37Pb), Lead-Free solder (Sn3.0Ag-0.5Cu)*1 or equivalent. (2) For soldering, Tin-Lead solder (63Sn/37Pb) or Lead-Free solder (Sn-3.0Ag0.5Cu)*1 shall be used. (*1: The figure displays with weight %. A predominantly tin-rich alloy with 3.0% silver and 0.5% copper.) (3) Recommended Flux is Rosin type with chlorine content: 0.2% or less and a low halogen content. After soldering, the flux residue should be removed by appropriate cleaning methods. (4) The recommended soldering conditions are as follows: Partial heating method (soldering iron, spot laser/air) Product terminal temperature: 260 deg-C, max. 10 s./terminal or 400 deg-C, max. 3 s./terminal
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FMM5007VF
Ku band Power Amplifier MMIC
Recommended Bias Circuit and Internal Block Diagram
PIN ASSIGMENT 1 : VDD 2 : RF in 3 : VGG 4 : Pmon 5 : RF out 6 : VDD
Note 1: The capacitors are recommended on the bias supply line, close to the package, in order to prevent video oscillations which could damage the module. Note 2: Two pins of VDD are internally connected respectively. Note 3: The external resistor ( 10Kohm ) on the board is necessary to monitor the output power.
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FMM5007VF
Ku Band Power Amplifier MMIC
For further information please contact :
Eudyna Devices USA Inc. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: (408) 232-9500 FAX: (408) 428-9111 www.us.eudyna.com Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888 Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Rm.1101,Ocean Centre, 5 Canton Road Tsim Sha Tsui, Kowloon, Hong kong TEL: +852-2377-0227 FAX: +852-2377-3921 Eudyna Devices Inc. JAPANESE SALES OFFICE(Head Office) 1, Kanai-cho, Sakae-ku, Yokohama, 244-0845, Japan Tel: +81-45-853-8150 Fax: +81-45-853-8170 www.eudyna.com
Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: Do not put these products into the mouth. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or swallowed. Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures.
Eudyna Devices Incorporated reserves the right to change products and specifications without notice. The information does not convey any license under rights of Eudyna Devices Incorporated or others.
(c) 2004 Eudyna Devices USA Inc. Printed in U.S.A.
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