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| (R) STPS3150/U POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS s 3A 150 V 175C 0.66 V DO-201AD STPS3150 s s NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP FOR HIGHER EFFICIENCY AND EXTENDED BATTERY LIFE LOW THERMAL RESISTANCE DESCRIPTION 150V Power Schottky rectifier are suited for switch Mode Power Supplies on up to 24V rails and high frequency converters. Packaged in SMB and Axial, this device is intended for use in consumer & computer applications like TV, STB, PC and DVD where low drop forward voltage in required to reduce power dissipation. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj dV/dt Parameter Repetitive peak reverse voltage RMS forward current Average forward current TL = 130C = 0.5 SMB TL = 140C = 0.5 DO-201AD Surge non repetitive forward current Half wave, single phase, 50Hz Storage temperature range Maximum junction temperature * Critical rate of rise of reverse voltage (rated VR, Tj = 25C) SMB DO-201AD 100 150 - 65 to + 150 175 10000 C C V/s A Value 150 15 3 Unit V A A SMB STPS3150U *: dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/5 April 2003 - Ed: 1A STPS3150/U THERMAL RESISTANCES Symbol Rth(j-l) Parameter Junction to leads Lead length = 10 mm DO-1201AD SMB Value 20 15 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * VF * Parameter Reverse leakage current Forward voltage drop Tests conditions Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 380 s, < 2% To evaluate the maximum conduction losses use the following equation: P = 0.59 x IF(AV) + 0.023 x IF2(RMS) Fig. 1: Conduction losses versus average current. PF(AV)(W) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 2.5 Min. Typ. 0.4 0.6 0.78 0.63 0.85 0.70 Max. 2.0 2.0 0.82 0.67 0.89 0.75 Unit A mA V VR = 150V IF = 3 A IF = 6 A Fig. 2: Average forward current versus ambient temperature ( = 0.5). IF(AV)(A) 3.5 Rth(j-a)=Rth(j-I) DO-201AD = 0.1 = 0.05 = 0.2 = 0.5 3.0 =1 2.5 2.0 1.5 1.0 Rth(j-a)=75C/W SMB T 0.5 T IF(AV)(A) =tp/T 3.0 tp 0.0 3.5 =tp/T 0 25 tp 50 Tamb(C) 75 100 125 150 175 Fig. 3-1: Non repetitive surge peak forward current versus overload duration (maximum values) (SMB). IM(A) 12 11 10 9 8 7 6 5 4 3 2 1 0 1.E-03 1.E-02 1.E-01 1.E+00 IM t Fig. 3-2: Non repetitive surge peak forward current versus overload duration (maximum values) (DO-201AD). IM(A) 14 DO-201AD SMB 12 10 Ta=25C Ta=25C 8 Ta=75C Ta=75C 6 4 IM Ta=125C Ta=125C 2 =0.5 t(s) 0 1.E-03 t =0.5 t(s) 1.E-02 1.E-01 1.E+00 2/5 STPS3150/U Fig. 4-1: Relative variation of thermal impedance junction to ambient versus pulse duration (SMB). Zth(j-c)/Rth(j-c) 1.0 SMB Fig. 4-2: Relative variation of thermal impedance junction to ambient versus pulse duration (DO-201AD). Zth(j-c)/Rth(j-c) 1.0 DO-201AD 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Single pulse = 0.2 = 0.1 = 0.5 0.9 0.8 0.7 0.6 0.5 0.4 = 0.5 T 0.3 0.2 = 0.2 = 0.1 T tp(s) 1.E+00 1.E+01 =tp/T 1.E+02 tp 1.E+03 0.1 Single pulse tp(s) 1.E+01 =tp/T 1.E+02 tp 1.E+03 0.0 1.E-02 1.E-01 0.0 1.E-01 1.E+00 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). IR(A) 1.E+04 Tj=150C Fig. 6: Junction capacitance versus reverse voltage applied (typical values). C(nF) 1000 F=1MHz VOSC=30mVRMS Tj=25C 1.E+03 Tj=125C 1.E+02 Tj=100C 1.E+01 Tj=75C 100 1.E+00 Tj=50C 1.E-01 Tj=25C VR(V) 1.E-02 0 25 50 75 100 125 150 VR(V) 10 1 10 100 1000 Fig. 7: Forward voltage drop versus forward current. IFM(A) 100 Tj=125C (maximum values) Fig. 8: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, Cu: 35m) (SMB). Rth(j-a)(C/W) 110 100 90 SMB Tj=125C (typical values) Tj=25C (maximum values) 80 70 60 10 50 40 30 20 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 10 0 0.0 0.5 1.0 1.5 2.0 S(cm) 2.5 3.0 3.5 4.0 4.5 5.0 3/5 STPS3150/U Fig. 9: Thermal resistance versus lead length (DO-201AD). Rth(C/W) 90 DO-201AD 80 70 60 50 40 30 20 10 0 5 10 Rth(j-a) Rth(j-I) Lleads(mm) 15 20 25 PACKAGE MECHANICAL DATA SMB DIMENSIONS E1 REF. Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 E c A1 E E1 b C L A2 D FOOT PRINT DIMENSIONS (in millimeters) 2.3 1.52 2.75 1.52 4/5 STPS3150/U PACKAGE MECHANICAL DATA DO-201AD plastic B A B OC note 1 E E note 1 OD OD note 2 DIMENSIONS REF. A B C D E 25.40 5.30 1.30 1.25 Millimeters Min. Max. 9.50 Inches Min. 1.000 0.209 0.051 0.049 NOTES 1 - The lead diameter D is not controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15 mm) Max. 0.374 Ordering type STPS3150 STPS3150RL STPS3150U s Marking STPS3150 STPS3150 G315 Package DO-201AD DO-201AD SMB Weight 1.12 g 1.12 g 0.107 g Base qty 600 1900 2500 Delivery mode Ammopack Tape & Reel Tape & Reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5 |
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