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| (R) STTH30L06 TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER Table 1: Main Product Characteristics IF(AV) VRRM Tj VF (typ) trr (max) FEATURES AND BENEFITS 30 A 600 V 175C 1.0 V 65 ns K A K A TO-220AC STTH30L06D DO-247 STTH30L06W Ultrafast switching Low reverse current Low thermal resistance Reduces switching & conduction losses A A K A K DESCRIPTION The STTH30L06, which is using ST Turbo 2 600V technology, is specially suited for use in switching power supplies, and industrial applications, as rectification and discontinuous mode PFC boost diode. D2PAK STTH30L06G SOD-93 STTH30L06P A K DOP3I STTH30L06PI Table 2: Order Codes Part Number STTH30L06D STTH30L06G STTH30L06G-TR STTH30L06W STTH30L06P STTH30L06PI Marking STTH30L06D STTH30L06G STTH30L06G STTH30L06W STTH30L06P STTH30L06PI January 2006 REV. 3 1/9 STTH30L06 Table 3: Absolute Ratings (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj RMS forward voltage TO-220AC / TO-247 Average forward current / D2PAK / SOT-93 DOP3I Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 125C Tc = 95C = 0.5 = 0.5 160 -65 to + 175 175 A C C Parameter Repetitive peak reverse voltage Value 600 50 30 Unit V A A tp = 10ms sinusoidal Table 4: Thermal Resistance Symbol Rth(j-c) Junction to case Parameter TO-220AC / TO-247 / D2PAK / SOT-93 DOP3I Value (max). 1.1 1.7 Unit C/W Table 5: Static Electrical Characteristics Symbol IR * Parameter Test conditions VR = VRRM 80 IF = 30A 1.0 Min. Typ Max. 25 800 1.55 1.25 V Unit A Reverse leakage current Tj = 25C Tj = 150C VF ** Forward voltage drop Tj = 25C Tj = 150C Pulse test: * tp = 5 ms, < 2% ** tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.95 x IF(AV) + 0.010 IF (RMS) 2 Table 6: Dynamic Characteristics Symbol trr Parameter Reverse recovery time Reverse recovery current Forward recovery time Forward recovery voltage Tj = 25C Test conditions IF = 0.5A Irr = 0.25A IR =1A IF = 1A dIF/dt = 50 A/s VR =30V Tj = 125C IF = 30A VR = 400V dIF/dt = 100 A/s Tj = 25C Tj = 25C IF = 30A dIF/dt = 100 A/s VFR = 1.1 x VFmax IF = 30A dIF/dt = 100 A/s VFR = 1.1 x VFmax 2.5 65 11.5 Min. Typ Max. Unit 65 90 16 500 A ns V ns IRM tfr VFP 2/9 STTH30L06 Figure 1: Conduction losses versus average forward current P(W) 50 45 40 35 30 25 20 15 10 5 0 0 5 10 15 20 25 30 35 40 100 Figure 2: Forward voltage drop versus forward current IFM(A) = 0.5 = 0.2 = 0.1 = 0.05 =1 90 80 70 60 50 40 Tj=150C (typical values) Tj=150C (maximum values) Tj=25C (maximum values) T 30 20 IF(AV)(A) =tp/T tp 10 0 0.00 0.25 0.50 0.75 1.00 1.25 VFM(V) 1.50 1.75 2.00 2.25 2.50 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 Figure 4: Peak reverse recovery current versus dI F /dt (typical values) IRM(A) 45 40 35 IF=IF(AV) VR=400V Tj=125C IF=2 x IF(AV) 30 IF=0.5 x IF(AV) 25 0.5 20 0.4 0.3 0.2 Single pulse 15 10 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 1.E+00 5 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 Figure 5: Reverse recovery time versus dIF/dt (typical values) trr(ns) 800 750 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 0 50 Figure 6: Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) 3500 VR=400V Tj=125C VR=400V Tj=125C 3000 2500 IF=2 x IF(AV) IF=2 x IF(AV) 2000 IF=IF(AV) IF=0.5 x IF(AV) IF=IF(AV) 1500 1000 500 IF=0.5 x IF(AV) dIF/dt(A/s) 0 100 150 200 250 300 350 400 450 500 0 100 dIF/dt(A/s) 200 300 400 500 3/9 STTH30L06 Figure 7: Reverse recovery softness factor versus dIF/dt (typical values) S factor 1.6 1.4 1.2 1.0 1.0 0.8 0.6 0.4 0.2 0.8 QRR IF< 2 x IF(AV) VR=400V Tj=125C Figure 8: Relative variations of dynamic parameters versus junction temperature 1.4 S factor 1.2 0.6 0.4 0.2 trr IRM IF=IF(AV) VR=400V Reference: Tj=125C dIF/dt(A/s) 0.0 0 50 100 150 200 250 300 350 400 450 500 0.0 25 50 Tj(C) 75 100 125 Figure 9: Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 10 9 8 7 6 5 4 3 2 1 0 0 50 100 150 200 250 300 350 400 450 500 IF=IF(AV) Tj=125C Figure 10: Forward recovery time versus dIF/dt (typical values) tfr(ns) 500 450 400 350 300 250 200 150 100 IF=IF(AV) VFR=1.1 x VF max. Tj=125C dIF/dt(A/s) 50 0 0 100 dIF/dt(A/s) 200 300 400 500 Figure 11: Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C Figure 12: Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4, eCU=35m) (D2PAK) Rth(j-a)(C/W) 80 70 60 50 100 40 30 20 10 VR(V) 10 1 10 100 1000 SCU(cm) 0 0 5 10 15 20 25 30 35 40 4/9 STTH30L06 Figure 13: D2PAK Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.14 1.70 0.045 0.067 0.45 0.60 0.017 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 10.00 10.40 0.393 0.409 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 2.40 3.20 0.094 0.126 0.40 typ. 0.016 typ. 0 8 0 8 REF. A E L2 C2 D L L3 A1 B2 B G A2 C R M * V2 * FLAT ZONE NO LESSTHAN 2mm A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 Figure 14: D2PAK Foot Print Dimensions (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 5/9 STTH30L06 Figure 15: DO-247 Package Mechanical Data DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F2 2.00 0.078 F3 2.00 2.40 0.078 0.094 G 10.90 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 L2 18.50 0.728 L3 14.20 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5 5 V2 60 60 Dia. 3.55 3.65 0.139 0.143 V V Dia. H A L5 L L2 L4 F2 L3 F3 V2 F G M E L1 D Figure 16: SOD-93 Package Mechanical Data REF. A C D D1 E F F3 G H L L2 L3 L5 L6 O DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.70 4.90 0.185 0.193 1.17 1.37 0.046 0.054 2.50 Typ. 0.098 Typ. 1.27 Typ. 0.050 Typ. 0.50 0.78 0.020 0.031 1.10 1.30 0.043 0.051 1.75 Typ. 0.069 Typ 10.80 11.10 0.425 0.437 14.70 15.20 0.578 0.598 12.20 0.480 16.20 0.638 18.0 Typ 0.709 Typ. 3.95 4.15 0.156 0.163 31.00 Typ. 1.220 Typ. 4.00 4.10 0.157 0.161 6/9 STTH30L06 Figure 17: SOD-93 Package Mechanical Data DIMENSIONS REF. A B C D E F G H K L N P R Millimeters Min. 4.4 1.45 14.35 0.5 2.7 15.8 20.4 15.1 3.4 4.08 10.8 1.20 Max. 4.6 1.55 15.60 0.7 2.9 16.5 21.1 15.5 3.65 4.17 11.3 1.40 Inches Min. 0.173 0.057 0.565 0.020 0.106 0.622 0.815 0.594 0.134 0.161 0.425 0.047 Max. 0.181 0.061 0.614 0.028 0.114 0.650 0.831 0.610 0.144 0.164 0.444 0.055 4.60 typ. 0.181 typ. 7/9 STTH30L06 Figure 18: TO-220AC Package Mechanical Data REF. H2 C L5 OI L6 L2 D L7 A L9 F1 L4 F G M E A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 10.00 10.40 0.393 0.409 16.40 typ. 0.645 typ. 13.00 14.00 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 Table 7: Ordering Information Ordering type STTH30L06D STTH30L06G STTH30L06G-TR STTH30L06W STTH30L06P STTH30L06P Marking STTH30L06D STTH30L06G STTH30L06G STTH30L06W STTH30L06P STTH30L06P Package TO-220AC D PAK D PAK DO-247 SOD-93 DOP3I 2 2 Weight 1.90 g 1.48 g 1.48 g 4.40 g 3.79 g 4.46 g Base qty 50 50 1000 30 30 30 Delivery mode Tube Tube Tape & reel Tube Tube Tube Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 m.N. (TO-220FPAC) / 0.55 m.N. (TO-220AC) Maximum torque value: 1.0 m.N. (TO-220FPAC) / 0.70 m.N. (TO-220AC) Table 8: Revision History Date 07-Sep-2004 21-Oct-2004 11-Jan-06 Revision 1 2 3 First issue. DOP3I package added. Table 3 on page 2: . IF(RMS) corrected from 30A to 50A . IF(AV) corrected from 50A to 30A Description of Changes 8/9 STTH30L06 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9 |
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