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INTEGRATED CIRCUITS
DATA SHEET
TDA8928J Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
Preliminary specification Supersedes data of 2004 Feb 04 2004 May 05
Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.2.1 8.2.2 9 10 11 12 13 14 FEATURES APPLICATIONS GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Power stage Protection Maximum temperature Maximum current LIMITING VALUES THERMAL CHARACTERISTICS QUALITY SPECIFICATION DC CHARACTERISTICS AC CHARACTERISTICS SWITCHING CHARACTERISTICS 18 19 20 15 15.1 15.2 15.3 15.4 15.4.1 15.4.2 15.5 16 17 17.1 17.2 17.3 17.4
TDA8928J
TEST AND APPLICATION INFORMATION SE application Package ground connection Output power Reference design Printed-circuit board Bill of materials Curves measured in reference design PACKAGE OUTLINE SOLDERING Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
1 FEATURES 3 GENERAL DESCRIPTION
TDA8928J
* High efficiency (> 90 %) * Supply voltage from 7.5 V to 30 V * Very low quiescent current * High output power * Diagnostic output * Usable as a stereo Single-Ended (SE) amplifier * Electrostatic discharge protection (pin to pin) * No heatsink required. 2 APPLICATIONS
The TDA8928J is a switching power stage for a high efficiency class-D audio power amplifier system. With this power stage a compact 2 x 10 W self oscillating digital amplifier system can be built, operating with high efficiency and very low dissipation. No heatsink is required. The system operates over a wide supply voltage range from 7.5 V up to 30 V and consumes a very low quiescent current.
* Television sets * Home-sound sets * Multimedia systems * All mains fed audio systems. 4 QUICK REFERENCE DATA SYMBOL General VP Iq(tot) Po supply voltage total quiescent current efficiency no load connected; VP = 12.5 V Po = 10 W; RL = 8 ; VP = 12.5 V RL = 8 ; THD = 10 %; VP = 12.5 V 7.5 - - 9 12.5 25 90 30 45 - - - V mA % PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Stereo single-ended configuration output power 10 5 W W RL = 16 ; THD = 10 %; VP = 12.5 V - 5 ORDERING INFORMATION TYPE NUMBER TDA8928J TDA8928ST PACKAGE NAME DBS17P RDBS17P DESCRIPTION plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) plastic rectangular DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) VERSION SOT243-3 SOT577-2
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
6 BLOCK DIAGRAM
TDA8928J
handbook, full pagewidth
VDD2 VDD1 13 5 6 DRIVER HIGH 7 DRIVER LOW VSS1 VDD2 12 DRIVER HIGH 11 DRIVER LOW 8 10
MGX377
TDA8928J
4 1 2 9 3 15 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp CONTROL AND HANDSHAKE
BOOT1
EN1 SW1 REL1 STAB DIAG POWERUP
OUT1
BOOT2
EN2 SW2 REL2
14 17 16 CONTROL AND HANDSHAKE
OUT2
VSS1 VSS2
Fig.1 Block diagram.
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
7 PINNING SYMBOL SW1 REL1 DIAG PIN 1 2 3 DESCRIPTION digital switch input; channel 1 digital control output; channel 1 digital open-drain output for overtemperature and overcurrent report digital enable input; channel 1 positive power supply; channel 1 bootstrap capacitor; channel 1 PWM output; channel 1 negative power supply; channel 1 decoupling internal stabilizer for logic supply negative power supply; channel 2 PWM output; channel 2 bootstrap capacitor; channel 2 positive power supply; channel 2 digital enable input; channel 2 enable input for switching on internal reference sources digital control output; channel 2 digital switch input; channel 2
REL2 16 SW2 17
MGX378
TDA8928J
handbook, halfpage
SW1 REL1 DIAG EN1 VDD1 BOOT1 OUT1 VSS1 STAB
1 2 3 4 5 6 7 8 9
EN1 VDD1 BOOT1 OUT1 VSS1 STAB VSS2 OUT2 BOOT2 VDD2 EN2 POWERUP REL2 SW2
4 5 6 7 8 9 10 11 12 13 14 15 16 17
TDA8928J
VSS2 10 OUT2 11 BOOT2 12 VDD2 13 EN2 14 POWERUP 15
Fig.2 Pin configuration.
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
8 FUNCTIONAL DESCRIPTION 8.2 Protection
TDA8928J
The TDA8928J is a two-channel audio power amplifier system using class-D technology. The power stage TDA8928J is used for driving the loudspeaker load. It performs a level shift from the low-power digital PWM signal, at logic levels, to a high-power PWM signal that switches between the main supply lines. A 2nd-order low-pass filter converts the PWM signal into an analog audio signal across the loudspeaker. 8.1 Power stage
Temperature and short-circuit protection sensors are included in the TDA8928J. The diagnostic output is pulled down to VSS in the event that the maximum current or maximum temperature is exceeded. The system shuts itself down when pin DIAG is connected to pins EN1 and EN2. 8.2.1 MAXIMUM TEMPERATURE
The power stage contains high-power DMOS switches, drivers, timing and handshaking between the power switches and some control logic (see Fig.1). The following functions are available: * Switch (pins SW1 and SW2): digital inputs; switching from VSS to VSS + 12 V and driving the power DMOS switches * Release (pins REL1 and REL2): digital outputs; switching from VSS to VSS + 12 V; follow pin SW1 and SW2 with a small delay. Note: for self oscillating applications this pin is not used * Power-up (pin POWERUP): must be connected to a continuous supply voltage of at least VSS + 5 V with respect to VSS * Enable (pins EN1 and EN2): digital inputs; at a level of VSS the power DMOS switches are open and the PWM outputs are floating; at a level of VSS + 12 V the power stage is operational * Diagnostics (pin DIAG): digital open-drain output; pulled down to VSS if the maximum temperature or maximum current is exceeded.
Pin DIAG becomes LOW if the junction temperature (Tj) exceeds 150 C. Pin DIAG becomes HIGH again if Tj is dropped to approximately 130 C, so there is a hysteresis of approximately 20 C. 8.2.2 MAXIMUM CURRENT
When the loudspeaker terminals are short-circuited this will be detected by the current protection. Pin DIAG becomes LOW if the output current exceeds the maximum output current of 2 A. Pin DIAG becomes HIGH again if the output current drops below 2 A. The output current is limited at the maximum current detection level when pin DIAG is connected to pins EN1 and EN2.
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
9 LIMITING VALUES In accordance with the Absolute Maximum Rate System (IEC 60134). SYMBOL VP VP(sc) IORM Tstg Tamb Tvj Vesd(HBM) PARAMETER supply voltage supply voltage for short-circuits across the load repetitive peak current in output pins storage temperature ambient temperature virtual junction temperature electrostatic discharge voltage note 1 (HBM) all pins with respect to VDD (class 1a) all pins with respect to VSS (class 1a) all pins with respect to each other (class 1a) Vesd(MM) electrostatic discharge voltage note 2 (MM) all pins with respect to VDD (class B) all pins with respect to VSS (class B) all pins with respect to each other (class B) Notes 1. Human Body Model (HBM); Rs = 1500 ; C = 100 pF. 2. Machine Model (MM); Rs = 10 ; C = 200 pF; L = 0.75 H. 10 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Rth(j-c) PARAMETER thermal resistance from junction to ambient thermal resistance from junction to case CONDITIONS in free air in free air CONDITIONS - - - -55 -40 - -500 -1500 -1500 MIN.
TDA8928J
MAX. 30 30 2 +150 +85 150 +500 +1500 +1500
UNIT V V A C C C V V V
-250 -250 -250
+250 +250 +250
V V V
VALUE 40 1.5
UNIT K/W K/W
11 QUALITY SPECIFICATION In accordance with "SNW-FQ611" if this device is used as an audio amplifier.
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
12 DC CHARACTERISTICS VP = 12.5 V; Tamb = 25 C; measured in test diagram of Fig.4; unless otherwise specified. SYMBOL Supply VP Iq(tot) supply voltage total quiescent current no load connected outputs floating Internal stabilizer logic supply (pin STAB) VO(STAB) VIH VIL VOH VOL VOL ILO VIH VIL VEN(hys) II(EN) VPOWERUP II(POWERUP) Tdiag Thys stabilizer output voltage referenced to VSS referenced to VSS referenced to VSS referenced to VSS referenced to VSS IDIAG = 1 mA; note 1 no error condition 11.7 13 - - - - - - - 5 4 - - 100 - 20 7.5 - - 12.5 25 5 PARAMETER CONDITIONS MIN. TYP.
TDA8928J
MAX. 30 45 10
UNIT
V mA mA
14.3
V
Switch inputs (pins SW1 and SW2) HIGH-level input voltage LOW-level input voltage 10 0 15 2 V V
Control outputs (pins REL1 and REL2) HIGH-level output voltage LOW-level output voltage 10 0 15 2 V V
Diagnostic output (pin DIAG, open-drain) LOW-level output voltage output leakage current 0 - 9 0 - - referenced to VSS VPOWERUP = 12 V 5 - 150 - 1.0 50 V A V V V A V A C C
Enable inputs (pins EN1 and EN2) HIGH-level input voltage LOW-level input voltage hysteresis voltage input current referenced to VSS referenced to VSS 15 - - 300
Switching-on input (pin POWERUP) operating voltage input current 12 170 - -
Temperature protection temperature activating diagnostic VDIAG = VDIAG(LOW) hysteresis on temperature diagnostic VDIAG = VDIAG(LOW)
Current protection IO(ocpl) Note 1. Temperature sensor or maximum current sensor activated. overcurrent protection level - 2.1 - A
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
13 AC CHARACTERISTICS VP = 12.5 V; Tamb = 25 C; unless otherwise specified. SYMBOL PARAMETER RL = 8 THD = 0.5 % THD = 10 % RL = 16 THD = 0.5 % THD = 10 % THD total harmonic distortion Po = 1 W; note 3 fi = 1 kHz fi = 10 kHz Notes efficiency endstage Po = 2 x 10 W; fi = 1 kHz; note 4 - - - 0.05 0.2 90 - - 4 5 7(2) 9(2) 8 10 CONDITIONS MIN. TYP.
TDA8928J
MAX.
UNIT
Single-ended application; note 1 Po output power - - - - 0.1 - - W W W W % % %
1. VP = 12.5 V; RL = 8 ; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 (series resistance of filter coil); Tamb = 25 C; measured in reference design (SE application) shown in Fig.5; unless otherwise specified. 2. Indirectly measured; based on Rds(on) measurement. 3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 20 kHz (AES 17 brickwall filter). When distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio band. Measured using the typical application circuit, given in Fig.5. 4. Efficiency for power stage.
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
14 SWITCHING CHARACTERISTICS VP = 12.5 V; Tamb = 25 C; measured in Fig.4; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. - - - from pin SW1 (SW2) to pin OUT1 (OUT2) - - - TYP.
TDA8928J
MAX. - - - - 270 0.4
UNIT
PWM outputs (pins OUT1 and OUT2); see Fig.3 tr tf tblank tPD tW(min) Rds(on) rise time fall time blanking time propagation delay minimum pulse width on-resistance of the output transistors 30 30 70 200 220 0.2 ns ns ns ns ns
handbook, full pagewidth
1/f osc VDD PWM output (V) 0V
VSS tr t PD VSTAB VSW (V) VSS tf t blank
VSTAB VREL (V) VSS 100 ns
MGW145
Fig.3 Timing diagram PWM output, switch and release signals.
2004 May 05
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dbook, full pagewidth
2004 May 05
12 k
15 TEST AND APPLICATION INFORMATION
Philips Semiconductors
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
VDD2 13
VDD1 5 6 BOOT1 15 nF 7 OUT1
TDA8928J
EN1 4 SW1 1 REL1 2 STAB 9 DIAG 3 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp CONTROL AND HANDSHAKE DRIVER HIGH
DRIVER LOW VSS1 VDD2 12 DRIVER HIGH 11 DRIVER LOW 8 VSS1 10 VSS2 VOUT2 V BOOT2 15 nF OUT2 VOUT1 V 2VP
11
12 V
POWERUP 15
EN2 14 100 nF SW2 17 REL2 16 V VEN VSW1
12 V 0
CONTROL AND HANDSHAKE
V VREL1 VSTAB
V VDIAG VSW2
12 V 0
V VREL2
MGX379
Preliminary specification
TDA8928J
Fig.4 Test diagram.
Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
15.1 SE application
TDA8928J
For a SE application the application diagram as shown in Fig.5 can be used. 15.2 Package ground connection
The heatsink of the TDA8928J is connected internally to VSS. 15.3 Output power
The output power in SE self oscillating class-D applications can be estimated using the formula 2 RL ------------------------------------------------ x V P ( R L + R ds(on) + R s ) P o(1%) = ---------------------------------------------------------------------2 x RL [ VP ] The maximum current I O(max) = ------------------------------------------- should not exceed 2 A. R L + R ds(on) + R s Where: RL = load impedance Rs = series resistance of filter coil Po(1%) = output power just at clipping. The output power at THD = 10 %: Po(10%) = 1.25 x Po(1%). 15.4 Reference design
The reference design for a self oscillating class-D system for the TDA8928J is shown in Fig.5. The Printed-Circuit Board (PCB) layout is shown in Figs 6, 7 and 8. The bill of materials is given in Section 15.4.2.
2004 May 05
12
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C39 R32 2.2 nF 100 R3 1 k C19 2.2 nF C20 2.2 nF R5 220 k 3 2 U2A 8 LM393 1 4 1 J3 2 C17 100 nF C15 22 F (100 V) S1 power-ON R14 15 k R25 2 k DZ1 36 V Q1 BC848 R16 C38 100 nF 1 k DZ2 3.3 V Q2 BC856 R17 5.6 k C37 220 pF VSSP C6 470 F (35 V) R12 2 k VDDP STAB (U1,9) R34 3.9 k R2 10 k
mgx380
Philips Semiconductors
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
L1 CON1 supply +14.5 V 1 2 3 -14.5 V C1 100 nF C2 100 nF bead C3 470 F (35 V) C4 470 F (35 V) L2 bead R1 10 k VDDP R33 3.9 k R9 1 k C14 22 F (100 V) STAB (U1,9) C16 100 nF R11 2 k 22 F (100 V) C5 470 F (35 V) VSSP VDDP VDDP C28 560 pF C29 560 pF VSSP VDDP
2 J1 1
C10 220 nF R26 0
R19 5.6 VSSP C9 220 nF VDD1 VDD2 13 7 6 OUT1 BOOT1 STAB C24 1 F L3 33 H
C7
C8 220 nF SW1 1 2 15 3 4 14 16 17 8 VSS1 VSSP C11 220 nF 10 5
C34 220 nF R22 22
C12 15 nF C32 470 nF
LS1 8
VSSP VDDP
C40 In1
R7 R10 0 R28 0 R29 0 VSSP U2B LM393 7
R13 15 k R24 R15 10 k VSSP 2 J2 1 0
REL1 POWERUP DIAG EN1 EN2 REL2 SW2
R30 39 k VDDP
13
In2
47 nF 3.9 k
U1 TDA8928J
9
C28 100 nF BOOT2 OUT2 C25 1 F L4 33 H R31
C27 22 F (100 V) VSSP VDDP 39 k
R8
C41
12 11
3.9 k 47 nF R6 220 k C21 2.2 nF C22 2.2 nF R4 1 k C42 R35
VSS2
C35 220 nF R23 22
C13 15 nF C33 470 nF
LS2 8
5
R21 5.6
6
Preliminary specification
C30 560 pF C31 560 pF VSSP
TDA8928J
2.2 nF 150
Fig.5 Single-ended self oscillating class-D system application diagram for TDA8928J.
Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
15.4.1 PRINTED-CIRCUIT BOARD
TDA8928J
The printed-circuit board dimensions are 8.636 x 5.842 cm; single-sided copper of 35 m; silk screen on both sides; 79 holes; 94 components (32 resistors and 41 capacitors).
handbook, full pagewidth
C10 R26
R24 pin 1 C28 R1 R11 R32 C8 C45 R35 C26 R19 C36 C26 R21 R33 C31 R34 C9 R12 C25 R2 C30 C16 R31 R15 C37 R13 U2 R4 R14 Q1 R9 C22 C21 R28 R7 R17 R6 R10 C17 C41 Q2 C1 C2 R8 C40 R16 C24 V GND DD R25 IN2 C38 IN1 R30
C34
C11 R22
C35
R29
R3 C19 C50 R5
R23
+
OUT1 C12
--
OUT2 C13
+
22 V
Bottom silk
MDB615
Fig.6 Printed-circuit board (bottom silk) layout for TDA8928J.
handbook, full pagewidth
Bottom copper
MDB617
Fig.7 Printed-circuit board (bottom copper) layout for TDA8928J.
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
TDA8928J
TDA8928ST
L3 C5 J1 C7 C6 L4 C27 J2
U1 state of D art VP typ +/- 12.5 V 2 x 10 W in 8 single layer demo PCB v2r4 RL 1 2003
DZ1 C4 L2 C32 C33 S1 DZ2 Con3 Con2 Con1 L1 C3
C14
C15 J3
CO2
CO1
VDD
GND
VSS
Out1
Out2
power_on In1 In2
Top silk
mgx381
Fig.8 Printed-circuit board (top silk) layout for TDA8928ST.
15.4.2
BILL OF MATERIALS DESCRIPTION TDA8928ST LM393AD TYPE Philips Semiconductors, SOT577-2 National, SO8 alternatives: TI semiconductors and On semiconductors used as jumper used as jumper, optional COMMENTS
COMPONENT U1 U2
DZ1 DZ2 Q1 Q2 L1, L2 L3, L4 S1 Con1 Con2, Con3 CO1, CO2 J1, J2, J3 Capacitors C37 C28, C29, C30, C31 2004 May 05
36 V Zener diode 3.3 V Zener diode BC848 transistor BC856 transistor bead 33 H coil power-on switch VSS, GND, VDD connector Out2, Out1 connector In1, In2 connector wire
BZX-79C36V, DO-35 BZX-79C3V3, DO-35 NPN, SOT23 PNP, SOT23 Murata BL01RN1-A62 Toko 11RHBP-330M ws PCB switch, SACME 09-03290-01 Augat 5KEV-03 Augat 5KEV-02 Cinch Farnell 152-396 Jumpers, D = 0.5 mm
used as jumper totally shielded optional optional optional optional
220 pF, 50 V 560 pF, 100 V
SMD0805 SMD0805 50 V is OK
15
Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
COMPONENT C19, C20, C21, C22, C39, C42 C12, C13 C40, C41 DESCRIPTION 2.2 nF, 50 V 15 nF, 50 V 47 nF, 50 V SMD0805 SMD0805 SMD1206 SMD0805 SMD1206 MKT SMD1206 Panasonic NHG Series ECA1JHG220 Panasonic M Series ECA1VM471 TYPE
TDA8928J
COMMENTS
C1, C2, C16, C17, 100 nF, 50 V C26, C38 C8, C9, C10, C11, 220 nF, 50 V C34, C35 C32, C33 C24, C25 C7, C14, C15, C27 C3, C4, C5, C6 C18, C23, C36 Resistors R10, R26, R28, R29 R24 R19, R21 R22, R23 R35 R32 R9 R3, R4, R16 R11, R12 R25 R7, R8, R33, R34 R17 R1, R2, R15 R13, R14 R30, R31 R5, R6 R18, R20, R27 0 0 5.6 , 0.25 W 22 , 1 W 150 100 1 k 1 k 2 k 2 k 3.9 k 5.6 k 10 k 15 k 39 k 220 k these resistors have been removed 470 nF, 63 V 1 F, 16 V 22 F, 100 V 470 F, 35 V these capacitors have been removed
C8 to C11 used as jumper
1206 due to supply range 63 V is OK
SMD1206 SMD0805 SMD1206 SMD2512 SMD1206 SMD1206 SMD1206 SMD0805 SMD1206 SMD0805 SMD0805 SMD0805 SMD0805 SMD0805 SMD0805 SMD0805
used as jumpers short-circuited in a new printed-circuit board layout 1206 due to dissipation 2512 due to dissipation used as jumper used as jumper used as jumper used as jumpers
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
15.5 Curves measured in reference design
MGX383
TDA8928J
102 handbook, halfpage THD + N (%) 10
102 handbook, halfpage THD + N (%)
MGX384
10
1
(1)
1
(1)
10-1
(2) (3)
10-1
(2)
10-2
10-2
10-3 10-2
10-1
1
10
Po (W)
102
10-3 10
102
103
104
f i (Hz)
105
2 x 8 SE; VP = 12.5 V. (1) 6 kHz. (2) 1 kHz. (3) 100 Hz.
2 x 8 SE; VP = 12.5 V. (1) Po = 10 W. (2) Po = 1 W.
Fig.9 THD + N as function of output power.
Fig.10 THD + N as function of frequency.
handbook, halfpage
100
MGX385
handbook, halfpage
0
MGX386
(%) 80
SVRR (dB) -10
-20 60 -30 40 -40 20
(1) (2) (3)
-50 -60 0 2 4 6 8 Po (W) VP = 12.5 V; Vripple(p-p) = 2 V. (1) Both supply lines in phase. (2) One supply line (VSS) rippled. (3) One supply line (VDD) rippled. (4) Both supply lines in antiphase. 10 10 102
(4)
0
103
104
f i (Hz)
105
2 x 8 SE; VP = 12.5 V; fi = 1 kHz.
Fig.11 Efficiency as function of output power.
Fig.12 SVRR as function of frequency.
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
TDA8928J
handbook, halfpage
100
MGX387
S/N (dB) 80
handbook, halfpage
cs (dB)
0
MGX388
-20
60
-40
40
-60
(1) (2)
20
-80
0 10-2
10-1
1
10
Po (W)
102
-100
10
102
103
104
f i (Hz)
105
2 x 8 SE; VP = 12.5 V. (1) Po = 1 W. (2) Po = 10 W. 2 x 8 SE; VP = 12.5 V.
Fig.13 S/N as function of output power.
Fig.14 Channel separation as function of frequency.
handbook, halfpage
35 G (dB) 30
MDB624
handbook, halfpage
24
MGX389
Po (W)
20
25
16
(1)
20
12
(2)
15
8
10
10
102
103
104
fi (Hz)
105
4 10
12
14
16
18 VP (V)
20
2 x 8 SE; VP = 12.5 V; Vi = 100 mV.
THD + N = 10 %; fi = 1 kHz. (1) 2 x 8 SE. (2) 2 x 16 SE.
Fig.15 Gain as function of frequency.
Fig.16 Output power as function of supply voltage.
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
16 PACKAGE OUTLINE
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)
TDA8928J
SOT243-3
non-concave x Dh
D Eh
view B: mounting base side
d
A2
B j E A
L3 L Q 1 Z e e1 wM 17 m e2 c vM
bp
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-3 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 8.4 7.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.6 w 0.25 x 0.03 Z (1) 2.00 1.45
1.27 5.08
ISSUE DATE 99-12-17 03-03-12
2004 May 05
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
TDA8928J
RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm)
SOT577-2
non-concave D x Dh
Eh
view B: mounting base side
d
A2
B j E
A L e2 c Q
1 Z e e1
17 wM
bp
vM
L1
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 13.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D(1) 24.0 23.6 d 20.0 19.6 Dh 10 E(1) 12.2 11.8 e 2.54 e1 1.27 e2 2.54 Eh 6 j 3.4 3.1 L 3.75 3.15 L1 3.75 3.15 Q 2.1 1.8 v 0.6 w 0.4 x 0.03 Z (1) 2.00 1.45
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT577-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 01-01-05 03-03-12
2004 May 05
20
Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
17 SOLDERING 17.1 Introduction to soldering through-hole mount packages
TDA8928J
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 17.3 Manual soldering
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 17.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. 17.4
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING WAVE suitable suitable(1) not suitable - suitable -
CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP(2) Notes
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable.
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Philips Semiconductors
Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
18 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
TDA8928J
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 20 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R30/02/pp23
Date of release: 2004
May 05
Document order number:
9397 750 13041

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