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| PF0146 MOS FET Power Amplifier Module for GSM Handy Phone ADE-208-285C (Z) 4th. Edition July 1996 Application For GSM class4 890 to 915 MHz Features * Small package: 1 cc, 3g * High efficiency: 50% Typ * High speed switching: 0.9 sec Pin Arrangement * RF-E 4 1: Pin 2: VAPC 3: VDD 4: Pout 5: GND 5 5 1 3 25 PF0146 Internal Diagram and External Condition at Classification G G G G : GND PIN1 pin PIN2 VAPC C2 PIN3 VDD C1 + PIN4 Pout Z1 FB1 FB2 Z2 Pin VAPC VDD Pout C1 = 0.01 F (Ceramic chip) C2 = 220 F (Aluminum electrolyte) FB = Ferrite bead BLO1RN1-A62-001 (Manufacture: MURATA) or equivalent Z1 = Z2 = 50 (Microstrip line) Absolute Maximum Ratings (Tc = 25C) Item Supply voltage Supply current APC voltage Input power Operating case temperature Storage temperature Output power Symbol VDD IDD VAPC Pin Tc (op) Tstg Pout Rating 10 3 6 20 Unit V A V mW C C W -30 to +100 -30 to +100 7 PF0146 Electrical Characteristics (Tc = 25C) Item Frequency range Control voltage range Drain cutoff current Total efficiency 2nd harmonic distortion 3rd harmonic distortion Input VSWR Output power (1) Symbol f VAPC IDS T 2nd H.D. 3rd H.D. Min 890 0.5 Typ Max 915 4.0 100 Unit MHz V A % dBc dBc Test Condition -- -- -- 50 -- -- VDD = 10 V, VAPC = 0 V Pin = 2mW, VDD = 6 V, Pout = 3.2 W (at APC controlled), RL = Rg = 50 , Tc = 25C -- 45 -- -35 -45 3 -- -- -50 -60 2 4.2 VSWR (in) -- Pout (1) 3.6 -- W Pin = 2 mW, VDD = 6 V, VAPC = 4 V, RL = Rg = 50 , Tc = 25C Pin = 2 mW, VDD = 5.4 V, VAPC = 4 V, RL = Rg = 50 , Tc = 80C Pin = 2 mW, VDD = 6 V, VAPC = 0.5 V, RL = Rg = 50 , Tc = 25C Pin = 2 mW, VDD = 6 V, Pout = 3.2 W, RL = Rg = 50 , Tc = 25C Pin = 2 mW, VDD = 7.5 V, Pout 3.2 W (at APC controlled), Rg = 50 , Tc = 25C, Output VSWR = 10:1 All phases -- Output power (2) Pout (2) 2.4 3.0 -- W Isolation -- -- -45 -40 dBm Switching time tr, tf -- 0.9 2 s Stability -- No parasitic oscillation -- Test System Diagram S.G Power Meter L.P.F 3dB ATT VAPC VDD Spectrum Analyzer Test Fixture Directional Coupler Directional Coupler RF SW. Power Meter Phase Shifter Short PF0146 Switching Time Test Diagram VDD=6.0 V S.G Pin P.G f=217Hz D.U.T Pout 1SS106 Z=50 2p 2p 1SS106 2.2 k Power Meter 50% VAPC 95% 5% tr tf Duty=1/8 50% VAPC 100p Oscillo Scope Vout Vout Test Fixture Pattern Unit: mm 2.5 5 3.3 2.5 5 2.88 32.97 5 6.5 2 2.88 35.97 2.88 5 1.5 5 1 100 Grass Epoxy Double sided PCB (t = 1.6 mm, r = 4.8) 62 2.5 1 2.5 PF0146 Note for Use * Apply control voltage range as VAPC = 0.5 to 4.0 V, and GSM burst mode must be applied to all operation. For instance, pulse width = 0.577 msec., duty = 12.5% and VAPC 0.5 V, for all 4.616 msec. Frame except for 0.577 msec. pulse. * Unevenness and distortion at the surface of PCB mounted module should be as small as possible. * To protect devices from electro-static damage, soldering iron, measuring equipment and human body, etc. should be grounded. * To avoid the degradation of efficiency and output power, lead pins should not be floated from copper foil of PCB, and connected to right position of RF signal line (refer to figure 1) * Recommendation to improve the thermal resistance is shown below. -- Make through holes as many as possible under module. -- Use heat sink on the top case of module. * When the external components(Isolator, Duplexer, etc) of the module are changed, the electrical characteristics of total system should be evaluated enough. * To avoid destruction of module caused by excess power consumption, voltage of APC should be limited less than 6 V. * To get good stability, all GND pins should be soldered to ground pattern of PCB. * Don' t apply Full Heating Methods except Infrared Heating Methods. * In case of Partial Heating Methods, soldering temperature and time should be less than 230C, 10 sec, per each GND pin. * Soldering temperature and time for I.R. Reflow should be the reflow profile shown in figure 2. * Recommended conditions for Rising Methods shows as follows. Solvents: de-ionized water, isopropyl alcohol, ethyl alcohol Rising condition: in case of soak rising 5 min max, in case of ultrasonic rising 5min max * Don' t apply dipping solder method to mount. * Apply the way of washing after actual confirmation. * Recommended pattern of footprint is shown in figure 3. RF signal line Worse module Better module PCB All of lead pins should be connected just on the RF signal line. Figure 1 PF0146 (C) 230 Package Surface Temperature 1 to 4[C/s] Natural-cooling 160 140 60 to 90s 1[C/s] 4[C/s] Room temp. -4[C/s] 30s Max Pre-heating Soldering 230C Max -1[C/s] Package surface temperature (an example) Figure 2 3.7 (0.146) 0.25 0.5 (0.020) 4-1.5 (0.060) 0.25 0. 0.5 0.5 1.5 Unit:[mm] Unit [mm] (inch) 1.5 0.5 5.1 3.8 3.8 5.1 0.7 (0.028) (0.20) (0.15)(0.15)(0.20) 0.5 Unit:[mm] Figure 3 0.25 1. 0 85 1.0 QQ ,, 3.1 (0.122) 4.0 (0.158) 3.7 3.7 (0.146) (0.146) 1.0 0.25 2.1 (0.827) 2.9 (0.114) 19.8 (0.780) 2.9 (0.114) PF0146 Characteristics Curve VAPC, T, VSWR (in) vs. Frequency 3 5 Pin = 2 mW VDD = 6 V Pout = 3.2 W Rg=Rl=50 Tc=25 C T 60 4 Apc Voltage VAPC (V) 2.5 V.S.W.R. (in) 54 Efficiency T (%) 3 48 2 2 VAPC 42 1.5 1 VSWRin 36 1 0 865 890 915 30 940 Frequency f (MHz) 2nd H.D, 3rd H.D vs. Frequency -30 Pin = 2 mW VDD = 6 V Pout = 3.2 W Rg=Rl=50 Tc=25 C 2nd H.D -30 -40 -40 2nd H.D (dBc) -50 -50 -60 3rd H.D -60 -70 -70 -80 865 890 915 Frequency f (MHz) -80 940 3rd H.D (dBc) PF0146 Pout, T vs. VAPC (1) 5 f = 890 MHz Pin = 2 mW VDD = 6 V Rg=Rl=50 Tc=25 C Pout 60 4 Output Power Pout (W) 50 Efficiency T (%) Efficiency T (%) T 40 3 2 30 1 20 0 0 1 2 Apc Voltage VAPC (V) 3 4 10 Pout, T vs. VAPC (2) 5 f = 915 MHz Pin = 2 mW VDD = 6 V Rg=Rl=50 Tc=25 C T 50 60 4 Output Power Pout (W) 3 Pout 40 2 30 1 20 0 0 1 2 Apc Voltage VAPC (V) 3 4 10 PF0146 2nd H.D, 3rd H.D, VSWR (in) vs. VAPC (1) 3 -30 f = 890 MHz Pin = 2 mW VDD = 6 V Rg = Rl = 50 Tc = 25 C -30 -40 2.5 2nd H.D (dBc) V.S.W.R. (in) -50 -40 2nd H.D -50 3rd H.D 3rd H.D (dBc) 3rd H.D (dBc) 2 -60 -60 1.5 -70 VSWRin -70 1 -80 0 1 2 Apc Voltage VAPC (V) 3 4 -80 2nd H.D, 3rd H.D, VSWR (in) vs. VAPC (2) 3 -30 f = 915 MHz Pin = 2 mW VDD = 6 V Rg = Rl = 50 Tc = 25 C 2nd H.D -50 3rd H.D -60 -60 -50 -30 -40 2.5 2nd H.D (dBc) V.S.W.R. (in) -40 2 1.5 -70 VSWRin 1 -80 0 1 2 Apc Voltage VAPC (V) 3 4 -80 -70 PF0146 T, VSWR (in), VAPC vs. Pin (1) 4 60 f = 890 MHz VDD = 6 V Pout = 3.2 W Rg = Rl = 50 Tc = 25 C Efficiency T (%) 50 VAPC 2 VSWRin 40 1.5 3 Apc Voltage VAPC (V) 3 T 2.5 V.S.W.R. (in) V.S.W.R. (in) 2 1 0 30 0 1 2 3 Input Power Pin (mW) 1 T, VSWR (in), VAPC vs. Pin (2) 4 60 f = 915 MHz VDD = 6 V Pout = 3.2 W Rg = Rl = 50 Tc = 25 C Efficiency T (%) 50 3 T 2.5 Apc Voltage VAPC (V) 3 2 VAPC 2 40 1.5 VSWRin 1 0 30 0 1 2 3 Input Power Pin (mW) 1 PF0146 Pout, T vs. Pin (1) 5.0 60 Pout Output Power Pout (W) 4.5 Efficiency T (%) Efficiency T (%) 50 4.0 f = 890 MHz VDD = 6 V VAPC = 4 V Rg = Rl = 50 Tc = 25 C 3.5 T 40 3.0 0 1 2 3 Input Power Pin (mW) 30 Pout, T vs. Pin (2) 5.0 f = 915 MHz VDD = 6 V VAPC = 4 V Rg = Rl = 50 4.5 Tc = 25 C 50 Pout 4.0 60 Output Power Pout (W) 40 3.5 T 3.0 0 1 2 3 Input Power Pin (mW) 30 PF0146 T vs. VDD 60 Pin = 2 mW, Pout = 3.2 W, Tc = 25C, Rg = Rl = 50 55 Efficiency T (%) 50 f=915 MHz 45 40 35 f=890 MHz 30 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 Supply Voltage VDD (V) PF0146 Package Dimensions Unit: mm 25 0.5 (1.5) 22 0.5 (1.5) (5 - 3.0) 5 1 2 3 (0.3) (5.1) (7.6) (5.1) 4 5 (1.5) (5.8) (8.8) 3.7 0.5 5 5 2.35 0.5 12 0.5 (0.25) (1.8) (2.4) 0.5 (0.3) +0.3 -0.2 Hitachi code EIAJ code JEDEC code RF-E -- -- |
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