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| DISCRETE SEMICONDUCTORS DATA SHEET ook, halfpage M3D168 BZG142 SMA ZenBlockTM; zener with integrated blocking diode Product specification Supersedes data of 2001 Apr 17 2001 Aug 20 Philips Semiconductors Product specification SMA ZenBlockTM; zener with integrated blocking diode FEATURES * Zener and 600 V/250 ns blocking diode in one package * Protects the MOSFET in power IC controllers such as STARPlugTM(1), TOPSwitchTM(2) and VIPerTM(3) * High surge capability * Supports valley switching * Glass passivated junctions * Excellent clamping capability and stability * Supplied in 12 mm embossed tape. DESCRIPTION The SMA ZenBlockTM is designed to protect the MOSFET in flyback converters against over-voltages caused by the transformer leakage inductance. The SMA ZenBlockTM combines a zener/TVS with a fast soft-recovery diode in one package, and can be used to replace double diode, RC or RCD snubbers. The BZG142 consists of a glass passivated chip in a DO-214AC surface mount package. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads. Top view BZG142 Side view MGU215 Fig.1 Simplified outline (DO-214AC) and symbol. handbook, halfpage Vo ZENBLOCK CONTROL MLD682 (1) STARPlug is a trademark of Philips. (2) TOPSwitch is a trademark of Power Integrations. (3) VIPer is a trademark of STMicroelectronics. Fig.2 Typical application. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Tstg Tj Zener Ptot PZSM total power dissipation non-repetitive peak reverse power dissipation non-repetitive peak reverse power dissipation Ttp = 105 C; see Fig.3 tp = 100 s; square pulse; Tj = 25 C prior to surge; see Figs 5 and 6 10/1000 s exponential pulse; Tj = 25 C prior to surge; see Fig.4 - - 2.8 400 W W PARAMETER storage temperature junction temperature CONDITIONS MIN. -65 -65 MAX. +175 +175 UNIT C C PRSM - 150 W Blocking diode VR ERSM continuous reverse voltage non-repetitive peak reverse avalanche energy L = 120 mH; Tj = Tj(max) prior to surge; inductive load switched off 2 - - 600 7.5 V mJ 2001 Aug 20 Philips Semiconductors Product specification SMA ZenBlockTM; zener with integrated blocking diode ELECTRICAL CHARACTERISTICS ZENER/TVS Tj = 25 C unless otherwise specified. WORKING VOLTAGE TYPE NUMBER SUFFIX(1) TEMPERATURE COEFFICIENT SZ (%/K) at Itest MIN. 0.07 0.07 0.07 0.07 0.07 0.07 0.07 0.07 MAX. 0.12 0.12 0.12 0.12 0.12 0.12 0.12 0.12 10 5 5 5 5 5 5 5 TEST CURRENT CLAMPING VOLTAGE V(CL)R (V) MAX. 97 130 143 171 214 228 258 288 1.54 1.15 1.05 0.88 0.70 0.66 0.58 0.52 BZG142 REVERSE CURRENT at STAND-OFF VOLTAGE IR (A) Tj = 150 C MAX. 100 100 100 100 100 100 100 100 56 75 82 100 120 130 150 160 at VR (V) VZ (V) at Itest (see Fig.7) MIN. NOM. 68 91 100 120 150 160 180 200 MAX. 75 100 110 132 165 176 198 220 Itest (mA) at IRSM (A)(2) 68 91 100 120 150 160 180 200 Notes 61 82 90 108 135 144 162 180 1. To complete the type number the suffix is added to the basic type number, e.g. BZG142-68. 2. Non-repetitive peak reverse current in accordance with "IEC 60060-1, Section 8" (10/1000 s pulse); see Fig.4. ELECTRICAL CHARACTERISTICS BLOCKING DIODE Tj = 25 C unless otherwise specified. SYMBOL V(BR)R CZB IR PARAMETER ZenBlock capacitance reverse current CONDITIONS f = 1 MHz; VR = 0; see Fig.8 VR = 600 V VR = 600 V; Tj = 150 C THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 note 2 Notes 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer 35 m, see Fig.9. 2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.9. For more information please refer to the "General Part of associated Handbook". CONDITIONS VALUE 25 100 150 UNIT K/W K/W K/W MIN. 700 - - - TYP. - 15 - - MAX. - - 5 100 UNIT V pF A A reverse avalanche breakdown voltage IR = 0.1 mA 2001 Aug 20 3 Philips Semiconductors Product specification SMA ZenBlockTM; zener with integrated blocking diode GRAPHICAL DATA BZG142 handbook, halfpage 4 MBH451 IRSM handbook, halfpage (%) 100 90 Ptot (W) 3 2 50 1 10 t 0 0 100 T (C) 200 t1 t2 MGD521 Solid line: tie-point temperature. Dotted line: ambient temperature; device mounted on an Al2O3 printed-circuit board as shown in Fig.9. In accordance with "IEC 60060-1, Section 8". t1 = 10 s. t2 = 1000 s. Fig.3 Maximum total power dissipation as a function of temperature. Fig.4 Non-repetitive peak reverse current pulse definition. 105 handbook, halfpage PZSM (W) 104 MLD681 handbook, halfpage derating 120 MGU425 percentage (%) 100 80 103 60 40 102 20 10 10-1 1 10 102 103 104 tp (s) 0 0 40 80 120 200 160 Tamb (C) Tj = 25 C prior to surge. See Fig.6. Fig.5 Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). Fig.6 Peak pulse power (PZSM, PRSM) or current (IRSM) derating curve. 2001 Aug 20 4 Philips Semiconductors Product specification SMA ZenBlockTM; zener with integrated blocking diode BZG142 handbook, halfpage 1500 IZ MLD679 handbook, halfpage 16 MLD680 CZB (pF) 12 (1) (mA) 1000 (2) 8 (3) 500 (1) (2) (3) 4 0 50 100 150 200 250 VZ (V) Measured under pulsed conditions. Solid line: Tamb = 25 C. Dotted line: Tamb = 150 C. (1) VZ = 68 V. (2) VZ = 120 V. (3) VZ = 200 V. 300 0 -200 0 200 400 VR (V) 600 (1) VZ = 68 V. (2) VZ = 120 V. (3) VZ = 200 V. Fig.7 Working current as a function of working voltage; typical values. Fig.8 ZenBlock capacitance as function of reverse voltage; typical values. 50 4.5 50 2.5 1.25 MSB213 Dimensions in mm. Fig.9 Printed-circuit board for surface mounting. 2001 Aug 20 5 Philips Semiconductors Product specification SMA ZenBlockTM; zener with integrated blocking diode PACKAGE OUTLINE Transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors BZG142 SOD124 H D A A1 c Q E b (1) 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 2.3 2.0 A1 0.05 b 1.6 1.4 c 0.2 D 4.5 4.3 E 2.8 2.4 H 5.5 5.1 Q 3.3 2.7 Note 1. The marking band indicates the cathode. OUTLINE VERSION SOD124 REFERENCES IEC JEDEC DO-214AC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-10-22 2001 Aug 20 6 Philips Semiconductors Product specification SMA ZenBlockTM; zener with integrated blocking diode DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS BZG142 This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2001 Aug 20 7 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2001 SCA73 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613510/03/pp8 Date of release: 2001 Aug 20 Document order number: 9397 750 08468 |
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