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HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9514 Issued Date : 1997.06.05 Revised Date : 2003.01.10 Page No. : 1/4 HM882 NPN EPITAXIAL PLANAR TRANSISTOR Description The HM882 is suited for the output stage of 0.75W audio, voltage regulator, and relay driver. Absolute Maximum Ratings SOT-89 * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................ 0.6 W (Note1) Total Power Dissipation (Ta=25C) ............................................................................... 2 W (Note2) Total Power Dissipation (Tc=25C)............................................................................ 1.3 W (Note1) Total Power Dissipation (Tc=25C) ............................................................................ 3.4 W (Note2) * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 70 V VCEO Collector to Emitter Voltage ...................................................................................... 30 V VEBO Emitter to Base Voltage .............................................................................................. 5 V IC Collector Current............................................................................................................... 3 A Thermal Characteristic Characteristic Thermal Resistance, junction to ambient Thermal Resistance, junction to ambient (Note2) Thermal Resistance, junction to case (Note1) Thermal Resistance, junction to case (Note2) Note1: When tested in free air condition, without heat sinking. Note2: When mounted on a 40X40X1mm ceramic board. (Note1) Symbol Rja Rja Rjc Rjc Max. 208 62.5 86 36.8 Unit o o C/W C/W o C/W o C/W HM882 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 40 30 5 30 100 Typ. 90 45 Max. 1 1 0.5 2 500 Unit V V V uA uA V V Spec. No. : HE9514 Issued Date : 1997.06.05 Revised Date : 2003.01.10 Page No. : 2/4 Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=30V, IE=0 VEB=3V, IB=0 IC=2A, IB=0.2A IC=2A, IB=0.2A VCE=2V, IC=20mA VCE=2V, IC=1A VCE=5V, IC=0.1A, f=100MHz IE=0,VCB=10V, f=1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF Classification Of hFE2 Rank Range Q 100-200 P 160-320 E 250-500 HM882 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 10 Spec. No. : HE9514 Issued Date : 1997.06.05 Revised Date : 2003.01.10 Page No. : 3/4 Saturation Voltage & Collector Current Saturation Voltage (mV) 1 VBE(sat) @ IC=10IB hFE VCE=2V 0.1 VCE(s at) @ IC=10IB 100 0.01 0.1 1 10 100 1000 10000 0.01 0.1 1 10 100 1000 10000 Collector Current (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 100 1000 Cutoff Frequency & Collector Current Cob Cutoff Frequency (MHz) Capacitance (pF) VCE=5V 10 0.1 1 10 100 100 1 10 100 1000 Reverse-Biased Voltage (V) Collector Current (mA) Safe Operating Area 10000 PT=1ms Collector Current-IC (mA) 1000 PT=100ms PT=1s 100 10 1 10 100 Forward Voltage-VCE (V) HM882 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-89 Dimension Marking: Spec. No. : HE9514 Issued Date : 1997.06.05 Revised Date : 2003.01.10 Page No. : 4/4 C H Date Code 882 Laser Marking HM B 1 E F G A 2 3 D Style: Pin 1.Base 2.Collector 3.Emitter I 3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M *: Typical DIM A B C D E Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201 Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41 Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HM882 HSMC Product Specification |
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