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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : MOS200611 Issued Date : 2006.06.01 Revised Date : 2006.06.28 Page No. : 1/4 H08N02CTS Dual N-Channel Enhancement-Mode MOSFET (20V, 8A) 8 7 6 5 8-Lead Plastic TSSOP-8 Package Code: TS H08N02CTS Symbol & Pin Assignment Features * RDS(on)<30m@VGS=2.5V, ID=5.5A * RDS(on)<20m@VGS=4.5V, ID=6.5A * High Density Cell Design for Ultra Low On-Resistance * High Power and Current Handing Capability * Fully Characterized Avalanche Voltage and Current * Ideal for Li ion Battery Pack Applications Q2 Q1 1 2 3 4 Pin 1: Drain Pin 2 / 3: Source 1 Pin 4: Gate 1 Pin 5: Gate 2 Pin 6 / 7: Source 2 Pin 8: Drain Absolute Maximum Ratings (T =25 C, unless otherwise noted) o A Symbol VDS VGS ID IDM PD Tj, Tstg RJA Drain-Source Voltage Gate-Source Voltage Drain Current (Continuous) Drain Current (Pulsed) *1 Parameter Ratings 20 12 8 30 Units V V A A W W C C/W Total Power Dissipation @TA=25 C Total Power Dissipation @TA=75 C Operating and Storage Temperature Range Thermal Resistance Junction to Ambient (PCB mounted) *2 o o 1.5 0.96 -55 to +150 83 *1: Maximum DC current limited by the package under the ambient condition at room temperature. *2: 1-in2 2oz Cu PCB board H08N02CTS HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Electrical Characteristics (TA=25C, unless otherwise noted) Symbol * Static BVDSS RDS(on) VGS(th) IDSS IGSS gFS * Dynamic Qg Qgs Qgd Ciss Coss Crss td(on) tr td(off) tf Total Gate Charge Gate-Source Charge Gate-Drain Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time VDD=10V, ID=1A, VGS=4.5V RGEN=6 VDS=10V, VGS=0V, f=1MHz VDS=10V, ID=6A, VGS=4.5V Drain-Source Breakdown Voltage Drain-Source On-State Resistance Gate Threshold Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Current Forward Transconductance VGS=0V, ID=250uA VGS=2.5V, ID=5.5A VGS=4.5V, ID=6.5A VDS=VGS, ID=250uA VDS=16V, VGS=0V VGS=4.5V, VDS=0V VDS=10V, ID=6.5A 20 0.6 Characteristic Test Conditions Min. Spec. No. : MOS200611 Issued Date : 2006.06.01 Revised Date : 2006.06.28 Page No. : 2/4 Typ. Max. Unit 30 30 20 1.6 1 200 - V m V uA nA S 9 2.4 3.6 476 65.1 49 50 100 500 200 ns pF nC * Drain-Source Diode Characteristics IS VSD Maximum Diode Forward Current Drain-Source Diode Forward Voltage VGS=0V, IS=1.5A 0.61 1.7 1.2 A V Note: Pulse Test: Pulse Width 300us, Duty Cycle2% Switching Test Circuit VDD td(on) ton tr Switching Waveforms td(off) toff tf 90% 90% RD VIN VGEN RG G S Input, VIN 10% Pulse Width 50% 50% 90% D VOUT Output, VOUT 10% 10% Inverted H08N02CTS HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TSSOP-8 Dimension D Spec. No. : MOS200611 Issued Date : 2006.06.01 Revised Date : 2006.06.28 Page No. : 3/4 H08N02CTS Marking: Pb-Free: " . " (Note) Normal: None Pb Free Mark Control Code Data Code Pin 1 Index 8 7 6 5 E1 Pin1 index 2 3 4 E Pin Style: 1.D 2.S1 3.S1 4.G1 5.G2 6.S2 7.S2 8.D Note: Green label is used for pb-free packing Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A A1 b C D E E1 e L S Min. Max. 1.20 0.05 0.15 0.19 0.3 0.09 0.20 2.90 3.10 6.20 6.60 4.30 4.50 0.65 BSC 0.45 0.75 0o 8o *: Typical, Unit: mm Detail F A1 b R 0.15 C Seating Plane A e S L 0.25 Detail F 8-Lead TSSOP-8 Plastic Surface Mounted Package HSMC Package Code: TS Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 H08N02CTS H 0 8N0 2 C HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Soldering Methods for HSMC's Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP TP Ramp-up TL Tsmax Temperature tL Spec. No. : MOS200611 Issued Date : 2006.06.01 Revised Date : 2006.06.28 Page No. : 4/4 Critical Zone TL to TP Tsmin tS Preheat Ramp-down 25 t 25oC to Peak Time Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices. Sn-Pb Eutectic Assembly <3oC/sec Pb-Free Assembly <3oC/sec 100oC 150oC 60~120 sec 150oC 200oC 60~180 sec <3oC/sec <3oC/sec 183oC 60~150 sec 240 C +0/-5 C 10~30 sec <6oC/sec <6 minutes o o 217oC 60~150 sec 260oC +0/-5oC 20~40 sec <6oC/sec <8 minutes Peak temperature 245oC 5oC 260 C 5 C o o Dipping time 10sec 1sec 10sec 1sec H08N02CTS HSMC Product Specification |
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