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| PRELIMINARY MAY 2006 XRK32309 REV. P1.0.1 LOW-COST 3.3V ZERO DELAY BUFFER GENERAL DESCRIPTION FUNCTIONAL DESCRIPTION Offered in both 16 pin SOIC and TSSOP packages, XRK32309 is a low cost 3.3V zero delay buffer. It is designed to distribute high speed clocks by taking one reference input and driving nine output clocks. The feedback of its on-chip PLL is internally connected to the FB output. XRK32309 devices operate over 10-100 MHz frequency range with 30 pF loads and up to 120MHz with lower loads (10 pF). The -1H version has higher drive strength than the base -1 version, featuring faster rise and fall time. The XRK32309 has two banks each with four outputs. These outputs are controlled by two select input lines according to the Table 2, "Select Input Decoding," on page 3. In cases where not all outputs are needed, bank B can be tri-stated. The select lines also enable putting the device in a bypass mode where the input is directly applied to the outputs. This feature is useful for chip and testing purposes. Some applications may require distributing the clock to several destinations. In such situations, multiple XRK32309 devices can be connected to accept the same input clock and generate several clock signals. FIGURE 1. BLOCK DIAGRAM OF THE XRK32309 In this case, the skew between the outputs of two devices is guaranteed to be less than 700 ps. The available versions of XRK32309 are shown in Table 12, "Ordering Information," on page 10. The XRK32309-1 is the base part. FEATURES * 10-MHz to 120-MHz operating range, compatible with CPU and PCI bus frequencies * Zero input-output propagation delay * Multiple low-skew outputs Output-output skew less than 250 ps Device-device skew less than 700 ps One input drives nine outputs, grouped as 4 + 4+1 * Less than 200 ps cycle-cycle jitter, compatible with Pentium(R)-based systems * Test Mode to bypass phase-locked loop (PLL) (see "Select Input Decoding" on page 2) * Available in space-saving 16-pin 150-mil SOIC or 4.4-mm TSSOP packages * 3.3V operation * Industrial and commercial temperature available PLL REF FB MUX QA0 QA1 QA2 QA3 S2 S1 Select Input Decoding QB0 QB1 QB2 QB3 Exar Corporation 48720 Kato Road, Fremont CA, 94538 * (510) 668-7000 * FAX (510) 668-7017 * www.exar.com XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER FIGURE 2. PIN OUT OF THE XRK32309 PRELIMINARY REV. P1.0.1 16 SOIC/TSSOP REF QA0 QA1 VDD GND QB0 QB1 S2 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 FB QA3 QA2 VDD GND QB3 QB2 S1 TABLE 1: PIN DESCRIPTION FOR XRK32309 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 REF[1] QA0[2] QA1[2] VDD GND QB0[2] QB1[2] S2[3] S1[3] QB2[2] QB3[2] GND VDD QA2[2] QA3[2] FB[2] SIGNAL Input reference frequency. Buffered clock output, Bank A Buffered clock output, Bank A 3.3V supply Ground Buffered clock output, Bank B Buffered clock output, Bank B Select input, bit 2 Select input, bit 1 Buffered clock output, Bank B Buffered clock output, Bank B Ground 3.3V supply Buffered clock output, Bank A Buffered clock output, Bank A Buffered output, internal feedback on this pin DESCRIPTION 2 PRELIMINARY REV. P1.0.1 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER TABLE 2: SELECT INPUT DECODING S2 0 0 1 1 NOTES: 1. 2. 3. 4. S1 0 1 0 1 QA0-QA3 Tri-Stated Driven Driven Driven QB0-QB3 Tri-Stated Tri-Stated Driven Driven FB[4] Driven Driven Driven Driven OUTPUT SOURCE PLL PLL Reference PLL Weak pull-down. Weak pull-down on all outputs. Weak pull-ups on these inputs. This output has an internal feedback for the PLL. The load on this output can be adjusted to change the skew between the reference and output. FIGURE 3. REF. INPUT TO QAX/QBX DELAY VS. LOADING DIFFERENCE BETWEEN FB AND QAX/QBX PINS 1500 1000 REF Input to QAx/QBx Delay (ps) 500 0 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 -500 -1000 -1500 Output Load Difference: FB Load - QAx/QBx Load (pF) Note: Target only, actual characterization curve may be slightly different. ZERO DELAY AND SKEW CONTROL In order to achieve Zero Delay between the input reference and the output, all outputs, including FB, must be equally loaded even when the FB output is not being used. Being internally connected as the PLL feedback, the FB output's capacitive loading relative to the other outputs can adjust the input to output delay according to the characteristic shown in Figure 3. This figure provides a tool for mapping the required delay to the capacitive load difference required between the FB and the Clock output of interest. For zero output to output skew, the outputs have to be loaded equally as well. 3 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER PRELIMINARY REV. P1.0.1 TABLE 3: ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage to Ground Potential DC Input Voltage (Except REF) DC Input Voltage REF Storage Temperature Junction Temperature Static Discharge Voltage (per MIL-STD-883, Method 3015) RANGE -0.5V to +7.0V -0.5V to VDD +0.5V -0.5 to 7V -65C to +150C 150C >2000V TABLE 4: OPERATING CONDITIONS FOR XRK32309SC-XX COMMERCIAL TEMPERATURE DEVICES PARAMETER VDD TA CL Load Capacitance, from 100MHz to 120MHz CIN tPU Input Capacitance Power-up time for all VDD's to reach minimum specified voltage (power ramps must be monotonic) 0.05 10 7 50 pF pF ms Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance, below 100MHz DESCRIPTION MIN 3.0 0 MAX 3.6 70 30 UNIT V C pF TABLE 5: ELECTRICAL CHARACTERISTICS FOR XRK32309SC-XX COMMERCIAL TEMPERATURE DEVICES PARAMETER VIL VIH IIL IIH VOL DESCRIPTION Input Low Voltage[5] Input High Voltage[5] Input Low Current Input High Current Output Low Voltage[6] VIN=0V VIN=VDD IOL= 8mA (-1) IOL= 12mA (-1H) VOH Output High Voltage[6] IOH= -8mA (-1) IOH= -12mA (-1H) IDD Supply Current Unloaded outputs at 66.67MHz, SEL inputs at VDD 32.0 mA 2.4 V TEST CONDITIONS MIN 2.0 MAX 0.8 50.0 100.0 0.4 UNIT V V A A V 4 PRELIMINARY REV. P1.0.1 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER TABLE 6: SWITCHING CHARACTERISTICS FOR XRK32309SC-1 COMMERCIAL TEMPERATURE DEVICES[7] PARAMETER t1 DC t3 t4 t5 t6A NAME Output Frequency 30-pF load 10-pF load Measured at 1.4V, FOUT=66.67MHz Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded TEST CONDITIONS MIN 10 10 40.0 TYP MAX 100 120 60.0 2.50 2.50 250 350 UNIT MHz MHz % ns ns ps ps Duty Cycle[6] = t2 / t1 Rise Time[6] Fall Time[6] Output to Output Skew[6] 50.0 0 Delay, REF Rising Edge to Measured at VDD/2 FB Rising Edge[6] Delay, REF Rising Edge to Measured at VDD/2. Measured in PLL Bypass Mode FB Rising Edge[6] Device to Device Skew[6] Cycle to Cycle Jitter[6] PLL Lock Time[6] Measured at VDD/2 on the FB pins of devices Measured at 66.67MHz, loaded outputs Stable power suppy, valid clock presented on REF pin t6B 1 5 8.7 ns t7 tJ tLOCK - 0 700 ps - - 200 1.0 ps ms NOTES: 5. 6. 7. REF input has a threshold voltage of V DD/2. Parameter is guaranteed by design and characterization. Not 100% tested in production. All parameters specified with loaded outputs. 5 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER PRELIMINARY REV. P1.0.1 TABLE 7: SWITCHING CHARACTERISTICS FOR XRK32309SC-1H COMMERCIAL TEMPERATURE DEVICES[7] PARAMETER t1 NAME Output Frequency 30-pF load 10-pF load Measured at 1.4V, FOUT=66.67MHz Measured at 1.4V, FOUT<50.0MHz Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded TEST CONDITIONS MIN 10 10 40.0 45.0 TYP MAX 100 120 60.0 55.0 1.50 1.50 250 350 UNIT MHz MHz % % ns ns ps ps 50.0 50.0 0 DC t3 t4 t5 t6A Duty Cycle[6] = t2 / t1 Rise Time[6] Fall Time[6] Output to Output Skew[6] FB Rising Edge[6] Delay, REF Rising Edge to Measured at VDD/2 t6B Delay, REF Rising Edge to Measured at VDD/2. Measured in PLL Bypass Mode FB Rising Edge[6] Device to Device Skew[6] Output Slew Rate[6] Cycle to Cycle Jitter[6] PLL Lock Time[6] Measured at VDD/2 on the FB pins of devices Measured between 0.8V and 2.0V using Test Circuit #2 Measured at 66.67MHz, loaded outputs Stable power suppy, valid clock presented on REF pin 1 5 8.7 ns t7 t8 tJ tLOCK - 0 700 ps 1 - - 200 1.0 V/ns ps ms 6 PRELIMINARY REV. P1.0.1 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER TABLE 8: OPERATING CONDITIONS FOR XRK32309SI-XX INDUSTRIAL TEMPERATURE DEVICES PARAMETER VDD TA CL Supply Voltage DESCRIPTION MIN 3.0 -40 0.05 MAX 3.6 85 30 10 7 50 UNIT V C pF pF pF ms Operating Temperature (Ambient Temperature) Load Capacitance, below 100MHz Load Capacitance, from 100MHz to 120MHz CIN tPU Input Capacitance Power-up time for all VDD's to reach minimum specified voltage (power ramps must be monotonic) TABLE 9: ELECTRICAL CHARACTERISTICS FOR XRK32309SI-XX INDUSTRIAL TEMPERATURE DEVICES PARAMETER VIL VIH IIL IIH VOL DESCRIPTION Input Low Voltage[5] Input High Voltage[5] Input Low Current Input High Current Output Low Voltage[6] VIN=0V VIN=VDD IOL= 8mA (-1) IOL= 12mA (-1H) VOH Output High Voltage[6] IOH= -8mA (-1) IOH= -12mA (-1H) IDD Supply Current Unloaded outputs at 66.67MHz REF, SEL inputs at VDD 35.0 mA 2.4 V TEST CONDITIONS MIN 2.0 MAX 0.8 50.0 100.0 0.4 UNIT V V A A V 7 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER PRELIMINARY REV. P1.0.1 TABLE 10: SWITCHING CHARACTERISTICS FOR XRK32309SI-1 INDUSTRIAL TEMPERATURE DEVICES[7] PARAMETER t1 DC t3 t4 t5 t6A NAME Output Frequency 30-pF load 10-pF load Measured at 1.4V, FOUT=66.67MHz Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded TEST CONDITIONS MIN 10 10 40.0 TYP MAX 100 120 60.0 2.50 2.50 250 350 UNIT MHz MHz % ns ns ps ps Duty Cycle[6] = t2 / t1 Rise Time[6] Fall Time[6] Output to Output Skew[6] 50.0 0 Delay, REF Rising Edge to Measured at VDD/2 FB Rising Edge[6] Delay, REF Rising Edge to Measured at VDD/2. Measured in PLL Bypass Mode FB Rising Edge[6] Device to Device Skew[6] Cycle to Cycle Jitter[6] PLL Lock Time[6] Measured at VDD/2 on the FB pins of devices Measured at 66.67MHz, loaded outputs Stable power suppy, valid clock presented on REF pin t6B 1 5 8.7 ns t7 tJ tLOCK - 0 700 ps - - 200 1.0 ps ms TABLE 11: SWITCHING CHARACTERISTICS FOR XRK32309SI-1H INDUSTRIAL TEMPERATURE DEVICES[7] PARAMETER t1 NAME Output Frequency 30-pF load 10-pF load Measured at 1.4V, FOUT=66.67MHz Measured at 1.4V, FOUT<50.0MHz Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded TEST CONDITIONS MIN 10 10 40.0 45.0 TYP MAX 100 120 60.0 55.0 1.50 1.50 250 350 UNIT MHz MHz % % ns ns ps ps 50.0 50.0 0 DC t3 t4 t5 t6A t6B t7 t8 Duty Cycle[6] = t2 / t1 Rise Time[6] Fall Time[6] Output to Output Skew[6] FB Rising Edge[6] Delay, REF Rising Edge to Measured at VDD/2 Delay, REF Rising Edge to Measured at VDD/2. Measured in PLL Bypass Mode FB Rising Edge[6] Device to Device Skew[6] Output Slew Rate[6] Measured at VDD/2 on the FB pins of devices Measured between 0.8V and 2.0V using Test Circuit #2 1 5 8.7 ns - 0 700 ps 1 - - v/ns 8 PRELIMINARY REV. P1.0.1 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER TABLE 11: SWITCHING CHARACTERISTICS FOR XRK32309SI-1H INDUSTRIAL TEMPERATURE DEVICES[7] PARAMETER tJ tLOCK NAME Cycle to Cycle Jitter[6] PLL Lock Time[6] TEST CONDITIONS Measured at 66.67MHz, loaded outputs Stable power suppy, valid clock presented on REF pin MIN TYP MAX 200 1.0 UNIT ps ms FIGURE 4. SWITCHING WAVEFORMS All Outputs Rise/Fall Time Duty Cycle Timing t1 t2 1.4V 1.4V 1.4V OUTPUT 2.0V 0.8V t3 2.0V 0.8V t4 3.3V 0V Output-Output Skew Input-Output Propagation Delay OUTPUT OUTPUT 1.4V 1.4V t5 INPUT OUTPUT VDD/2 VDD/2 t6 Device-Device Skew FB, Device 1 FB, Device 2 VDD/2 VDD/2 t7 FIGURE 5. TEST CIRCUIT Test Circuit #1 VDD 0.1F Outputs QAx/QBx CLOAD VDD 0.1F GND GND 0.1F GND GND VDD 0.1F Test Circuit #2 VDD Outputs 1K 10pF 1K For parameters t 8 (output slew rate) on -1H devices. 9 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER PRELIMINARY REV. P1.0.1 TABLE 12: ORDERING INFORMATION PART ORDERING NUMBER XRK32309CD-1 XRK32309CDTR-1 XRK32309ID-1 XRK32309IDTR-1 XRK32309CD-1H XRK32309CDTR-1H XRK32309ID-1H XRK32309IDTR-1H XRK32309CG-1H XRK32309CGTR-1H XRK32309IG-1H XRK32309IGTR-1H PACKAGE TYPE 16 PIN SOIC 16 PIN SOIC 16 Pin SOIC 16 Pin SOIC 16 Pin SOIC 16 Pin SOIC 16 Pin SOIC 16 Pin SOIC 16 Pin TSSOP 16 Pin TSSOP 16 Pin TSSOP 16 Pin TSSOP OPERATING TEMPERATURE RANGE 0 TO +70 0 TO +70 -40 to +85 -40 to +85 0 TO +70 0 TO +70 -40 to +85 -40 to +85 0 TO +70 0 TO +70 -40 to +85 -40 to +85 10 PRELIMINARY REV. P1.0.1 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER PACKAGE DRAWINGS AND DIMENSIONS FIGURE 6. XRK32309 PACKAGE DRAWING - 16 LEAD SMALL OUTLINE 16 LEAD SMALL OUTLINE (150 MIL JEDEC SOIC) D 16 1 9 E 8 H C A Seating Plane e B A1 L Note: The control dimension is the millimeter column INCHES SYMBOL A A1 B C D E e H L MIN 0.053 0.004 0.013 0.007 0.386 0.150 MAX 0.069 0.010 0.020 0.010 0.394 0.157 MILLIMETERS MIN 1.35 0.10 0.33 0.19 9.80 3.80 MAX 1.75 0.25 0.51 0.25 10.00 4.00 0.050 BSC 0.228 0.016 0 0.244 0.050 8 1.27 BSC 5.80 0.40 0 6.20 1.27 8 11 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER PRELIMINARY REV. P1.0.1 FIGURE 7. XRK32309 PACKAGE DRAWING - 16 LEAD THIN SHRINK SMALL OUTLINE 16 LEAD TSSOP THIN SHRINK SMALL OUTLINE (4.4mm TSSOP) SYMBOL A A1 A2 B C D E E1 e L INCHES MIN MAX 0.031 0.043 0.002 0.006 0.031 0.037 0.007 0.012 0.004 0.008 0.193 0.201 0.248 0.260 0.169 0.177 0.0256 BSC 0.018 0.030 0 8 MILLIMETERS MIN MAX 0.80 1.10 0.05 0.15 0.80 0.95 0.19 0.30 0.09 0.20 4.90 5.10 6.30 6.60 4.30 4.50 0.65 BSC 0.45 0.75 0 8 12 PRELIMINARY REV. P1.0.1 XRK32309 LOW-COST 3.3V ZERO DELAY BUFFER REVISIONS REV. # P1.0.0 P1.0.1 DATE 04/05/06 05/12/06 Initial release. Operating range changed to 10MHz to 120MHz - edit all references of this. DESCRIPTION OF CHANGES NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Copyright 2006 EXAR Corporation Datasheet May 2006. Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. 13 |
Price & Availability of XRK32309ID-1
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